| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/05/2014 | CN103554433A 固化性树脂组合物 The curable resin composition of the |
| 02/05/2014 | CN103552126A Cover plate for drilling |
| 02/05/2014 | CN102621914B Automatic control method for LED surface mounting machine |
| 02/05/2014 | CN102548249B Manufacturing method of circuit boards |
| 02/05/2014 | CN102497737B Method for manufacturing printed circuit board (PCB) with step-shaped grooves |
| 02/05/2014 | CN102487577B Manufacturing method of circuit board with combination of flexible circuit board and hard circuit board |
| 02/05/2014 | CN102480852B Method for manufacturing circuit boards |
| 02/05/2014 | CN102191004B Thermosetting adhesive for flexible basic material and preparation method thereof |
| 02/05/2014 | CN102165589B Production process for surface-mounting ceramic LED package, surface-mounting ceramic LED package produced by said production process, and mold for producing said package |
| 02/04/2014 | US8642899 Terminal structure, electronic device, and manufacturing method thereof |
| 02/04/2014 | US8642898 Circuit board structure with capacitors embedded therein |
| 02/04/2014 | US8642462 Interconnection designs and materials having improved strength and fatigue life |
| 02/04/2014 | US8642123 Integration of ZnO nanowires with nanocrystalline diamond fibers |
| 02/04/2014 | CA2522281C System and method for attenuating the effect of ambient light on an optical sensor |
| 01/31/2014 | CA2821272A1 Electronic circuit board, assembly and a related method thereof |
| 01/30/2014 | WO2014018491A2 Systems, structures and materials for electronic device cooling |
| 01/30/2014 | WO2014017635A1 Ceramic electronic component and method for producing ceramic electronic component |
| 01/30/2014 | WO2014017426A1 Probe unit, circuit board inspection device, and manufacturing method for probe units |
| 01/30/2014 | WO2014017115A1 Microetching agent for copper, replenishment solution thereof, and method for producing wiring board |
| 01/30/2014 | WO2014016966A1 Screen printing machine |
| 01/30/2014 | WO2014016959A1 Inspection area determining method, and circuit board inspection device |
| 01/30/2014 | WO2014015481A1 Method for treating circuit board surface |
| 01/30/2014 | WO2013158178A3 Micro cold spray direct write systems and methods for printed micro electronics |
| 01/30/2014 | US20140030908 Protective element for conductors |
| 01/30/2014 | US20140030541 Alternate pad structures/passivation integration schemes to reduce or eliminate imc cracking in post wire bonded dies during cu/low-k beol processing |
| 01/30/2014 | US20140030471 Component-embedded resin substrate and method for manufacturing same |
| 01/30/2014 | US20140029261 In-Plane Bent Printed Circuit Boards |
| 01/30/2014 | US20140029225 Electronic devices including two or more substrates electrically connected together and methods of forming such electronic devices |
| 01/30/2014 | US20140029224 Method of mounting electronic component, circuit board, solder joint portion, printed wiring board with connecting layer, and sheet-like joint member |
| 01/30/2014 | US20140029220 Electronic module and method for the production thereof |
| 01/30/2014 | US20140029216 Circuit board, electronic device, and method of manufacturing circuit board |
| 01/30/2014 | US20140029215 Wireless communications apparatus |
| 01/30/2014 | US20140029208 Component-containing module and method for producing component-containing module |
| 01/30/2014 | US20140029206 Ejectable component assemblies in electronic devices |
| 01/30/2014 | US20140029201 Power package module and manufacturing method thereof |
| 01/30/2014 | US20140029078 Devices and methods for protecting electromechanical device arrays |
| 01/30/2014 | US20140028502 Wireless communications antenna assembly |
| 01/30/2014 | US20140027296 Sidewalls of electroplated copper interconnects |
| 01/30/2014 | US20140027263 Touch panel and method for manufacturing same |
| 01/30/2014 | US20140027262 Touch screen panel fabrication method thereof |
| 01/30/2014 | US20140027168 Printed wiring board, printing method, and liquid device |
| 01/30/2014 | US20140027167 Printed circuit board and method of manufacturing printed circuit board |
| 01/30/2014 | US20140027166 Techniques for efficient wire routing in electronic devices |
| 01/30/2014 | US20140027164 Printed circuit board with patterned electrically conductive layer therein visible and method for manufacturing same |
| 01/30/2014 | US20140027163 Printed circuit board and method for manufacturing the same |
| 01/30/2014 | US20140027162 Printed circuit board and method for manufacturing a printed circuit board |
| 01/30/2014 | US20140027156 Multilayer type coreless substrate and method of manufacturing the same |
| 01/30/2014 | US20140027047 Carrier for manufacturing printed circuit board, method of manufacturing the same and method of manufacturing printed circuit board using the same |
| 01/30/2014 | US20140027038 Method for manufacturing conductive fiber and/or fabrics, conductive fiber and/or fabric, and method for manufacturing circuit board |
| 01/30/2014 | US20140026413 Single-layer pcb microfluidics |
| 01/30/2014 | US20140026412 Method for manufacturing printed wiring board |
| 01/30/2014 | US20140026411 Techniques for efficient wire routing in a device |
| 01/30/2014 | US20140026408 Fixture for breaking circuit board |
| 01/30/2014 | DE102013214664A1 Verfahren zur Metallisierung von Durchkontaktierungen Process for the metallization of vias |
| 01/30/2014 | DE102013108017A1 Mehrschichtige Sicherheitshülle Multiple layers of protection cover |
| 01/30/2014 | DE102013108016A1 Sicherheitshülle Containment |
| 01/30/2014 | DE102013108015A1 Sicherheitshülle mit zerbrechlichen Leitern Containment with fragile ladders |
| 01/30/2014 | DE102012213304A1 Method for producing three-dimensional printed circuit board arrangement, involves inserting first printed circuit board in second circuit board, so that first recess in first board is inserted into second recess in second board |
| 01/30/2014 | DE102012213076A1 Layer backup structure for plug connector, has supporting bracket that is provided to prevent tilting of plug connector during transportation from assembly station to soldering station |
| 01/30/2014 | DE102012106942A1 Method for exchanging defective electronic component arranged on carrier against replacement component, involves securing replacement component on carrier by solder deposit which is formed by spraying solder on carrier |
| 01/30/2014 | DE102012106941A1 Method for manufacturing support of printed circuit board assembly, involves compensating deviations from preset pattern by applying additional viscous medium in substrate at application process performed based on predefined program |
| 01/29/2014 | EP2690941A1 Wiring substrate |
| 01/29/2014 | EP2690940A1 Screen printing machine |
| 01/29/2014 | EP2690939A1 Screen printing machine |
| 01/29/2014 | EP2690938A1 Method for forming copper wiring, method for manufacturing wiring substrate, and wiring substrate |
| 01/29/2014 | EP2690937A1 Method for forming copper wiring, method for manufacturing wiring substrate, and wiring substrate |
| 01/29/2014 | EP2690763A1 Electric fluid pump for a motor vehicle |
| 01/29/2014 | EP2689645A1 Method for producing a film stack, and system for producing a film stack |
| 01/29/2014 | EP2689644A1 Method and populating device for producing an electric contact sensor plate and for populating an electric or electronic module with the contact sensor plate in an automated manner, contact sensor plate, and use of said contact sensor plate |
| 01/29/2014 | EP2689643A1 Thermal management within an led assembly |
| 01/29/2014 | EP2573508B1 Solder height detection method and solder height detection device |
| 01/29/2014 | EP2538761B1 Intelligent Power Module and related assembling method |
| 01/29/2014 | EP2464202B1 Multi-Layer Substrate and Electronic Device Having the Same |
| 01/29/2014 | CN203416518U Suction nozzle of surface mounter |
| 01/29/2014 | CN203416517U Structure for arranging special-shaped SMDs (surface mounted devices) |
| 01/29/2014 | CN203416516U Novel multi-shaft surface-mounting machine |
| 01/29/2014 | CN203416515U Suction nozzle sleeve |
| 01/29/2014 | CN203416514U Device for adjusting height of suction nozzle |
| 01/29/2014 | CN203416513U Suction nozzle seat structure |
| 01/29/2014 | CN203416512U Limiting device |
| 01/29/2014 | CN203416511U Pneumatic workbench cooperated clamp for electroplating circuit board rapidly and circularly |
| 01/29/2014 | CN203416510U Thin board special-purpose production tool for horizontal line |
| 01/29/2014 | CN203416509U Rapid fixing device of PCB |
| 01/29/2014 | CN203416508U PCB fixing tray |
| 01/29/2014 | CN203416507U Automatic cleaning etching apparatus of PCB |
| 01/29/2014 | CN203409743U Plug-in mounting workbench for components and parts of LED (Light-Emitting Diode) circuit board |
| 01/29/2014 | CN203409398U Smoke exhausting mechanism of pin tin-soldering groove of LED (Light-Emitting Diode) circuit board |
| 01/29/2014 | CN203409389U Longitudinal arrangement structure of preheating tank heating pipe of wave soldering machine |
| 01/29/2014 | CN103548430A Electronic component mounting method, electronic component loading device and electronic component mounting system |
| 01/29/2014 | CN103548429A Spring-to-board I/O-connector assembly, members thereof and board provided therewith |
| 01/29/2014 | CN103548428A Method and populating device for producing an electric contact sensor plate and for populating an electric or electronic module with the contact sensor plate in an automated manner, contact sensor plate, and use of said contact sensor plate |
| 01/29/2014 | CN103548427A Printed board |
| 01/29/2014 | CN103548426A Wiring substrate, multi-pattern wiring substrate, and manufacturing method therefor |
| 01/29/2014 | CN103548207A Circuit connection material, circuit member connection structure, and circuit member connection structure manufacturing method |
| 01/29/2014 | CN103548128A Method and device for transporting solder spheres |
| 01/29/2014 | CN103547706A Surface treating composition for copper and copper alloy and utilization thereof |
| 01/29/2014 | CN103547138A Assembly type carrying tool and using method thereof |
| 01/29/2014 | CN103547088A Multilayered circuit board structure with buried element and manufacturing method |
| 01/29/2014 | CN103547087A Vacuum adhesive pressing hole plugging method for high-depth buried holes |
| 01/29/2014 | CN103547086A Reflow soldering jig for PCBs of bank card cipherer |