| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/18/2014 | US20140262453 Transparent conductive electrodes and their structure design, and method of making the same |
| 09/18/2014 | US20140262451 Wiring substrate and manufacturing method thereof |
| 09/18/2014 | US20140262449 Apparatus and Method for a Back Plate for Heat Sink Mounting |
| 09/18/2014 | US20140262448 High-frequency signal line, method for producing same, and electronic device |
| 09/18/2014 | US20140262444 Circuitry with high aspect ratio traces |
| 09/18/2014 | US20140262443 Hybrid patterned nanostructure transparent conductors |
| 09/18/2014 | US20140262442 Module and method of manufacturing the same |
| 09/18/2014 | US20140261961 Transferable film including readable conductive image, and methods for providing transferable film |
| 09/18/2014 | US20140259659 Phased array steering for laser beam positioning systems |
| 09/18/2014 | US20140259658 Method of cutting conductive patterns |
| 09/18/2014 | US20140259657 Patterned ophthalmic lenses with inserts |
| 09/18/2014 | US20140259656 Data logger sensor component assembly and test process |
| 09/18/2014 | US20140259654 Method of manufacturing led module |
| 09/18/2014 | US20140259653 Flexible rework device |
| 09/18/2014 | US20140259648 Bonding system |
| 09/18/2014 | DE102013102637A1 Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates A metal-ceramic substrate and method for manufacturing a metal-ceramic substrate |
| 09/18/2014 | DE102013102542A1 Elektronisches Bauteil und Verfahren zum Herstellen eines elektronischen Bauteils Electronic component and method for manufacturing an electronic component |
| 09/18/2014 | DE102013102541A1 Elektronisches Bauteil, Verfahren zu dessen Herstellung und Leiterplatte mit elektronischem Bauteil An electronic part, method of producing the electronic component and circuit board with |
| 09/17/2014 | EP2779814A2 Flexible lighting device including a protective conformal coating |
| 09/17/2014 | EP2779810A2 Printed circuit board package structure and manufacturing method thereof |
| 09/17/2014 | EP2779806A2 Flexible lighting device including a heat-spreading layer |
| 09/17/2014 | EP2778261A1 Method of filling through-holes |
| 09/17/2014 | EP2778260A2 Method of filling through-holes |
| 09/17/2014 | EP2777826A2 Liquid dispensing syringe |
| 09/17/2014 | EP2777370A2 Printed circuit boards with embedded electro-optical passive element for higher bandwidth transmission |
| 09/17/2014 | EP2777369A1 Method and system for producing circuit boards |
| 09/16/2014 | US8837212 Electronic devices including two or more substrates electrically connected together and methods of forming such electronic devices |
| 09/16/2014 | US8837169 EMI shielding device which can be easily assembled and disassembled |
| 09/16/2014 | US8837168 Electronic package structure |
| 09/16/2014 | US8837163 Integrated flex tail circuit packaging |
| 09/16/2014 | US8837162 Circuit board socket with support structure |
| 09/16/2014 | US8837161 Multi-configuration processor-memory substrate device |
| 09/16/2014 | US8837160 High-dielectric sheet, a printed circuit board having the high-dielectric sheet and production methods thereof |
| 09/16/2014 | US8837141 Electronic module with heat spreading enclosure |
| 09/16/2014 | US8837110 Graphene mounted on aerogel |
| 09/16/2014 | US8836138 Wiring substrate and semiconductor package |
| 09/16/2014 | US8836114 Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers |
| 09/16/2014 | US8836108 Circuit board structure and package structure |
| 09/16/2014 | US8835773 Wiring board and method of manufacturing the same |
| 09/16/2014 | US8835772 Production method of connection structure |
| 09/16/2014 | US8835768 Flexible circuit board |
| 09/16/2014 | US8834957 Preparation method for an electroconductive patterned copper layer |
| 09/16/2014 | US8834956 Methods of utilizing block copolymer to form patterns |
| 09/16/2014 | US8834729 Method of making bondable printed wiring member |
| 09/16/2014 | US8833923 Conductor forming method |
| 09/16/2014 | US8833726 Sealing frame and method for covering a component |
| 09/16/2014 | US8833634 Electronic component mounting system |
| 09/16/2014 | US8833253 Mask holder |
| 09/16/2014 | US8833252 Screen printing apparatus |
| 09/16/2014 | US8833251 Screen printing device and screen printing method |
| 09/16/2014 | US8832935 Method of manufacturing a printed wiring board |
| 09/16/2014 | US8832933 Method of fabricating a semiconductor test probe head |
| 09/16/2014 | US8832932 Method of mounting an electronic component on a circuit board |
| 09/16/2014 | US8832931 Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components |
| 09/16/2014 | US8832929 Method of manufacturing a flexible printed circuit board |
| 09/15/2014 | CA2846697A1 Sealing and encapsulation in energized ophthalmic devices with annular inserts |
| 09/12/2014 | WO2014138024A1 High speed printed circuit board with uniform via inside diameter |
| 09/12/2014 | WO2014137749A1 Smart phone on a chip and method making same |
| 09/12/2014 | WO2014137002A1 Soldering joint structure of printed circuit board with excellent solder discharge property |
| 09/12/2014 | WO2014136897A1 Photosensitive resin composition, dry film using same, printed wiring board, and method for producing printed wiring board |
| 09/12/2014 | WO2014136763A1 Copper foil for laser processing, carrier-foil-supported copper foil for laser processing, copper-clad laminate, and process for producing printed wiring board |
| 09/12/2014 | WO2014136683A1 Method for manufacturing power-module substrate |
| 09/12/2014 | WO2014136606A1 Adhesive sheet and method for manufacturing adhesive sheet |
| 09/12/2014 | WO2014136595A1 Structure, circuit board, and electronic device |
| 09/12/2014 | WO2014136303A1 Semiconductor device and method for producing semiconductor device |
| 09/12/2014 | WO2014135958A1 Method of printing electronic systems on textile substrates |
| 09/12/2014 | WO2014135742A1 Circuit board and a manufacturing method thereon |
| 09/12/2014 | WO2014135415A1 Method for producing a functionalised thermoplastic plastic film having hybrid layer structures and plastic film processed in accordance with said method |
| 09/12/2014 | WO2014134699A1 Forming a transparent metal oxide layer on a conductive surface of a dielectric substrate |
| 09/11/2014 | US20140255709 Laminate, method for producing the same, and method for forming conductive pattern |
| 09/11/2014 | US20140255600 Aqueous activator solution and process for electroless copper deposition on laser-direct structured substrates |
| 09/11/2014 | US20140254189 Beacon with illuminated leds array boards connected |
| 09/11/2014 | US20140254120 Device packaging structure and device packaging method |
| 09/11/2014 | US20140254113 Method of providing an electronic device structure and related electronic device structures |
| 09/11/2014 | US20140254108 Thermal isolation in printed circuit board assemblies |
| 09/11/2014 | US20140254101 Smart phone on a chip and method making same |
| 09/11/2014 | US20140253827 Conductive film, manufacturing method thereof, and touch screen having the same |
| 09/11/2014 | US20140252541 Systems and methods for power train assemblies |
| 09/11/2014 | US20140251946 Fabrication method of wiring structure for improving crown-like defect |
| 09/11/2014 | US20140251676 Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition |
| 09/11/2014 | US20140251675 High speed printed circuit board with uniform via inside diameter |
| 09/11/2014 | US20140251673 Micro-channel connection method |
| 09/11/2014 | US20140251671 Micro-channel with conductive particle |
| 09/11/2014 | US20140251670 Module, method for manufacturing the module, and electronic apparatus including the module |
| 09/11/2014 | US20140251668 Automatic manufacturing process for providing buffer pads for a pcb and pcb structure using the same |
| 09/11/2014 | US20140251667 Conductive Networks on Patterned Substrates |
| 09/11/2014 | US20140251659 Circuit board, and manufacturing method for circuit board |
| 09/11/2014 | US20140251656 Wiring board and method for manufacturing the same |
| 09/11/2014 | US20140251655 Stabilization agents for silver nanowire based transparent conductive films |
| 09/11/2014 | US20140251537 Insulating Resin Film, Bonded Structure Using Insulating Resin Film, and Production Method of Bonded Structure |
| 09/11/2014 | US20140251429 Conductive structure and method for manufacturing same |
| 09/11/2014 | US20140250687 Method of fabricating flexible electronic devices |
| 09/11/2014 | DE112012004675T5 Siebdrucker und Siebdruckverfahren Screen printers and screen printing method |
| 09/11/2014 | DE102014203738A1 Elektronisches teil und elektronische steuereinheit Electronic part and electronic control unit |
| 09/11/2014 | DE102014203737A1 Elektronisches teil und elektronische steuereinheit Electronic part and electronic control unit |
| 09/11/2014 | DE102014203736A1 Elektronisches teil und elektronische steuereinheit Electronic part and electronic control unit |
| 09/11/2014 | DE102014203732A1 Elektronisches teil und elektronische steuereinheit Electronic part and electronic control unit |
| 09/11/2014 | DE102014102944A1 Eine Package-Anordnung und ein Verfahren zur Herstellung einer Package-Anordnung A package assembly and a method of manufacturing a package assembly |
| 09/11/2014 | DE102014102917A1 Abzugsstrecken Withdrawal routes |
| 09/10/2014 | EP2775808A1 Method for manufacturing substrate having built-in component, and substrate having built-in component manufactured using same |