Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/2014
06/12/2014WO2014087630A1 System for determining suitability of printing component that has been set in screen printing device and method for determining suitability of printing component that has been set
06/12/2014WO2014087578A1 Device for producing circuit board and method for producing circuit board
06/12/2014WO2014086954A1 Method and soldering device for selective soldering with at least one solder nozzle and another functional element which are moved synchronously by a movement device
06/12/2014WO2014035528A3 Paint-on approach for fabrication of electrically active structures
06/12/2014US20140162473 Mobile independent loading mechanism
06/12/2014US20140162060 Strippable adhesion composition and uses thereof
06/12/2014US20140161992 Method for forming copper wiring
06/12/2014US20140160710 Environmental sensitive electronic device package and manufacturing method thereof
06/12/2014US20140160707 Non-uniform substrate stackup
06/12/2014US20140160705 Environmental sensitive electronic device package and manufacturing method thereof
06/12/2014US20140160695 Display device and method of manufacturing the same
06/12/2014US20140160692 Method for surface decoration of an object with 3-dimensional geometry and the object obtained therefrom
06/12/2014US20140160549 Colloid electrolyte composition
06/12/2014US20140159222 Chip-embedded printed circuit board and semiconductor package using the pcb, and manufacturing method of the pcb
06/12/2014US20140158414 Recessed discrete component mounting on organic substrate
06/12/2014US20140158411 Substrate having transparent electrode for flexible display and method of fabricating the same
06/12/2014US20140158410 Polyimide, copper-clad laminate, flexible printed circuit board, and method for manufacturing the flexible printed circuit board
06/12/2014US20140158408 Multi-layer wiring board and method of manufacturing the same
06/12/2014US20140158402 Method of producing resonant patterns adapted to the implementation of rf passive functions
06/12/2014US20140158400 Conductive films having low-visibility patterns and methods of producing the same
06/12/2014US20140158399 Electrohydrodynamic (EHD) Printing for the Defect Repair of Contact Printed Circuits
06/12/2014US20140157593 Method of making hybrid wiring board with built-in stopper, interposer and build-up circuitry
06/12/2014DE112012003081T5 Leiterbild und Verfahren zum Herstellen desselben The same conductor pattern and method of making
06/12/2014DE102013221153A1 Embedding-technologie mit hohem wirkungsgrad Embedding technology with high efficiency
06/12/2014DE102012222791A1 Verfahren zur Kontaktierung eines Halbleiters und Halbleiterbauelement mit erhöhter Stabilität gegenüber thermomechanischen Einflüssen A method for contacting a semiconductor and semiconductor device having increased stability against thermo-mechanical influences
06/12/2014DE102012222678A1 Verfahren zur Herstellung einer Leiterplatte mit erhöhter Stromtragfähigkeit A process for producing a circuit board with an increased current carrying capacity
06/12/2014DE102012112100A1 Method for manufacturing printed circuit board, involves fitting first side of circuit board with surface mounted device component, and soldering through fetch technique components and device component in reflow soldering process
06/12/2014DE102010021765B4 Herstellungsverfahren zur Anordnung zweier Verbindungspartner mittels einer Niedertemperatur Drucksinterverbindung Manufacturing process for the arrangement of two link partners by means of a low-temperature pressure sintering connection
06/11/2014EP2741592A1 Electronic device comprising a heat protection by means of an inserted electronic component, module comprising such a device and process for manufacturing such a device
06/11/2014EP2741591A1 Method for producing a circuit board with increased conductivity
06/11/2014EP2741300A1 Composition set, electroconductive substrate and manufacturing method thereof, and electroconductive binding material composition
06/11/2014EP2740334A1 Method for producing a low-induction busbar
06/11/2014EP2739904A1 Modular lighting assembly adapter part
06/11/2014CN203645926U 线路板过炉自动循环装置 Board the furnace automatic circulation device
06/11/2014CN203645925U 一种贴导电片夹具 One kind of conductive sheet attached fixtures
06/11/2014CN203645924U 一种制作柔性线路板用的加热装置 A heating device with a flexible printed circuit board production
06/11/2014CN203645923U 一种制作柔性线路板用的挂具 A method of making a flexible circuit board with hanging
06/11/2014CN203636158U 点焊机pcb板的运动机构 Spot welding pcb board sports agency
06/11/2014CN203636157U 点焊机pcb板的y轴运动机构 Spot welding pcb board y-axis motion mechanism
06/11/2014CN203636148U 一种全自动浸焊锡机 Dip a fully automatic soldering machine
06/11/2014CN1853452B Multilayer printed wiring board
06/11/2014CN103858527A Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition
06/11/2014CN103858526A Circuit board and method for forming a circuit on a PCB
06/11/2014CN103858525A Printed circuit board, component and circuit assembly
06/11/2014CN103858016A Capacitance detection circuit
06/11/2014CN103857833A Copper foil excellent in adhesion with resin, method for manufacturing same, and printed wiring board or battery negative electrode material using electrolytic copper foil
06/11/2014CN103857268A Shield film, shield printed wiring board and method of manufacturing shield printed wiring board
06/11/2014CN103857215A Processes for manufacturing printed wiring boards possessing electrically conductive constraining cores
06/11/2014CN103857214A Multi-layer PCB hot melting bonding mechanism
06/11/2014CN103857213A Two-sided flexible printed circuit board and manufacturing method thereof
06/11/2014CN103857212A Manufacturing method for multilayer circuit board and circuit board
06/11/2014CN103857211A Transparent circuit board and manufacture method for the same
06/11/2014CN103857210A Bearer circuit board, manufacturing method for the same and packaging structure thereof
06/11/2014CN103857209A Multi-layer circuit board and manufacture method for the same
06/11/2014CN103857208A Machining method for circuit board drilling
06/11/2014CN103857207A Circuit board and manufacturing method thereof
06/11/2014CN103857206A Golden finger plate manufacturing method, golden finger plate and printed circuit board
06/11/2014CN103857205A Circuit board laser pore-forming method
06/11/2014CN103857204A Bearing plate and manufacture method for the same
06/11/2014CN103857203A Jig and method for assembling divergent light distribution overall lens
06/11/2014CN103857202A PCB and manufacturing method for copper pillar of printed circuit board
06/11/2014CN103857201A Insertion-connection part protective cover
06/11/2014CN103857200A Welding supporting plate for printed circuit boards
06/11/2014CN103857199A Axial rotation device of BGA rework station pickup assembly
06/11/2014CN103857198A Forming method of wire distributing circuit
06/11/2014CN103857197A Circuit board and manufacturing method of circuit board
06/11/2014CN103857196A Method for optimizing multi-head arch-type high speed and high precision chip mounter in off-line mode
06/11/2014CN103857195A Anti-interference filtering device
06/11/2014CN103857194A Structure for simultaneous surface mounting of multiple BGAs
06/11/2014CN103857193A Alignment system for simultaneous surface mounting of multiple BGAs
06/11/2014CN103857192A Protection method for inner circuit of printed circuit board
06/11/2014CN103857191A Multi-layer flexible circuit board micro-hole processing technology based on picosecond laser
06/11/2014CN103857190A Preparation method for FPC board
06/11/2014CN103857189A Method for manufacturing conducting circuit on insulating substrate and circuit board manufactured with method
06/11/2014CN103857188A Partial double-sided-reinforcement flexible board and manufacturing method thereof
06/11/2014CN103857187A Circuit board and surplus-glue processing method thereof
06/11/2014CN103857186A Adsorption apparatus for circuit board
06/11/2014CN103857177A Transparent circuit board, and transparent circuit board module and manufacturing method thereof
06/11/2014CN103857176A Circuit board and manufacture method for the same
06/11/2014CN103857174A Printed circuit board and manufacturing method thereof
06/11/2014CN103857173A High efficiency embedding technology
06/11/2014CN103855052A PCB fixed structure of BGA rework table
06/11/2014CN103849915A Electroplating device and method of plating copper in via hole of PCB (Printed Circuit Board)
06/11/2014CN103847097A Riveting and positioning fixture, PCB riveting method, manufacturing method for PCB and PCB
06/11/2014CN103846515A Electromagnetic pump wave crest generator for plating element with tin
06/11/2014CN103846514A Electromagnetic pump nozzle for plating element with tin
06/11/2014CN103260882B Screen printing device and screen printing method
06/11/2014CN102560584B Additive for electrolytic copper foil and surface treatment process of very low profile electrolytic copper foil
06/11/2014CN102501575B Screen printing apparatus
06/11/2014CN102393605B Photosensitive resin composition, photosensitive element, method for resist pattern formation, and method for manufacturing printed wiring board
06/11/2014CN102361757B Screen printing system and method for cleaning masks of screen printing system
06/11/2014CN102334391B Multi-layer circuit carrier and method for the production thereof
06/10/2014US8749992 Electronic component
06/10/2014US8745863 Method of manufacturing multi-layer printed circuit board
06/10/2014US8745861 Method of making a storage system having an environmentally-modifiable conductor
06/10/2014US8745860 Method for manufacturing printed wiring board
06/05/2014WO2014085156A1 Electrical components and methods of manufacturing electrical components
06/05/2014WO2014084321A1 Copper foil with carrier, process for producing copper foil with carrier, printed wiring board, and printed circuit board
06/05/2014WO2014084080A1 Layered solder material for bonding dissimilar electrodes, and method for bonding dissimilar electrodes to electronic components
06/05/2014WO2014084077A1 Ceramic copper-metallized wiring board and process for producing same
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