Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
07/2014
07/03/2014US20140186525 Conductive metal ink composition and method for forming a conductive pattern
07/03/2014US20140186521 Nickel-gold plateable thick film silver paste, and plating process for low temperature co fired ceramic devices and ltcc devices made therefrom
07/03/2014US20140185312 Method and apparatus for implementing optical modules in high temperatures
07/03/2014US20140185259 Packaging substrate, method for manufacturing same, and chip packaging structure having same
07/03/2014US20140185257 Printed circuit board with embedded component and method for manufacturing same
07/03/2014US20140185256 Method of manufacturing module and module
07/03/2014US20140185254 Printed circuit board and method of manufacturing the same
07/03/2014US20140185253 Miniature High Density Opto-Electronic Package
07/03/2014US20140185214 Stacked power module for graphics processing unit
07/03/2014US20140184525 Touch panel and method for manufacturing the same
07/03/2014US20140184358 Baw-filter operating using bulk acoustic waves
07/03/2014US20140183158 Method for improving anisotropy of carbon nanotube film and method for making touch panel
07/03/2014US20140182919 Printed circuit board and method for manufacturing the same
07/03/2014US20140182918 Method of manufacturing module and terminal assembly
07/03/2014US20140182917 Method for forming cavity, apparatus for forming cavity, method for manufacturing circuit board, and circuit board
07/03/2014US20140182916 Circuit board and method of manufacturing the same
07/03/2014US20140182915 Circuit board and method for manufacturing the same
07/03/2014US20140182914 Universal serial bus hybrid footprint design
07/03/2014US20140182913 Packaging substrate and method of fabricating the same
07/03/2014US20140182911 Printed circuit board including embedded electronic component and method for manufacturing the same
07/03/2014US20140182909 Heat transfer device for wave soldering
07/03/2014US20140182904 Printed circuit board and method for manufacturing the same
07/03/2014US20140182900 Rigid-flex printed circuit board and method for making same
07/03/2014US20140182899 Rigid-flexible printed circuit board and method for manufacturing same
07/03/2014US20140182897 Circuit board and method of manufacturing the same
07/03/2014US20140182896 Substrate having electronic component embedded therein and method of manufacturing the same
07/03/2014US20140182895 Multilayered substrate and method of manufacturing the same
07/03/2014US20140182892 Printed circuit board with embedded component and method for manufactruing same
07/03/2014US20140182126 Method for manufacturing wiring board
07/03/2014US20140182125 Temperable electrochromic devices
07/03/2014DE102013111765A1 Vorrichtung zum Verhindern eines Leiterbahnbreitendefekts und Verfahren zum Verhindern eines Leiterbahnbreitendefekts An apparatus for preventing a line width defect, and method for preventing a line width defect
07/03/2014DE102013100016A1 Verfahren zur Herstellung einer elektrisch leitfähigen Struktur auf einem nichtleitenden Trägermaterial sowie ein hierzu bestimmtes Additiv und Trägermaterial A process for producing an electrically conductive pattern on a non-conductive carrier material, and for this purpose a particular additive and support material
07/03/2014DE102012224376A1 Leiterbahnanordnung und Verfahren zu deren Herstellung Interconnect arrangement, and processes for their preparation
07/03/2014DE102012025236A1 Method for applying paste on support material during production of thick film conductors or heating tracks of ceramic heater, involves applying paste on mold by stamper, and transferring paste to workpiece by moving stamper over workpiece
07/02/2014EP2750491A1 Substrate with built-in component and method of manufacturing same
07/02/2014EP2750490A1 Component-mounting printed circuit board and manufacturing method for same
07/02/2014EP2750489A1 Method for dismantling electronic components on a circuit board by fine sand
07/02/2014EP2750488A1 Method for printing thin metal layers in a ceramic layer structure and electronic components contained therein
07/02/2014EP2749374A1 Solder piece, chip solder, and method for manufacturing solder piece
07/02/2014EP2749157A1 Circuit board
07/02/2014EP2749156A1 Sensor with a single electrical carrier means
07/02/2014EP2749155A2 Wiring board in which a component is mounted
07/02/2014EP2749154A1 Metal clad circuit board
07/02/2014EP2749153A1 Electronic textile with means for facilitating waste sorting
07/02/2014EP2749152A1 Electromagnetic interference shielding techniques
07/02/2014EP2747933A1 A mn doped sn-base solder alloy and solder joints thereof with superior drop shock reliability
07/02/2014CN203691768U 一种贴片机装置 A patch machine device
07/02/2014CN203691767U 耐高温可剥蓝胶印制线路板 High temperature can peel blue plastic PCB
07/02/2014CN203691766U 波峰焊焊接托盘结构 Wave soldering pallet structure
07/02/2014CN203691765U 自动贴胶机 Automatic machine gum paste
07/02/2014CN203691764U 一种线路板制程工序辅助传送装置 A circuit board manufacturing process steps auxiliary conveyor
07/02/2014CN203691763U 插框结构 Chassis architecture
07/02/2014CN203691762U 设置吹气装置的分板机 Set scoreboard blowing device
07/02/2014CN203691761U 一种fpc成型机 One kind of machine fpc
07/02/2014CN203691760U 具有软性板的吸附平台装置 Adsorption platform device has a soft board
07/02/2014CN203691759U 高精度印制线路板钻铣定位销钉种植器具 PCB drilling and milling high-precision positioning pin planting equipment
07/02/2014CN203691745U 一种高精度单面线路板 A high-precision single-sided circuit boards
07/02/2014CN203688026U 锡膏添加量测治具 Add paste measurement fixture
07/02/2014CN203683708U 一种柔性印制电路板镀镍金挂具 A flexible printed circuit board linked to a gold-plated nickel
07/02/2014CN203683700U 一种pcb板的电镀槽 Plating tank one kind pcb board
07/02/2014CN203680427U Pcb板回力模冲成型装置 Pcb board back to power punch forming device
07/02/2014CN203679571U 台式点焊机 Desktop spot welder
07/02/2014CN203679570U 可旋转的焊接头结构 A rotatable welding head structure
07/02/2014CN203679469U 设置出料缓冲支架的回流炉 Setting the material buffer bracket reflow oven
07/02/2014CN103907404A 电磁干扰屏蔽技术 Electromagnetic interference shielding technology
07/02/2014CN103907179A 回流膜、焊料凸块形成方法、焊料接合的形成方法以及半导体装置 Reflux film, the solder bump forming method, and a method for forming a solder joint of a semiconductor device
07/02/2014CN103906596A 具有优越的降落冲击可靠性的Mn掺杂的Sn基焊料合金及其焊缝 Superior reliability landing impact Mn-doped Sn-based solder alloy and welds
07/02/2014CN103906380A 一种在pi基板上加成制备多层印制电路板的方法 A method of preparing an addition on a substrate pi multilayer printed circuit board
07/02/2014CN103906379A 一种多层印刷电路板的压合方法 A multilayer printed wiring board lamination method
07/02/2014CN103906378A 承载大电流的电路板的制作方法及承载大电流的电路板 The method of making a large current carrying circuit board and a circuit board carrying a large current
07/02/2014CN103906377A 承载大电流的电路板的制作方法及承载大电流的电路板 The method of making a large current carrying circuit board and a circuit board carrying a large current
07/02/2014CN103906376A 可挠折的电路板及其制作方法 Can scratch off the board and its production method
07/02/2014CN103906375A 软性电路板帮定自动对位方法及机构 Flexible printed circuit board to help set the automatic alignment methods and institutions
07/02/2014CN103906374A 刚挠结合板及其制作方法 Rigid-flex board and its manufacturing method
07/02/2014CN103906373A 承载大电流的电路板的制作方法及承载大电流的电路板 The method of making a large current carrying circuit board and a circuit board carrying a large current
07/02/2014CN103906372A 具有内埋元件的电路板及其制作方法 Board and its production method has buried elements
07/02/2014CN103906371A 具有内埋元件的电路板及其制作方法 Board and its production method has buried elements
07/02/2014CN103906370A 芯片封装结构、具有内埋元件的电路板及其制作方法 Chip package structure with embedded components and circuit board production methods
07/02/2014CN103906369A 电路基板生产线用的电子元件安装设备 Electronic components used in the circuit board production line installation apparatus
07/02/2014CN103906368A 一种贴片机贴装头通用控制系统及其控制方法 A patch machine placement head universal control system and control method
07/02/2014CN103906367A 布线形成装置、维护方法以及布线形成方法 Wiring forming apparatus, maintenance methods and wiring forming method
07/02/2014CN103906366A 一种在pi基板上加成制备双面柔性印制电路的方法 Preparing an addition on the double-sided flexible printed circuit substrate pi method
07/02/2014CN103906365A 一种基于石墨烯的电子电路的制作设备及其制作方法 Production equipment and production methods of a graphene-based electronic circuits
07/02/2014CN103906364A 一种印制电路板中隐埋电阻的加工方法 One of a printed circuit board processing methods buried resistor
07/02/2014CN103906363A 一种用于线路板薄芯材粘贴拖带板的定位板及定位方法 A thin core board pasted towing plate positioning plate and positioning method
07/02/2014CN103906362A 一种手机电容屏挠性印制板的制作方法 A method of making flexible PCB capacitive screen phone
07/02/2014CN103906361A 一种车载挠性印制板的制作方法 A method of making flexible PCB Car
07/02/2014CN103906360A 柔性电路板及其制作方法 Flexible circuit board and its manufacturing method
07/02/2014CN103906359A 电子油墨笔 Electronic ink pen
07/02/2014CN103906356A 用于印刷电路板结构中嵌入器件的系统和方法 A printed circuit board structure of a system and method for embedded devices
07/02/2014CN103906355A 电路板及其制作方法 Board and its production method
07/02/2014CN103906354A 电路板及其制造方法 Circuit board and manufacturing method thereof
07/02/2014CN103906353A 铝基hdi/bum印制电路板及光致蚀刻成孔方法 Aluminum hdi / bum printed circuit board into the hole and light-induced etching method
07/02/2014CN103906352A 厚膜导电合成材料及制备多层电路的方法 A thick film conductive synthetic material and method for preparing a multilayer circuit
07/02/2014CN103906351A 带电路的悬挂基板和其制造方法 And a method for producing the suspension board with circuit
07/02/2014CN103906349A 带沉入式焊盘的印制线路板、该线路板的加工方法、以及加工该线路板时使用的填充凸块板 Sunken PCB pad with the circuit board processing methods, as well as filling bump board when the board process used
07/02/2014CN103906347A 电路板及制作方法 Circuit boards and production methods
07/02/2014CN103906346A 高散热与高导热特性的半导体器件电路基板 High heat and high thermal conductivity characteristics of the semiconductor device circuit board
07/02/2014CN103904050A 封装基板、封装基板制作方法及封装结构 Package substrate, the package substrate fabrication method and package structure
07/02/2014CN103898498A 黑化药水及透明印刷电路板的制作方法 Blackening syrup production method and the transparent printed circuit board
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