Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/2014
08/27/2014EP2770806A1 Method for forming through holes in insulating substrate and method for manufacturing insulating substrate for interposer
08/27/2014EP2770528A1 Solder bump formation method and device
08/27/2014EP2770520A1 Relay assembly with fastening clip
08/27/2014EP2770448A1 Electronic-substrate electrical design device using three-dimensional space, electrical design method, program, and computer-readable recording medium
08/27/2014EP2769602A1 Contacting of an antenna
08/27/2014EP2768625A2 Device for soldering
08/26/2014US8817480 Seal structure
08/26/2014US8816807 Controlled self assembly of anisotropic conductive adhesives based on ferromagnetic particles
08/26/2014US8816707 Misalignment detection devices
08/26/2014US8816411 Mosfet package
08/26/2014US8816218 Multilayer electronic structures with vias having different dimensions
08/26/2014US8816213 Terminal structure, printed wiring board, module substrate, and electronic device
08/26/2014US8816212 Flexible device and fabricating method thereof
08/26/2014US8816211 Articles with photocurable and photocured compositions
08/26/2014US8815387 Copper foil with ultra thin adhesive layer, and a method for manufacturing the copper foil with ultra thin adhesive layer
08/26/2014US8815334 Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board
08/26/2014US8815333 Manufacturing method of metal structure in multi-layer substrate
08/26/2014US8815126 Method and composition for screen printing of conductive features
08/26/2014US8813356 Method for manufacturing magnetic substrate and common mode filter
08/26/2014US8813354 Method of manufacturing an electromagnetic shielding structure
08/26/2014US8813353 Method of manufacturing a dielectric structure
08/26/2014US8813349 Device for separating electronic components
08/25/2014DE202014103626U1 Berührungsempfindlicher Bildschirm mit einer Anhaftstruktur Touch sensitive screen with a Anhaftstruktur
08/21/2014WO2014127377A1 Improved system and method for manufacturing flexible laminated circuit boards
08/21/2014WO2014126982A2 Liquid crystal alignment layers and methods of fabrication
08/21/2014WO2014125470A1 Two-step, direct- write laser metallization
08/21/2014US20140235080 Externally serviceable it memory dimms for server/tower enclosures
08/21/2014US20140233241 Circuit board element having at least one led
08/21/2014US20140233199 Component built-in board and method of manufacturing the same, and mounting body
08/21/2014US20140233165 Flex circuit
08/21/2014US20140232951 Substrate with transparent electrode, method for manufacturing thereof, and touch panel
08/21/2014US20140231393 Program controlled dicing of a substrate using a pulsed laser beam
08/21/2014US20140231381 Methods of Continuously Wet Etching A Patterned Substrate
08/21/2014US20140231127 Multi-Finish Printed Circuit Board
08/21/2014US20140231125 Interconnect Joint Protective Layer Apparatus and Method
08/21/2014US20140231124 Base material for forming electroconductive pattern, circuit board, and method for producing each
08/21/2014US20140230241 Electronic component mounting system and electronic component mounting method
08/21/2014US20140230207 Lift off process for conductor foil layer
08/21/2014DE112013000132T5 Flexible Leiterplatte sowie Verfahren zu deren Herstellung Flexible printed circuit board as well as processes for their preparation
08/21/2014DE102013101644A1 Elektronisches Bauteil Electronic component
08/20/2014EP2768294A2 Assembly having a flexible circuit board
08/20/2014EP2768293A1 Printed circuit board for electrical circuits
08/20/2014EP2768292A1 Method for the double-sided population of a circuit board
08/20/2014EP2768291A1 Component built-in board and method of manufacturing the same, and mounting body
08/20/2014EP2768290A1 Electronic component
08/20/2014EP2767147A1 Method and apparatus for reducing pressure effects on an encapsulated device
08/20/2014EP2727898A9 Brazing filler metal, brazing filler metal paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor module
08/19/2014US8811019 Electronic device, method for producing the same, and printed circuit board comprising electronic device
08/19/2014US8810996 Inkjet-printed flexible electronic components from graphene oxide
08/19/2014US8810994 Power storage module for railway vehicles
08/19/2014US8810040 Wiring substrate including projecting part having electrode pad formed thereon
08/19/2014US8809734 Methods and systems for thermal-based laser processing a multi-material device
08/19/2014US8809694 Circuit module
08/19/2014US8809693 Three-dimensional circuit board
08/19/2014US8809689 Systems and methods for composite structures with embedded interconnects
08/19/2014US8809082 Method for producing lamps
08/19/2014US8808790 Method for manufacturing a submillimetric electrically conductive grid coated with an overgrid
08/19/2014US8808011 Contact and bonding structure of the contact
08/19/2014US8807416 Reflow soldering system
08/19/2014US8807025 Mesh for screen printing and method of forming patterns using the mesh for screen printing
08/19/2014US8806743 Panelized process for SMT sensor devices
08/19/2014US8806742 Method of making an electronic package
08/19/2014US8806741 Method of making an electronic device
08/14/2014WO2014123849A1 One part epoxy resin including acrylic block copolymer
08/14/2014WO2014122055A1 Masking method for semiconductor devices with high surface topography
08/14/2014WO2014094729A3 Method for the metallation of a workpiece and a layer structure made up of a workpiece and a metal layer
08/14/2014US20140227539 Process for forming metal film, and product equipped with metal film
08/14/2014US20140227531 Resin composition, prepreg, and laminate
08/14/2014US20140227498 Method, system for manufacturing a circuit board, and the circuit board thereof
08/14/2014US20140227446 Surface modifier for polyimide resin and surface-modifying method for polyimide resin
08/14/2014US20140226289 Vehicle interior panel with integral wire harness
08/14/2014US20140225957 Electric connection method
08/14/2014US20140225839 Mesh sensor design for reduced visibility in touch screen devices
08/14/2014US20140224762 Substrate Manufacturing Method
08/14/2014US20140224530 Mixed-metal system conductors for use in low-temperature co-fired ceramic circuits and devices
08/14/2014US20140224528 Precursor substrate, flexible circuit board and process for producing the same
08/14/2014US20140224527 Flexible circuit board and process for producing the same
08/14/2014US20140224526 Multi-layer flexible circuit board and process for producing the same
08/14/2014US20140223734 Method of manufacturing proximity sensor
08/14/2014DE10297077B4 Verfahren zur Verbesserung der Stabilität von Kohlenstoffdispersionen A process for improving the stability of carbon dispersions
08/14/2014DE102013201417A1 Verfahren zur Herstellung eines MID-Bauteils, MID-Bauteil A process for the preparation of a MID component, MID component
08/14/2014DE102013101315A1 Verfahren zur Verlötung eines Anschlusselement Method for soldering a connection element
08/13/2014EP2765456A1 Masking method for semiconductor devices with high surface topography
08/13/2014EP2764760A1 Electronic components accommodated by a cavity of the current pcm or by a cavity of the adjacent pcm to minimize height of cavities
08/13/2014EP2763797A2 Direct dispense device and method
08/13/2014CN203775542U 背光模组与印刷在玻璃上的柔性电路板的贴合装置 The backlight module and a flexible printed circuit board on the glass lamination unit
08/13/2014CN203775541U 一种吸取焊锡圈的真空吸嘴 A suction vacuum nozzle solder ring
08/13/2014CN203775540U 恒压力校平机构 Constant pressure leveling mechanism
08/13/2014CN203775539U 一种通孔元器件装配用印制板夹持架 One kind of through-hole components fitted with PCB clamping frame
08/13/2014CN203775538U 一种全自动机械式高速插针机 A fully automated high-speed mechanical pin machine
08/13/2014CN203775537U 全自动端子插片机 Automatic terminal inserted machine
08/13/2014CN203775536U 一种带防尘板的pcb板磨边装置 A tape dust board pcb board edging device
08/13/2014CN203775535U 基板吸附载台 Substrate adsorption stage
08/13/2014CN203775534U 用于生产印刷在玻璃上的柔性电路板的上料装置 Feeding means for the production of a flexible printed circuit on a glass plate
08/13/2014CN203766221U 电路板阻焊双面印刷装置 Double-sided circuit board solder printing device
08/13/2014CN103988589A 用于机动车的控制器 A controller for a motor vehicle
08/13/2014CN103988375A 带有屏蔽的插塞式连接器 With shielded plug connector
08/13/2014CN103987245A 生产数据生成装置和生产数据生成方法 Data generation means and the production method for producing data generation
08/13/2014CN103987242A 电子部件组装系统和载体识别方法 Electronic component assembly systems and carrier identification methods
08/13/2014CN103987215A 壳体结构及应用该结构的电子装置 The electronic device housing structure and application of the structure
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