| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/02/2014 | CN102858540B 丝网印刷机 Screen Printing Machine |
| 07/02/2014 | CN102404935B 多层导通孔叠层结构 Vias multilayer laminate structure |
| 07/02/2014 | CN102365724B 部件的布置方法 Layout of components |
| 07/02/2014 | CN102356510B 高频开关模块 Frequency switch module |
| 07/02/2014 | CN102293072B 线路板及其制造方法 Circuit board and its manufacturing method |
| 07/02/2014 | CN102017818B 用于在平坦绝缘基底上形成导电图案的设备、方法、具有该导电图案的平坦绝缘基底和形成在该平坦绝缘基底上的芯片组 Device on a planar insulating substrate for forming a conductive pattern, the method, having a planar insulating substrate and the conductive pattern is formed on the flat insulating substrate chipset |
| 07/02/2014 | CN101951724B 金属化聚酰亚胺薄膜以及使用该薄膜得到的柔性电路板 Metallized polyimide film and a flexible circuit board of the film obtained |
| 07/02/2014 | CN101836516B 在电路板上焊接元件的方法和相应的电路板 In the method of soldering components on the circuit board and the corresponding circuit board |
| 07/02/2014 | CN101829660B 基板输送装置 Substrate transport apparatus |
| 07/01/2014 | US8767025 Printer device, temperature adjustment method of printer device, and temperature adjustment system of printer device |
| 07/01/2014 | US8766104 Printed circuit boards including strip-line circuitry and methods of manufacturing same |
| 07/01/2014 | US8766101 Wiring substrate, method for manufacturing wiring substrate, and semiconductor package including wiring substrate |
| 07/01/2014 | US8766089 Semiconductor substrate, electrode forming method, and solar cell fabricating method |
| 07/01/2014 | US8765274 Secondary battery and method of making secondary battery |
| 07/01/2014 | US8765212 Methods for continuously moving a fluid dispenser while dispensing amounts of a fluid material |
| 07/01/2014 | US8764996 Methods of patterning a material on polymeric substrates |
| 07/01/2014 | US8764222 Heat dissipating structure of LED circuit board and LED lamp tube comprised thereof |
| 07/01/2014 | US8763894 Method and system for generating tracing information for gas cylinders |
| 07/01/2014 | US8763530 Ink for black matrix and method of manufacturing substrate using the same |
| 07/01/2014 | US8763525 Gravure printing of transparent conductive films containing networks of metal nanoparticles |
| 07/01/2014 | US8763244 Method of forming conductive elements |
| 07/01/2014 | US8763242 Semiconductor device and method of manufacturing the same |
| 07/01/2014 | US8763241 Method of manufacturing printed wiring board |
| 07/01/2014 | US8763240 Fabrication process for embedded passive components |
| 06/26/2014 | WO2014099614A1 Thermally decomposable polymer composition for forming microelectric assemblies |
| 06/26/2014 | WO2014098345A1 Apparatus and method for detecting cracks in contact part of electronic device |
| 06/26/2014 | WO2014098158A1 Film forming method, conductive film, and insulating film |
| 06/26/2014 | WO2014098157A1 Film forming method, conductive film and insulating film |
| 06/26/2014 | WO2014097835A1 Resin multilayer substrate |
| 06/26/2014 | WO2014097390A1 Lead-free solder alloy |
| 06/26/2014 | WO2014097061A1 Procedure for the manufacture and assembly of electronic boards and electronic device thus obtainable |
| 06/26/2014 | WO2014096140A1 Component, method for producing a component, component arrangement and method for applying a component |
| 06/26/2014 | WO2014096049A1 Method for producing a magnetically permeable circuit |
| 06/26/2014 | WO2014095895A1 Optoelectronic component and method for the production thereof |
| 06/26/2014 | WO2014095599A1 Method for brazing a printed circuit |
| 06/26/2014 | WO2014095596A1 Method for pre-soldering metal surfaces onto metallised substrates using a metallic gauze, metallised substrates with a solder layer which has a superficial structure of a gauze |
| 06/26/2014 | WO2014095315A1 Electronic device and method for producing an electronic device |
| 06/26/2014 | WO2014095314A1 Sensor for outputting an electric signal on the basis of a detected physical variable |
| 06/26/2014 | WO2014095270A1 Method for producing a multilayer carrier body |
| 06/26/2014 | WO2014095199A1 Electric assembly to be mounted on a top-hat rail |
| 06/26/2014 | WO2014094028A1 Semi-finished product for the production of a printed circuit board, method for producing a printed circuit board and printed circuit board |
| 06/26/2014 | WO2014094022A1 Semi-finished product for the production of a printed circuit board |
| 06/26/2014 | WO2013139470A3 Substrate for a portable data carrier |
| 06/26/2014 | US20140179162 Apparatus for Differential Far-End Crosstalk Reduction |
| 06/26/2014 | US20140178601 Conductive material and process |
| 06/26/2014 | US20140178581 Fine metal particles and fine metal oxide particles in dry powder form, and use thereof |
| 06/26/2014 | US20140178573 Low firing temperature copper composition |
| 06/26/2014 | US20140178571 Resin substrate having metal film pattern formed thereon |
| 06/26/2014 | US20140178566 Pattern forming apparatus and method, and method of manufacturing substrate formed with pattern |
| 06/26/2014 | US20140177220 Light emitting device and manufacturing method thereof |
| 06/26/2014 | US20140177192 Core substrate and method for manufacturing the same, and substrate with built-in electronic components and method for manufacturing the same |
| 06/26/2014 | US20140177182 Flexible display and method for manufacturing the same |
| 06/26/2014 | US20140177181 Electromagnetic Interference Shielding Structures |
| 06/26/2014 | US20140177178 Printed electronics |
| 06/26/2014 | US20140177177 Electronic device and fabrication method thereof |
| 06/26/2014 | US20140177150 Crosstalk cancelation in striplines |
| 06/26/2014 | US20140177106 Suspension board with circuits and method for manufacturing the same |
| 06/26/2014 | US20140176286 Ferrite ceramic composition, ceramic electronic component, and method for producing ceramic electronic component |
| 06/26/2014 | US20140176285 Ferrite ceramic composition, ceramic electronic component, and method for manufacturing ceramic electronic component |
| 06/26/2014 | US20140175047 Method of manufacturing a printed circuit board |
| 06/26/2014 | US20140175046 Method for forming copper wiring |
| 06/26/2014 | US20140174940 Heat-dissipating substrate and fabricating method thereof |
| 06/26/2014 | US20140174811 Printed circuit board and manufacturing method thereof |
| 06/26/2014 | US20140174810 Printed circuit board and method of manufacturing the same |
| 06/26/2014 | US20140174809 Circuit board and method of manufacturing the same |
| 06/26/2014 | US20140174805 Printed circuit board and method of manufacturing the same |
| 06/26/2014 | US20140174804 Electrical device package structure and method of fabricating the same |
| 06/26/2014 | US20140174801 Conductive material and process |
| 06/26/2014 | US20140174798 Metal core substrate and method of manufacturing the same |
| 06/26/2014 | US20140174795 Printed wiring board, printed circuit board, and method for manufacturing printed circuit board |
| 06/26/2014 | US20140174793 Printed circuit board and method for manufacturing the same |
| 06/26/2014 | US20140174791 Circuit board and manufacturing method thereof |
| 06/26/2014 | US20140174789 Touch panel and fabrication method thereof |
| 06/26/2014 | US20140174644 Fabrication method of packaging substrate |
| 06/26/2014 | US20140174629 Method for manufacturing light emitting diode module |
| 06/26/2014 | US20140174190 Manufacturing strain sensitive sensors and/or strain resistant conduits from a metal and carbon matrix |
| 06/26/2014 | US20140173886 Method for manufacturing light-emitting diode light bar |
| 06/26/2014 | US20140173885 Method for manufacturing light emitting diode module |
| 06/26/2014 | US20140173884 Method for manufacturing light emitting diode backlight module |
| 06/26/2014 | DE112012004185T5 Leistungsmanagements-Anwendungen von Zwischenverbindungssubstraten Performance management applications of interconnect substrates |
| 06/26/2014 | DE102013220951A1 Printed circuit board (PCB) has heat sink that is arranged and designed to distribute heat absorbed over flat extension in PCB and substrate layer configured to deliver heat |
| 06/26/2014 | DE102012112913A1 Electrically non-conductive substrate used in sensor components, has cavity whose surface is partially provided with four layers, and electrically conductive connection that is produced on outer surface of substrate |
| 06/26/2014 | DE102006002452B4 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation |
| 06/25/2014 | EP2747531A1 Method for the manufacture of circuit boards with mixed components |
| 06/25/2014 | EP2747530A1 Board Printing Apparatus and Board Printing Method |
| 06/25/2014 | EP2747529A1 Wiring board |
| 06/25/2014 | EP2747512A1 Furnace, control device therefor, control method therefor, and storage medium |
| 06/25/2014 | EP2746427A1 Organic solderability preservative and method |
| 06/25/2014 | EP2745659A1 Electronic module, lighting device and manufacturing method of the electronic module |
| 06/25/2014 | EP2745658A1 Method of forming a conductive image on a non-conductive surface |
| 06/25/2014 | EP2745657A1 Conductive pattern, method for forming the same, printed wiring board, and manufacturing method of the same |
| 06/25/2014 | EP2745656A1 Method for metallizing polymer layer systems, and polymer layer systems |
| 06/25/2014 | EP2745655A2 Electronic device comprising a capacitor in a holder for a circuit board and method for production thereof |
| 06/25/2014 | CN203675464U 一种塞孔专用治具 One kind of special fixture plug hole |
| 06/25/2014 | CN203675463U 一种挠性电路板双面贴装元器件装置 A flexible circuit board sided mount components means |
| 06/25/2014 | CN203675462U 一种贴装机构的拉针装置 Pull the needle apparatus placement agencies |
| 06/25/2014 | CN203675461U 用于波峰焊的偷锡治具 Steal fixture for wave soldering tin |
| 06/25/2014 | CN203675460U 一种用于电路板印刷的托架 A bracket for the printed circuit board |
| 06/25/2014 | CN203675459U 表贴异型元件装置 Surface mount device shaped element |
| 06/25/2014 | CN203675458U 一种吸嘴机构 One kind of nozzle bodies |