Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
01/2014
01/22/2014CN103533763A Manufacturing method for forming conductor line on non-conductive substrate
01/22/2014CN103533762A Splitting fixture for jointed PCB (printed circuit board)
01/22/2014CN103533761A Manufacturing method for improving accuracy of PCB (printed circuit board) back drilling hole
01/22/2014CN103533760A Fabrication method of non-via holes in inner layer of multilayer PCB
01/22/2014CN103533759A Method for manufacturing high-frequency microwave super-long flexible printed circuit board
01/22/2014CN103533758A Manufacturing method for flexible circuit board
01/22/2014CN103533757A Dual-heating laminated board
01/22/2014CN103533756A Method for etching printed circuit board
01/22/2014CN103533751A 传感器阵列包装 The sensor array packaging
01/22/2014CN103533746A High-density interconnection integrated printed circuit board of improved laminated structure and manufacturing method thereof
01/22/2014CN103533741A Double-side thick copper plate and manufacturing method thereof
01/22/2014CN103531383A Jig for coating film adhesive on metal dome bonding pad
01/22/2014CN102835195B Soldering device and cover support/sealing structure
01/22/2014CN102615952B Temperature controllable SMT (surface mounting technology) soldering paste printing double-layer mold plate
01/22/2014CN102473993B Signal line and circuit board
01/22/2014CN102449070B Resin composition, cured product, and circuit board using same
01/22/2014CN102415223B Printed board arrangement
01/22/2014CN102132641B 电子元件安装系统 An electronic component mounting system
01/22/2014CN101432134B Conductor foil with adhesive layer, conductor-clad laminate, printed wiring board and multilayer wiring board
01/22/2014CN101427385B Method of coupling photovoltaic cells and film for implementing it
01/21/2014US8634178 ESD protection in a very small form factor consumer electronic product
01/21/2014US8633584 Electronic assembly with electronic compontent and interconnection assembly connected via conductive bump and mating well
01/21/2014US8633398 Circuit board contact pads
01/21/2014US8631570 Through wafer vias with dishing correction methods
01/21/2014US8631569 Circuit board with holding mechanism for holding wired electronic components method for manufacture of such a circuit board and their use in a soldering oven
01/21/2014US8631568 Printed wiring board manufacturing method
01/21/2014US8631567 Method of manufacturing rigid-flexible printed circuit board
01/21/2014US8631566 Circuit board structure comprising an electrical component and a method for manufacturing a circuit board structure comprising an electrical component
01/21/2014US8631565 Method for manufacturing a solar module
01/16/2014WO2014011578A1 Photosintering of micron-sized copper particles
01/16/2014WO2014011228A1 High speed circuit assembly with integral terminal and mating bias loading electrical connector assembly
01/16/2014WO2014010473A1 Photosensitive resin composition, photosensitive dry film, pattern formation method, printed circuit board, and method for producing same
01/16/2014WO2014010204A1 Alkali development type resin, and photosensitive resin composition using same
01/16/2014WO2014010145A1 Method for providing paste
01/16/2014WO2014009906A1 Optimized printed circuit board
01/16/2014WO2014009234A1 Printed circuit board having a solder-guiding capillary
01/16/2014WO2014008889A1 Method for producing metal-ceramic substrates and metal-ceramic substrate
01/16/2014US20140017397 Method of manufacturing a printed circuit board
01/16/2014US20140016293 High frequency module having surface acoustic wave device and method for manufacturing the same
01/16/2014US20140016290 Touch panel and method for manufacturing the same
01/16/2014US20140016284 Means to provide electrical connections to borderless flexible display
01/16/2014US20140016278 Conductive structure, touch panel, and method for manufacturing same
01/16/2014US20140014635 System and methods for forming apertures in microfeature workpieces
01/16/2014US20140014615 Etching liquid composition for multilayer containing copper and molybdenum and process for etching thereof
01/16/2014US20140014401 Circuit device and method for making the same
01/16/2014US20140013865 Apparatus for Sensing
01/16/2014DE112012001568T5 Musterdruckvorrichtung Pattern printing device
01/16/2014DE112011105153T5 Im Spritzgussverfahren hergestellte Schaltkreiskomponente Molded circuit component
01/16/2014DE102012212087A1 Leiterplatte mit einer Lotmittel führenden Kapillare Circuit board with a solder leading capillary
01/15/2014EP2685795A1 Circuit board and method for manufacturing circuit board
01/15/2014EP2685463A1 Patterned flexible transparent conductive sheet and manufacturing method thereof
01/15/2014EP2684696A2 Universal adapter for connecting templates of different tensioning systems with the same tensioning frame
01/15/2014EP2684434A1 Process for flip-chip connection of an electronic component
01/15/2014EP2684433A2 Assembly having a substrate, an smd component, and a lead frame part
01/15/2014EP2207244B1 Assembly of connector and multilayer circuit board
01/15/2014EP2133398B1 Fire-retardant adhesive resin composition, and adhesive film using the same
01/15/2014CN203399477U Suction nozzle elevating system used for chip mounter
01/15/2014CN203399430U Auxiliary device capable of improving PCB (Printed Circuit Board) golden finger beveling efficiency
01/15/2014CN203399429U Vacuum laminating resin plug hole auxiliary fixture
01/15/2014CN203399428U Universal LED circuit board welding combined die
01/15/2014CN203399427U Wave-soldering tool
01/15/2014CN203399426U Cooling device used for processing mainboard
01/15/2014CN203399425U Minimized electronic component processing positioning device
01/15/2014CN203399424U Lower guide block structure of component plugging machine
01/15/2014CN203399423U Soldermask counterpoint tool hole
01/15/2014CN203399422U Circuit board etching apparatus
01/15/2014CN203399421U Automatic V-CUT auxiliary base plate
01/15/2014CN203399420U Auxiliary clamp improving laminating flatness of multilayer thick copper foil circuit board
01/15/2014CN203399419U Device for forming circuits on touch control panel
01/15/2014CN203399418U Plug-and-play type circuit board printed chassis structure
01/15/2014CN203399417U Circuit board board-plugging mechanism
01/15/2014CN203399416U Water retaining apparatus for printed circuit board
01/15/2014CN203399415U Jig used for flexible circuit board elastic sheet binding
01/15/2014CN203399398U Magnetic integrated substrate based on LTCF
01/15/2014CN203390783U PCB (printed circuit board) supporting and sucking jig
01/15/2014CN1809252B Method of manufacturing printed circuit board
01/15/2014CN103518424A Method for mounting electronic component, device for mounting electronic component, and system for mounting electronic component
01/15/2014CN103518423A Method for producing more particularly processing or populating, a circuit board element and carrier for use in such a method
01/15/2014CN103518288A Antenna and communication apparatus as well as manufacturing method for antenna
01/15/2014CN103517587A Hard and soft combined circuit board and manufacturing method thereof
01/15/2014CN103517586A Hard and soft combined circuit board and manufacturing method thereof
01/15/2014CN103517585A Flexible and hard combined circuit board and manufacturing method thereof
01/15/2014CN103517584A Manufacturing method of multilayer circuit board
01/15/2014CN103517583A Multilayer circuit board and manufacturing method thereof
01/15/2014CN103517582A Multilayer circuit board and manufacturing method thereof
01/15/2014CN103517581A Manufacturing method of multilayer PCB board and multilayer PCB board
01/15/2014CN103517580A Manufacturing method of multilayer PCB board and multilayer PCB board
01/15/2014CN103517579A Circuit board and processing method thereof
01/15/2014CN103517578A Manufacturing method of multilayer PCB board and multilayer PCB board
01/15/2014CN103517577A Method for manufacturing conductive post of ceramic packaging substrate
01/15/2014CN103517576A Printed circuit board processing method, printed circuit board and electronic device
01/15/2014CN103517575A Method for transplant grafting of printed circuit board
01/15/2014CN103517574A Bearing jig and method for manufacturing rigid-flexible printed circuit board
01/15/2014CN103517573A Processing method of circuit board
01/15/2014CN103517572A Wiring board, method for repairing disconnection in wiring board, method for forming wiring in wiring board, and method for manufacturing wiring board
01/15/2014CN103517571A Method of electroplating and depositing metal
01/15/2014CN103517570A Electronic circuit manufacturing method and shell body
01/15/2014CN103517569A Silver conductive ink and method for manufacturing printed circuit with same
01/15/2014CN103517568A Circuit board and its manufacturing method
01/15/2014CN103517567A Printed-circuit board manufacturing method and PCB
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