Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
02/2014
02/12/2014CN103582283A Flexible printed circuit board and manufacturing method
02/12/2014CN103582279A 电路板及其制作方法 Circuit board and its manufacturing method
02/12/2014CN103579011A Package carrier and manufacturing method thereof
02/12/2014CN103572336A Copper plating solution for PCB (printed circuit board) blind holes, as well as preparation method and plating method of copper plating solution
02/12/2014CN103572335A Copper plating solution for PCB (printed circuit board) through holes, and preparation method and plating method thereof
02/12/2014CN103572334A Copper plating solution for PCB (printed circuit board) through holes and PCB blind holes, as well as preparation method and plating method of copper plating solution
02/12/2014CN103571275A Conductive ink composition, manufacturing method of conductive pattern and conductive circuit
02/12/2014CN103571269A Printing ink composition, circuit board and preparation method thereof
02/12/2014CN103567325A Preformed solder generating device, feeder, assembling system and assembling method
02/12/2014CN102259503B Automatic code spraying system and application method thereof
02/11/2014US8649894 Method and device for controlling circuit board positions during the assembly of electronic components
02/11/2014US8648278 Process for producing substrate provided with metal pattern and substrate provided with metal laminate
02/11/2014US8647577 Chemical coating of microwell for electrochemical detection device
02/11/2014US8647560 Method for forming pattern and a wired board
02/11/2014US8646676 Electronic component mounting system and electronic component mounting method
02/11/2014US8646306 Method for manufacturing sensor element for gas sensor
02/11/2014US8646175 Method for making a conductive film/plate exibiting electric anisotropy
02/11/2014US8646174 Device and method for mounting electronic components
02/11/2014US8646173 Method of mounting electronic circuit constituting member and relevant mounting apparatus
02/11/2014CA2781956C Solder paste
02/11/2014CA2711649C Circuit board having an electrodeposited coating on a conductive core within a via and method of making same
02/06/2014WO2014021575A1 Wiperless mask cleaning device
02/06/2014WO2014021186A1 Wiring board, mounting structure provided with same, and method for manufacturing wiring board
02/06/2014WO2014021077A1 Multilayer substrate and power module using multilayer substrate
02/06/2014WO2014020863A1 Intaglio plate for offset gravure printing and printed wiring board
02/06/2014WO2014020862A1 Intaglio plate for offset gravure printing and printed wiring board
02/06/2014WO2014020206A1 Tool, method and machine for manufacturing multi-layer printed circuit boards
02/06/2014WO2014019495A1 Ink composition and circuit board and method for producing the same
02/06/2014US20140037912 Wiring substrate, multi-piece wiring substrate array, and manufacturing method therefor
02/06/2014US20140037889 Insulator for build-up pcb and method of manufacturing pcb using the same
02/06/2014US20140037862 Method for manufacturing printed circuit board
02/06/2014US20140037254 Side-edge mountable parallel optical communications module, an optical communications system that incorporates the module, and a method
02/06/2014US20140036471 Thin Leadframe QFN Package Design of RF Front-Ends for Mobile Wireless Communication
02/06/2014US20140036467 Ceramic multilayer substrate and method for manufacturing the same
02/06/2014US20140036466 Cased electrical component
02/06/2014US20140036465 Packaging substrate, method for manufacturing same, and chip packaging body having same
02/06/2014US20140036464 Integrated System and Method of Making the Integrated System
02/06/2014US20140036463 Electronic circuit board, assembly and a related method thereof
02/06/2014US20140036462 Multiple Surface Integrated Devices on Low Resistivity Substrates
02/06/2014US20140036459 Modular electronic header assembly and methods of manufacture
02/06/2014US20140036455 System and method for additive manufacturing of an object
02/06/2014US20140036454 Bva interposer
02/06/2014US20140036428 Method of moulding
02/06/2014US20140036218 Camera module and method for making same
02/06/2014US20140035168 Bonding pad for thermocompression bonding, process for producing a bonding pad and component
02/06/2014US20140034372 Ceramic wiring board, multi-piece ceramic wiring board, and method for producing same
02/06/2014US20140034369 Wiring substrate, multi-piece wiring substrate, and method for producing same
02/06/2014US20140034364 Methods of manufacturing metal wiring buried flexible substrate by using plasma and flexible substrates manufactured by the same
02/06/2014US20140034360 Conductive member, production method of the same, touch panel, and solar cell
02/06/2014US20140034359 Printed circuit board and method of manufacturing printed circuit board
02/06/2014US20140034358 Electrode pattern and method of manufacturing the same, printed circuit board using electrode pattern and method of manufacturing the same
02/06/2014US20140034354 Electrode, electrode material, and electrode formation method
02/06/2014US20140034244 System for manufacturing laminted circuit boards
02/06/2014US20140033528 Method of fast device attachment
02/06/2014US20140033527 Low-cost transformer assembly
02/06/2014US20140033526 Fabricating method of embedded package structure
02/06/2014US20140033518 Vacuum thermal bonding apparatus and vacuum thermal bonding method
02/06/2014DE102012213812A1 Einpresskontaktierung Einpresskontaktierung
02/06/2014DE102012213567A1 Method for connecting a connection element with metallization element, involves welding connection element to metallization element but without use to sonotrode for stapling
02/06/2014DE102012105439B4 Gedruckte Verdrahtungsplatine (PWB) mit Lötaugen A printed wiring board (PWB) with pads
02/05/2014EP2693855A1 Electronic circuit board, assembly and a related method thereof
02/05/2014EP2693854A2 High-contrast waterproof surface-mounted led lamp
02/05/2014EP2693853A1 Tool, method and machine for manufacturing multilayer printed circuit boards
02/05/2014EP2692215A1 Method for producing more particularly processing or populating, a circuit board element and carrier for use in such a method
02/05/2014EP2691237A1 Silk-screen stencil for printing onto a photovoltaic cell
02/05/2014CN203423858U Fusion auxiliary tool capable of preventing corner warp and stagger of circuit boards
02/05/2014CN203423857U Adjustable plug-in component and wave soldering tool
02/05/2014CN203423856U Chip mounter platform
02/05/2014CN203423855U Automatic conveying device and electronic installation system
02/05/2014CN203423854U Electric component belt and connection attaching sheet thereof
02/05/2014CN203423853U Reinforced base for PCB
02/05/2014CN203423852U Uncovering tool for rigid-flex board
02/05/2014CN203423851U Rubber ring correction device
02/05/2014CN203423848U Novel PCB coil
02/05/2014CN203420002U Electroless plating copper preventing lamination device
02/05/2014CN203420001U Clamp fixing tool for circuit board thin plate operation
02/05/2014CN203419998U Chemical gold hanging basket
02/05/2014CN203418201U Two-side DIP wave soldering jig for double-side SMT components
02/05/2014CN103563498A 电路板及其制造方法 The circuit board and its manufacturing method
02/05/2014CN103563497A Connection method, connected-body production method and connected body
02/05/2014CN103563496A Treatment solution for forming migration suppression layer, and production method for laminate having migration suppression layer
02/05/2014CN103563495A Wiring board and method for manufacturing wiring board
02/05/2014CN103563071A Wiring board and high frequency module using same
02/05/2014CN103562440A Liquid crystal polymer-copper clad laminate and copper foil used for liquid crystal polymer-copper clad laminate
02/05/2014CN103562436A Primer layer for plating process, laminate for circuit board and production method for same, and multilayer circuit board and production method for same
02/05/2014CN103561955A Printer
02/05/2014CN103561954A Screen printing machine, and screen printing method
02/05/2014CN103561548A Method for relieving plate pressing winkles at rivet positions of multi-layer plate
02/05/2014CN103561547A Printed circuit board through hole fixture
02/05/2014CN103561546A Flexible printed circuit board and metal sheet hot-pressing attaching process
02/05/2014CN103561545A Home pressing device, home pressing control method and wiring machine
02/05/2014CN103561544A Method for mounting chips on PCB
02/05/2014CN103561543A PCB countersunk groove processing method
02/05/2014CN103561542A Method for manufacturing circuit board capable of rapidly dissipating heat
02/05/2014CN103561541A Circuit board manufacturing technique
02/05/2014CN103561540A UV lamp illuminating device
02/05/2014CN103561539A Rotating platform, method for controlling rotating platform and line connecting machine
02/05/2014CN103561538A Method for making soft and hard double-sided circuit board
02/05/2014CN103561537A Method for punching flexible printed circuit board
02/05/2014CN103558735A Photocurable thermosetting resin composition and printed wiring board using the same
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