| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/19/2014 | US20140170304 Board printing apparatus and board printing method |
| 06/19/2014 | US20140168920 Component-mounting printed board and method of manufacturing the same |
| 06/19/2014 | US20140168510 Imaging element module and method for manufacturing the same |
| 06/19/2014 | US20140166495 Substrate for printed wiring board, printed wiring board, and methods for producing same |
| 06/19/2014 | US20140166355 Method of manufacturing printed circuit board |
| 06/19/2014 | US20140166354 Circuit board and manufacturing method thereof |
| 06/19/2014 | US20140166353 Electrical interconnect formed through buildup process |
| 06/19/2014 | US20140166347 Printed circuit board and method for manufacturing the same |
| 06/19/2014 | US20140166345 Transparent conducting glass and method of manufacturing same |
| 06/19/2014 | US20140166343 Electronic component embedded substrate and method of manufacturing electronic component embedded substrate |
| 06/19/2014 | US20140165346 Heat dissipating substrate and method of manufacturing the same |
| 06/19/2014 | US20140165269 Flexible computing fabric |
| 06/18/2014 | EP2744319A1 Solder printing system |
| 06/18/2014 | EP2744311A1 Method for producing resonating patterns suitable for the performance of passive RF functions |
| 06/18/2014 | EP2744309A1 Electric connecting element |
| 06/18/2014 | EP2744045A1 A method for brazing aluminium electrical conductors |
| 06/18/2014 | EP2743291A1 Method for the production of a component or a structural part on-board a vehicle adapted to integrate electrical devices and connections, and composite material for the realization of said component or structural part |
| 06/18/2014 | EP2743286A1 Resin composition for resists |
| 06/18/2014 | EP2742784A1 Method for manufacturing a component interconnect board |
| 06/18/2014 | EP2742783A1 High resolution printing |
| 06/18/2014 | EP2742782A1 Method for manufacturing a led matrix and a device comprising a led matrix |
| 06/18/2014 | EP2742104A1 Electrically conductive heat-activated adhesive compound |
| 06/18/2014 | DE112012003721T5 Durchgangslochstruktur zum Übertragen differentieller Signale Through-hole structure for transmitting differential signals |
| 06/18/2014 | DE102013225814A1 Verfahren zum Vorbeloten von Metallflächen auf metallisierten Substraten A method for Vorbeloten metal surfaces on metallized substrates |
| 06/18/2014 | DE102012223287A1 Printed circuit board for accommodating electronic element i.e. LED, has electrically insulated layer comprising openings for guiding connection unit, where core and/or connection unit and/or conductors are partially made from copper |
| 06/18/2014 | DE102012223077A1 Kontaktanordnung für einen mehrlagigen Schaltungsträger Contact arrangement for a multilayer circuit carrier |
| 06/18/2014 | DE102012112587A1 Verfahren zur Herstellung eines magnetisch leitenden Kreises A process for the preparation of a magnetically conductive loop |
| 06/18/2014 | DE102012112550A1 Verfahren zur Metallisierung eines Werkstücks sowie ein Schichtaufbau aus einem Werkstück und einer Metallschicht A process for the metallization of a workpiece as well as a layer structure of a workpiece and a metal layer |
| 06/18/2014 | DE102012112546A1 Method for manufacturing mixed printed circuit board of measuring device, involves printing stencil with solder paste, and fitting surface mount device components with side of board, where components are soldered during soldering process |
| 06/18/2014 | DE102012112503A1 Verfahren zur Herstellung von mischbestückten Leiterplatten A process for the preparation of compound mounted PCBs |
| 06/18/2014 | DE102007005345B4 Verfahren zum Reflow-Löten sowie Vorrichtung zur Durchführung des Verfahrens A method of reflow soldering, as well as apparatus for carrying out the method |
| 06/18/2014 | CN203661516U 多工位插装生产线和鼠标pcb板自动生产线 Multi-position plug production lines and mouse pcb board automatic production line |
| 06/18/2014 | CN203661427U 多层板铆合对位治具 Multilayer riveting counterpoint Fixture |
| 06/18/2014 | CN203661426U 一种可扩充式的贴片机 A scalable type of placement machine |
| 06/18/2014 | CN203661425U 新型贴片机平台及贴片机 The new placement machine platform and Mounter |
| 06/18/2014 | CN203661424U 偏心定位机构 Eccentric positioning mechanism |
| 06/18/2014 | CN203661423U 一种可调节的电路板对位治具 An adjustable alignment jig board |
| 06/18/2014 | CN203661422U 一种pcb板在线烧写夹具 One kind pcb board online burning fixtures |
| 06/18/2014 | CN203661421U 具有小尺寸薄型盲槽的线路板的压合结构 Laminated structures with a small size of a thin circuit board blind slot |
| 06/18/2014 | CN203661420U 新型整板带胶钢片 The new whole plate with plastic steel |
| 06/18/2014 | CN203659456U 导电粒子、各向异性导电粘接剂膜和连接结构体 Conductive particles, an anisotropic conductive adhesive film and the connection structure |
| 06/18/2014 | CN203658731U 菲林对位机用ccd视觉对位装置 Film of the crew with visual alignment device ccd |
| 06/18/2014 | CN203649597U 自动焊接系统 Automatic Welding System |
| 06/18/2014 | CN103875315A Flexible printed circuit board for electrically contacting and mechanically fixing a lamp in a luminaire |
| 06/18/2014 | CN103874407A Method for manufacturing a flexible portable electronic device |
| 06/18/2014 | CN103874347A Novel high-intensity high-performance multilayer substrate surface symmetrical structure and manufacturing method |
| 06/18/2014 | CN103874346A Method for manufacturing circuit board |
| 06/18/2014 | CN103874345A Method for manufacturing multi-layer microwave circuit by using ceramic substrates |
| 06/18/2014 | CN103874344A Vias of a circuit board and method for depositing conducting polymers into through-holes |
| 06/18/2014 | CN103874343A High-precision full-automatic BGA repair workbench |
| 06/18/2014 | CN103874342A Circuit board assembling method and circuit board |
| 06/18/2014 | CN103874341A Surface mount carrier and surface mount method |
| 06/18/2014 | CN103874340A Automatic medium-speed chip mounter |
| 06/18/2014 | CN103874339A Manufacturing method of teflon high-frequency circuit board |
| 06/18/2014 | CN103874338A Preprocessing method for LED (light emitting diode) nixie tube lattice component |
| 06/18/2014 | CN103874337A Nonmetal base material metallization method and product |
| 06/18/2014 | CN103874336A Carbon oil printing process for circuit board |
| 06/18/2014 | CN103874335A Circuit board etching line width control method |
| 06/18/2014 | CN103874334A Manufacturing method of teflon high-frequency circuit board |
| 06/18/2014 | CN103874333A Manufacturing method of teflon high-frequency circuit board |
| 06/18/2014 | CN103874332A Manufacturing method of teflon high-frequency circuit board |
| 06/18/2014 | CN103874331A Manufacturing method of teflon high-frequency circuit board |
| 06/18/2014 | CN103874330A Conducting method for inner and outer surfaces of wiring substrate |
| 06/18/2014 | CN103874329A V-CUT processing method of PCB |
| 06/18/2014 | CN103874327A Copper-clad plate and manufacturing method thereof |
| 06/18/2014 | CN103874326A Printed circuit board and method of manufacturing printed circuit board |
| 06/18/2014 | CN103874325A Laminate structure, manufacturing method, and light emitting device |
| 06/18/2014 | CN103874324A Multi-color solder mask layer |
| 06/18/2014 | CN103874323A Coplane electromagnetic band gap plate based on vertical cascade connection and manufacturing method thereof |
| 06/18/2014 | CN103874322A Metal wire layout structure on insulation layer and preparation method thereof |
| 06/18/2014 | CN103874321A Circuit board and manufacturing method thereof |
| 06/18/2014 | CN103874320A Circuit board and manufacturing method thereof |
| 06/18/2014 | CN103872002A Stretchable and foldable electronic devices |
| 06/18/2014 | CN103871996A Package structure and manufacturing method thereof |
| 06/18/2014 | CN103869620A Alkali-developable photocurable resin composition, dried film and cured product of composition, and printed wiring board comprising dried film or cured product |
| 06/18/2014 | CN103869615A Photocurable composition, solder resist layer and printed circuit board |
| 06/18/2014 | CN103866324A Selective tin etching solution |
| 06/18/2014 | CN103865431A Conducting resin composite material, preparation method of conducting resin composite material and printed circuit board containing conducting resin composite material |
| 06/18/2014 | CN103865061A Polyimide material, copper-clad substrate, and flexible circuit board and its making method |
| 06/18/2014 | CN102822112B Metal base substrate and manufacturing method thereof |
| 06/18/2014 | CN102724822B Control technological method for planeness of surface of LTCC substrate |
| 06/18/2014 | CN102595798B Forming process for fine line circuit with line width being below 0.05mm of flexible printed circuit board |
| 06/18/2014 | CN102522345B Ball mounting device and ball mounting method utilizing same |
| 06/18/2014 | CN102307756B Headliner with integral wire harness |
| 06/18/2014 | CN102300415B Method for preparing uniformly-conductive silver wire used for printed electronics |
| 06/18/2014 | CN102196880B Laser processing method and laser processing device |
| 06/18/2014 | CN101738858B Flame retardant photocurable resin composition, dry film and cured product thereof, and printed wiring board using the same |
| 06/18/2014 | CN101672959B Optical transceiver |
| 06/17/2014 | US8754742 Multilayer ceramic substrate and method for producing the same |
| 06/17/2014 | US8754523 Surface-mounted electronic component |
| 06/17/2014 | US8754334 Multilayer printed wiring board |
| 06/17/2014 | US8752284 Method of producing a land grid array (LGA) interposer utilizing metal-on-elastomer |
| 06/17/2014 | US8752283 Assembly of electronic and optical devices |
| 06/12/2014 | WO2014088358A1 Printed circuit board |
| 06/12/2014 | WO2014088357A1 Printed circuit board and manufacturing method therefor |
| 06/12/2014 | WO2014088291A1 Method for forming fine conductive pattern using metal nanoink for laser patterning process |
| 06/12/2014 | WO2014088099A1 Method for producing metal-foil-clad laminate |
| 06/12/2014 | WO2014087945A1 Process for manufactuing conductive film and printed wiring board |
| 06/12/2014 | WO2014087792A1 High-frequency module |
| 06/12/2014 | WO2014087693A1 Etching fluid, replenishing fluid, and method for forming copper wiring |