Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/2014
08/13/2014CN103987213A 制备形成有铜薄层的衬底的方法、制造印制电路板的方法及由此制造的印制电路板 The method for preparing a thin layer of copper is formed in a substrate, a method of manufacturing a printed circuit board and the printed circuit board thus manufactured
08/13/2014CN103987212A 多层布线基板制造用的支承基板、多层布线基板的制造方法 A supporting substrate with a multilayer wiring substrate manufacturing method for manufacturing a multilayer wiring board
08/13/2014CN103987211A 一种基于增大铝基面的高效散热铝基板及其制作方法 Based on increasing efficient cooling aluminum plate aluminum surface and its production method
08/13/2014CN103987210A 一种pcb制作方法和pcb One kind of pcb production methods and pcb
08/13/2014CN103987209A 一种利用环氧薄片进行阻焊塞孔的方法 A use of epoxy sheets were solder plug hole method
08/13/2014CN103987208A 一种印刷线路板及其制作方法 A printed wiring board and manufacturing method thereof
08/13/2014CN103987207A 软硬复合线路板及其制造方法 Soft and hard composite board and its manufacturing method
08/13/2014CN103987206A 印刷电路基板的制造方法 The method of manufacturing a printed circuit board
08/13/2014CN103987205A 用在贴片机工作台上的pcb板固定装置及其使用方法 Table used in the placement machine pcb board fixture and method of use
08/13/2014CN103987204A 一种新型的贴片机 A new placement machine
08/13/2014CN103987203A 一种高厚铜及网格类印制板阻焊加工方法 A high-thick copper PCB and solder processing methods Grid class
08/13/2014CN103987202A 一种用于控制局部铜厚的pcb板制作方法及pcb板 A method for controlling the local copper thickness pcb board production methods, and pcb board
08/13/2014CN103987201A 前驱基板、软性印刷电路板及其制造方法 The precursor substrate, the flexible printed circuit board and its manufacturing method
08/13/2014CN103987200A 剥离式补强板假贴机 Peel-off stickers reinforcement plate fake machine
08/13/2014CN103987199A 补强板全自动假贴机 Automatic reinforcement plate affixed fake machine
08/13/2014CN103987198A 一种无辅助结构的无芯基板的制造方法 A method of manufacturing a coreless no auxiliary structure substrate
08/13/2014CN103987197A Pcb板的加工方法及pcb板 Pcb board processing method, and pcb board
08/13/2014CN103987196A 一种免烘烤湿膜线路板的制作方法 A no-bake method of making wet film circuit board
08/13/2014CN103987195A 印刷基板的开孔加工方法 The method of drilling a printed circuit board
08/13/2014CN103987194A 一种多层板压合涨缩控制方法 One kind of multilayer laminated sizing control method
08/13/2014CN103987191A 一种减小ac耦合电容pad对高速串行信号传输影响的方法 A high-speed serial signal transmission is reduced impact ac coupling capacitor pad on way
08/13/2014CN103987190A 一种优化差分过孔阻抗的方法 An optimized differential via impedance method
08/13/2014CN103987189A 前驱基板、软性印刷电路板及其制造方法 The precursor substrate, the flexible printed circuit board and its manufacturing method
08/13/2014CN103987187A 一种嵌埋铜块pcb板及其制作方法 One kind of embedded copper block pcb board and its manufacturing method
08/13/2014CN103987185A 多层式的软性印刷电路板及其制造方法 The flexible multi-layered printed circuit board and its manufacturing method
08/13/2014CN103987184A 电路板及制造方法和包括该电路板的照明模块和照明装置 The circuit board and the manufacturing method of the circuit board and includes a lighting module and a lighting device
08/13/2014CN103984253A Vcp电镀线分段开、停机节能装置 Vcp plating line segment open, stop saving devices
08/13/2014CN103046031B 一种线路板电镀金方法 A circuit board gold plating method
08/13/2014CN103034146B 一种X－Ray钻靶机控制方法 One kind of X-Ray drill drone control method
08/13/2014CN102869207B 一种多层led混合材料线路板的层压方法 A multi-layer lamination process led the board of the mixed material
08/13/2014CN102803384B 薄膜用组合物以及用其制作的接着薄膜与覆盖薄膜 The film compositions, and then covered with a thin film with a film and its production
08/13/2014CN102781661B 单面金属包覆层叠体的制造方法 The method of manufacturing the single-sided metal-clad laminate
08/13/2014CN102638934B 一种灯条线路板成型方法 A lamp lines plate forming method
08/13/2014CN102595786B 一种具有内嵌电容的印制电路板及其制造方法 An embedded capacitance printed circuit board and its manufacturing method
08/13/2014CN102480847B 线路板及其制造方法 Circuit board and its manufacturing method
08/13/2014CN102472965B 光固化性树脂组合物 The photocurable resin composition
08/13/2014CN102427678B Pcb板制作方法 Pcb board production methods
08/13/2014CN102369315B 包含抑制剂的无空隙亚微米结构填充用金属电镀组合物 Inhibitor containing submicron structure without gaps filled with the metal plating composition
08/13/2014CN102293069B 线路板及其制造方法 Circuit board and its manufacturing method
08/13/2014CN102239021B 用于喷出具有高温的流体液滴的装置 Fluid droplet discharge device having a high temperature for
08/13/2014CN102171306B 各向异性导电粘结剂及使用该粘结剂的连接结构体的制备方法 And the anisotropic conductive adhesive prepared using the method of the connection structure of the binder
08/13/2014CN102066473B 高介电常数激光直接结构化材料 High dielectric constant material laser direct structuring
08/13/2014CN101128088B 嵌入式波导印刷电路板结构 Embedded waveguide printed circuit board structure
08/12/2014US8804328 External electrical connection for a portable electronic device
08/12/2014US8803452 High intensity light source
08/12/2014US8803004 Complex adhesive boundaries for touch sensors
08/12/2014US8802992 Circuit board mounting apparatus
08/12/2014US8802760 Composition and methods of forming solder bump and flip chip using the same
08/12/2014US8802346 Metal compositions and methods of making same
08/12/2014US8801971 Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution
08/12/2014US8801912 Continuous copper electroplating method
08/12/2014US8800479 In-process orientation of particles used in direct-write inks to control electrical characteristics
08/12/2014US8800142 Package substrate unit and method for manufacturing package substrate unit
08/12/2014US8800140 Method of making a modular multichannel microelectrode array
08/12/2014US8800139 Method of chip mounting onto downwardly-facing mounting surface of printed circuit board
08/12/2014US8800138 Method for conditioning a substrate surface for forming an electronic device thereon and resultant device
08/12/2014US8800137 Method of manufacturing printed circuit board
08/12/2014CA2387813C An energy enhanced process for treating a conductive surface and products formed thereby
08/07/2014WO2014121115A1 Removable conformal radio frequency shields
08/07/2014WO2014120896A1 Discrete component assembly
08/07/2014WO2014120894A1 Circuit assembly
08/07/2014WO2014120640A1 Pcb having offset differential signal routing
08/07/2014WO2014118783A1 Three-dimensional conductive patterns and inks for making same
08/07/2014WO2014091000A3 Printed circuit comprising a heat-transport insert
08/07/2014US20140222123 Nanopillar electrode devices and methods of recording action potentials
08/07/2014US20140220330 Polymer resin composition, polyimide resin film, preparation method of polyimide resin film, flexible metal laminate, and circuit board
08/07/2014US20140218883 Electronic module allowing fine tuning after assembly
08/07/2014US20140218881 Mounting method of electronic component, electronic component mount body, and manufacturing method thereof
08/07/2014US20140218875 Aqueous polyimide precursor solution composition and method for producing aqueous polyimide precursor solution composition
08/07/2014US20140218872 Electronic circuit and method of fabricating the same
08/07/2014US20140218869 Heat radiation structure of electric device and method for manufacturing the same
08/07/2014US20140218851 Shield Can
08/07/2014US20140218642 Conductive sheet, touch panel, display device, method for producing conductive sheet, and recording medium
08/07/2014US20140218637 Conductive film, manufacturing method thereof, and touch screen including the conducting film
08/07/2014US20140218155 Low profile packaging and assembly of a power conversion system in modular form
08/07/2014US20140217059 Capacitive touch sensor integrated with window panel and fabrication method thereof
08/07/2014US20140216941 Method of Electrochemically Fabricating Multilayer Structures Having Improved Interlayer Adhesion
08/07/2014US20140216803 Conductive component and preparation method thereof
08/07/2014US20140216802 Substrate structure and the process manufacturing the same
08/07/2014US20140216799 Conductive film forming method, copper particulate dispersion and circuit board
08/07/2014US20140216795 Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a method
08/07/2014US20140216794 Printed wiring board and method for manufacturing printed wiring board
08/07/2014US20140216793 Method of manufacturing a printed circuit board or a sub-assembly thereof as well as printed circuit board or a sub-assembly thereof and use thereof
08/07/2014US20140216792 Method of manufacturing a rigid-flex printed circuit board or a sub-assembly thereof as well as rigid-flex printed circuit board or a sub-assembly thereof
08/07/2014US20140216791 Short circuit reduction in an electronic component comprising a stack of layers arranged on a flexible substrate
08/07/2014US20140216787 Printed circuit board and fabrication method thereof
08/07/2014US20140215817 Method for manufacturing a component interconnect board
08/07/2014US20140215782 Multilayer wiring substrate, and method of manufacturing the same
08/07/2014DE102014202007A1 Mehrebenenmetallisierung auf einem Keramiksubstrat Mehrebenenmetallisierung on a ceramic substrate
08/07/2014DE102013202037A1 Hermetische Durchführung, Verfahren zur Herstellung einer hermetischen Durchführung, Leiterplatte und chirurgisches Instrument Hermetic implementation, method of manufacturing a hermetic implementation, PCB and surgical instrument
08/07/2014DE102013201926A1 Verfahren zum elektrischen Kontaktieren eines Bauteils und Bauteilverbund A method for electrically contacting a component and composite component
08/07/2014DE102013200868A1 Verfahren zur Herstellung einer stoffschlüssigen Verbindung und einer elektrischen Verbindung A process for producing a material-locking connection and an electrical connection
08/06/2014EP2763518A1 Component embedded substrate mounting body, method for manufacturing same and component embedded substrate
08/06/2014EP2763517A1 Substrate manufacturing method
08/06/2014EP2763516A2 Light-emitting device and lighting apparatus
08/06/2014EP2763515A1 Electronic device, joining material, and method for producing electronic device
08/06/2014EP2763514A1 Interposer substrate and method of manufacturing the same
08/06/2014EP2763513A1 Wiring substrate, component embedded substrate, and package sructure
08/06/2014EP2761979A1 Systems and methods for void reduction in a solder joint
08/06/2014EP2761059A1 Methods of continuously wet etching a patterned substrate
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