Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/2014
05/20/2014US8729400 Multilayer printed wiring board
05/20/2014US8726509 Method of manufacturing an ink jet recording head of laminate structure
05/20/2014US8726498 Methods for filling holes in printed wiring boards
05/20/2014US8726497 Methods of making composite electrodes
05/20/2014US8726496 Technique for remanufacturing a medical sensor
05/20/2014US8726495 Multi-layer board manufacturing method thereof
05/20/2014CA2738433C Printed circuit board for harsh environments
05/20/2014CA2654063C Navigation tool socket for a wireless communication device
05/15/2014WO2014073876A1 Method for manufacturing metal printed circuit board
05/15/2014WO2014073716A1 Tin-based solder ball and semiconductor package including same
05/15/2014WO2014073696A1 Surface-treated copper foil and laminate using same
05/15/2014WO2014073694A1 Surface-treated copper foil and laminate using same, copper-clad laminate, printed circuit board, and electronic device
05/15/2014WO2014073677A1 Method for producing conductive sheet, and conductive sheet
05/15/2014WO2014073563A1 Production method for build-up multilayer substrate, and build-up multilayer substrate
05/15/2014WO2014073504A1 Display device
05/15/2014WO2014073128A1 Circuit board and method for producing same
05/15/2014WO2014073126A1 Wiring board
05/15/2014WO2014073085A1 Wiring board and method for manufacturing same
05/15/2014WO2013034128A8 Conductor track unit for a motor vehicle
05/15/2014WO2013025473A3 Functionalization of thermal management materials
05/15/2014US20140134404 Method for fabricating dual damascene profiles using sub pixel-voting lithography and devices made by same
05/15/2014US20140134327 Water-based conductive ink for inkjet recording
05/15/2014US20140134326 Method for functional printing system
05/15/2014US20140133797 Flip-chip optical interface with micro-lens array
05/15/2014US20140133122 Electronic component assembly
05/15/2014US20140133119 Wiring board and method for manufacturing the same
05/15/2014US20140133111 Combined wiring board and method for manufacturing combined wiring board
05/15/2014US20140133065 3d capacitor
05/15/2014US20140131889 Flexible printed circuit board for packaging semiconductor device and method of producing the same
05/15/2014US20140131307 Method and Apparatus for Converting Commerical Off-The-Shelf (COTS) Thin Small-Outline Package (TSOP) Components Into Rugged Off-The-Shelf (ROTS) Components
05/15/2014US20140131085 Circuit board having tie bar buried therein and method of fabricating the same
05/15/2014US20140131083 Printed circuit board and method for manufacturing the same
05/15/2014US20140131081 Printed circuit board and method of manufacturing the same
05/15/2014US20140131076 Ceramic substrate composite and method for manufacturing ceramic substrate composite
05/15/2014US20140131074 Wiring substrate and method for manufacturing wiring substrate
05/15/2014US20140131072 Connection structure for a substrate and a method of fabricating the connection structure
05/15/2014US20140131069 Touch-sensing electrode structure and method of manufacturing the same
05/15/2014US20140131068 Circuit board and method for manufacturing the same
05/15/2014US20140131067 Transparent conductor and preparation method thereof
05/15/2014US20140130347 Method of manufacturing printed circuit board
05/15/2014US20140130341 Method and system for pins detection and insertion of electronic component
05/15/2014DE10300818B4 Stanzwerkzeug, insbesondere für Green Sheets Punch, especially for Green Sheets
05/15/2014DE102013112589A1 System und Verfahren für ein elektronisches Gehäuse mit einem Ausfallöffnungsmechanismus System and method for an electronic housing having a discharge opening mechanism
05/15/2014DE102013100700B3 Method of manufacturing semiconductor device module, involves inserting terminal free ends into contact holes of a board and introducing adjusting device relative to carrier in different relative positions by sliding board on terminals
05/14/2014EP2731411A2 Connection structure of circuit board
05/14/2014EP2730834A1 LED Illumination Device
05/14/2014EP2729846A1 Process for the production of a layered body and layered bodies without masking obtainable therefrom
05/14/2014EP2729845A1 Process for the production of a layered body and layered bodies obtainable therefrom
05/14/2014EP2729595A1 Method for providing organic resist adhesion to a copper or copper alloy surface
05/14/2014CN203596979U 一种成品褪阻焊的浸泡挂篮 One kind of faded solder dipping finished hanging basket
05/14/2014CN203596978U 电路板喷锡挂具 HASL board hanging
05/14/2014CN1800979B 光固化性/热固化性单液型阻焊剂组合物以及使用其的印刷电路板 The photo-curable / thermal curable one-part compositions and the use of the solder resist which is a printed circuit board
05/14/2014CN103797902A 多层布线基板 The multilayer wiring board
05/14/2014CN103797901A 部件安装基板的制造方法及制造系统 Component mounting board manufacturing method and manufacturing system of
05/14/2014CN103797692A 插头模块、特别是用于车窗玻璃升降器驱动装置的插头模块及其制造方法 Plug modules, especially the plug module for window lifter drive device and manufacturing method thereof
05/14/2014CN103796788A 导电性材料、使用该导电性材料的连接方法和连接结构物 A conductive material, the conductive material using a connection method and connection structure
05/14/2014CN103796451A 印刷布线板及印刷布线板的制造方法 The method of manufacturing a printed wiring board and a printed wiring board
05/14/2014CN103796450A 组合印制电路板和印制电路板的制造方法 Combination method of manufacturing printed circuit boards and printed circuit board
05/14/2014CN103796449A 高厚径比线路板镀孔塞孔的制作方法 Plugs the hole plating method of making high aspect ratio board
05/14/2014CN103796448A 印刷电路板bvh深度的最小化方法 PCB bvh depth minimization method
05/14/2014CN103796447A 回流装置 Reflux device
05/14/2014CN103796446A 大规模阵列式光电收发传感器的高效制作方法 Efficient mass production methods optoelectronic transceiver sensor array
05/14/2014CN103796445A 具有内埋元件的电路板及其制作方法 Circuit board and a method of preparing a buried element
05/14/2014CN103796444A 一种贴片机自动送料机构 A patch automatic feed mechanism
05/14/2014CN103796443A 小型贴片机贴装头的运动控制系统 Small patch machine placement head movement control system
05/14/2014CN103796442A 用于表面贴装设备的支撑顶针 For surface mount devices support thimble
05/14/2014CN103796441A 软薄板表面电浆处理结构 Soft sheet surface plasma processing structure
05/14/2014CN103796440A 在绝缘金属板上形成导电线路的方法 Method for forming a conductive insulated metal panel line
05/14/2014CN103796439A 焊料供应方法及焊料供应装置 Solder and solder supply means supply method
05/14/2014CN103796438A 涂覆式立体结构线路的制备方法及其应用 Three-dimensional structure of the coating line type production method and its application
05/14/2014CN103796437A 阴阳铜箔电路板的制作方法 Copper circuit board fabrication method of yin and yang
05/14/2014CN103796436A Pcb板冷却装置及方法 Pcb board cooling apparatus and method
05/14/2014CN103796435A 测量线路板层压偏位的方法 Deviation measurement circuit board lamination method
05/14/2014CN103796434A 一种超薄型柔性线路板盲孔加工方法 An ultra-thin type of flexible circuit boards blind hole machining method
05/14/2014CN103796433A 线路板混合表面工艺的制作方法 The method of mixing the surface of the circuit board production process
05/14/2014CN103796432A 基板载体夹具 Substrate carrier jig
05/14/2014CN103796431A 折线模具 Polyline mold
05/14/2014CN103796430A 一种用于板件的吸附及分离装置 An adsorption and separation device for plate
05/14/2014CN103796429A 电路板的制作方法 Method of manufacturing a circuit board
05/14/2014CN103796422A 带载体的铜箔、使用它的覆铜板、印刷布线板、印刷电路板和印刷布线板的制造方法 The copper foil with a carrier, the use of the method of manufacturing it CCL, printed wiring boards, printed circuit boards and printed wiring board
05/14/2014CN103796418A 一种电路板及电路板的制作方法 A method of manufacturing a circuit board and the circuit board
05/14/2014CN103796417A 电路板及其制作方法 Circuit board and its manufacturing method
05/14/2014CN103796416A 软硬结合电路板及其制作方法 Flex circuit board and its manufacturing method
05/14/2014CN103796415A 多层电路板及其制作方法 Multi-layer circuit board and its manufacturing method
05/14/2014CN103796414A 印制电路板及印制电路板的制造方法 The method of manufacturing printed circuit boards and printed circuit boards
05/14/2014CN103795370A 电子元件模块 The electronics module
05/14/2014CN103794516A 一种阶梯阻焊的封装产品制作方法 One kind of ladder solder packaging products production methods
05/14/2014CN103792788A 感光性树脂组合物、感光性元件、抗蚀图形的形成方法及印刷电路板的制造方法 Method for producing a photosensitive resin composition, a photosensitive element, resist pattern forming method and a printed circuit board
05/14/2014CN103787665A 联接剂、有机陶瓷材料、有机陶瓷线路板及其制备方法 Coupling agent, an organic ceramic material, an organic ceramic circuit board and a method for preparing
05/14/2014CN103786389A 带载体的铜箔、使用它的覆铜板、印刷布线板、印刷电路板和印刷布线板的制造方法 The copper foil with a carrier, the use of the method of manufacturing it CCL, printed wiring boards, printed circuit boards and printed wiring board
05/14/2014CN103038020B 无铅焊料合金及使用其的电子基板 Lead-free solder alloy, and using the same electronic substrate
05/14/2014CN102553854B 升降抖动装置 Lifting jitter device
05/14/2014CN102281750B 一种贴片机 A patch machine
05/14/2014CN102265714B 电子部件及其制造方法 An electronic component and its manufacturing method
05/14/2014CN102172113B 电子元件安装系统和电子元件安装方法 The electronic component mounting system and an electronic component mounting method
05/14/2014CN102172111B 电子部件安装系统以及电子部件安装方法 The electronic component mounting system and an electronic component mounting method
05/14/2014CN102144435B 电子部件安装装置以及电子部件安装装置的工作方法 Working method of the electronic component mounting apparatus and an electronic component mounting apparatus
05/13/2014USRE44886 Method and apparatus for improving laser hole resolution
05/13/2014US8723050 Multilayer printed circuit board and method for making same
05/13/2014US8721349 Connector, optical transmission device, and connector connection method
1 ... 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 ... 1185