| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/29/2014 | CN103547085A Surface mounter and mounting method |
| 01/29/2014 | CN103547084A Surface mounter |
| 01/29/2014 | CN103547083A Automatic spacing-adjustable surface-mounting mechanism of chip mounter |
| 01/29/2014 | CN103547082A Circuit board manufacturing method |
| 01/29/2014 | CN103547081A Ultra-thick copper coil circuit board resistance welding method, system and circuit board |
| 01/29/2014 | CN103547080A Manufacturing method of high-frequency circuit board |
| 01/29/2014 | CN103547079A Method for manufacturing soft dielectric circuit |
| 01/29/2014 | CN103547078A PCB dismounting jig |
| 01/29/2014 | CN103547077A Clamping mechanism with multiple chucks and PCB testing and distributing production line |
| 01/29/2014 | CN103547076A Circuit board oven with heat recovery device |
| 01/29/2014 | CN103547075A Automatic PCB (printed circuit board) detecting and assembling production equipment |
| 01/29/2014 | CN103547074A High frequency metal core circuit substrate production method |
| 01/29/2014 | CN103547073A PCB (printed circuit board) jointed board clamp |
| 01/29/2014 | CN103547072A The printed circuit board manufacturing method |
| 01/29/2014 | CN103547065A Protruding copper structure PCB and manufacturing process of protruding copper structure PCB |
| 01/29/2014 | CN103547056A Conducting circuit device and manufacturing method thereof |
| 01/29/2014 | CN103547055A Circuit board provided with circuit pattern and manufacturing method of circuit board |
| 01/29/2014 | CN103543608A Photosensitive resin composition, and photosensitive element, resist pattern formation method and printed circuit board production method each utilizing same |
| 01/29/2014 | CN103540973A Electrogilding liquid for heat sinks of chips and circuit boards and use method |
| 01/29/2014 | CN103538341A Hot rolling lamination equipment |
| 01/29/2014 | CN102548215B Stacked-assembled substrate and stacked assembly method of TSOP (Thin Small Outline Package) integrated circuits |
| 01/29/2014 | CN102459417B Modified polyimide and method for producing modified polyimide |
| 01/29/2014 | CN102333908B Metal-coated polyimide resin substrate with excellent thermal aging resistance properties |
| 01/29/2014 | CN102256452B Circuit board with built-in semiconductor chip and method of manufacturing the same |
| 01/29/2014 | CN102174299B Circuit-connecting material, and connection structure for circuit member |
| 01/29/2014 | CN102132638B Mitigation of whiskers in sn-films |
| 01/28/2014 | US8637777 Power module substrate having heatsink, method for manufacturing the same, power module having heatsink, and power module substrate |
| 01/28/2014 | US8637047 Erysipelothrix rhusiopathiae-haemophilus parasuis vaccine and methods of using the same |
| 01/28/2014 | US8635769 Light strip and a method for making the same |
| 01/23/2014 | WO2014014043A1 Reinforcing-plate-integrated flexible printed circuit board |
| 01/23/2014 | WO2014013962A1 Continuous pattern plating transfer system and method for manufacturing continuous pattern plating transfer material |
| 01/23/2014 | WO2014013899A1 Conductive paste for laser etching, conductive thin film, and conductive laminate |
| 01/23/2014 | WO2014013847A1 Solder alloy, solder paste, and electronic circuit board |
| 01/23/2014 | WO2014013632A1 Solder alloy, solder paste, and electronic circuit board |
| 01/23/2014 | WO2014013592A1 Squeegee, squeegee device and screen printing device |
| 01/23/2014 | WO2014013572A1 Inspection head, work apparatus, and electronic-component mounting line |
| 01/23/2014 | WO2013181015A3 Method for providing a printed pattern |
| 01/23/2014 | US20140023777 Method for producing wiring board having through hole or non-through hole |
| 01/23/2014 | US20140022752 Circuit board system |
| 01/23/2014 | US20140022751 Electric circuit apparatus and manufacturing method therefor |
| 01/23/2014 | US20140022750 Circuit board and method of manufacturing the same |
| 01/23/2014 | US20140022745 Component and method for producing a component |
| 01/23/2014 | US20140022736 Ic package and assembly |
| 01/23/2014 | US20140022735 Three-dimensional circuit component, method of making the same, and physical-quantity measuring instrument |
| 01/23/2014 | US20140021851 Substrate for led module and method for manufacturing the same |
| 01/23/2014 | US20140021594 Packaging Structures and Methods for Semiconductor Devices |
| 01/23/2014 | US20140021164 Method for manufacturing a multilayer rigid flexible printed circuit board |
| 01/23/2014 | US20140021163 Graphene windows, methods for making same, and devices containing same |
| 01/23/2014 | US20140020940 Printed wiring board and method for manufacturing printed wiring board |
| 01/23/2014 | US20140020938 Method of forming copper wiring, method of manufacturing wiring board, and wiring board |
| 01/23/2014 | US20140020937 Fabrics with multi-layered circuit and manufacturing method thereof |
| 01/23/2014 | US20140020936 Electrode sensor and method of fabricating the same |
| 01/23/2014 | US20140020932 Printed circuit board, manufacturing method therefor, and metal-surface treatment liquid |
| 01/23/2014 | US20140020931 Support body, method of manufacturing support body, method of manufacturing wiring board, method of manufacturing electronic component, and wiring structure |
| 01/23/2014 | US20140020246 Method of mounting a connector |
| 01/23/2014 | US20140020245 Manufacturing of stacks of multilayer plastic laminates for printed circuits |
| 01/23/2014 | DE102008050879B4 Dichtung Seal |
| 01/22/2014 | EP2688375A1 Three-dimensional circuit component, method of making the same, and physical-quantity measuring instrument |
| 01/22/2014 | EP2688373A2 Electric circuit apparatus and manufacturing method therefor |
| 01/22/2014 | CN203407099U Alignment monitor structure for layers of PCBs |
| 01/22/2014 | CN203407098U PCB structure with holes to be selectively filled with resin |
| 01/22/2014 | CN203407097U A board conveying rack of a chip mounter |
| 01/22/2014 | CN203407096U Printing chassis with pin structure |
| 01/22/2014 | CN203407095U Etching tool for PCB with copper thickness difference |
| 01/22/2014 | CN203407094U Expansion positioning mechanism |
| 01/22/2014 | CN203407093U Dustproof workbench for circuit board |
| 01/22/2014 | CN203407092U Shared tool rotating upside down for printing |
| 01/22/2014 | CN203407091U Milling structure for a plurality of base material sheets |
| 01/22/2014 | CN203407090U Sealed type circuit board printing disc |
| 01/22/2014 | CN203407089U Auxiliary production tool of thin plate |
| 01/22/2014 | CN203406769U Power supply conversion device and photovoltaic equipment comprising power supply conversion device |
| 01/22/2014 | CN203405669U Film capable of achieving black wafer direct alignment |
| 01/22/2014 | CN203403166U Jig for electroplating of printed circuit board |
| 01/22/2014 | CN203401188U Nitrogen protective device |
| 01/22/2014 | CN103535121A Ceramic electronic component and manufacturing method thereof |
| 01/22/2014 | CN103535120A Conductive pattern and method for producing same |
| 01/22/2014 | CN103534802A Low temperature co-fired ceramic structure for high frequency applications and process for making same |
| 01/22/2014 | CN103534095A Printing device |
| 01/22/2014 | CN103534049A Copper powder, copper paste, method for manufacturing conductive coating film, and conductive coating film |
| 01/22/2014 | CN103533822A Tray for surface mount device |
| 01/22/2014 | CN103533783A Manufacturing method of multi-layer PCB (printed circuit board) |
| 01/22/2014 | CN103533782A Via hole design method |
| 01/22/2014 | CN103533781A High-precision visual system of surface mounted device |
| 01/22/2014 | CN103533780A Method for manufacturing soft-hard composite board |
| 01/22/2014 | CN103533779A PIN connection pin pressed welding method for PCB (Printed Circuit Board) board |
| 01/22/2014 | CN103533778A Method for pasting metal dome with jig |
| 01/22/2014 | CN103533777A Metal dome positioning and installing method |
| 01/22/2014 | CN103533776A Method for manufacturing embedded PCB (printed circuit board) |
| 01/22/2014 | CN103533775A SMT (Surface Mounted Technology) component feeding box |
| 01/22/2014 | CN103533774A Chip mounter |
| 01/22/2014 | CN103533773A Material conveying device for chip mounter |
| 01/22/2014 | CN103533772A High-accuracy rapid chip mounter |
| 01/22/2014 | CN103533771A Visual system of chip mounter |
| 01/22/2014 | CN103533770A Suction nozzle of chip mounter |
| 01/22/2014 | CN103533769A Liquid material discharge apparatus and method |
| 01/22/2014 | CN103533768A Micro-etching processing method |
| 01/22/2014 | CN103533767A Method for performing three-proofing treatment on circuit board by using ultrasonic waves |
| 01/22/2014 | CN103533766A Fabrication method of circuit board and circuit board fabricated by method |
| 01/22/2014 | CN103533765A Method for improving metal surface roughness on ceramic substrate wihth through hole and the ceramic substrate |
| 01/22/2014 | CN103533764A Manufacturing method for forming conductor line on non-conductive substrate |