Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/2014
08/06/2014EP2761056A2 Layered composite of a substrate film and of a layer assembly comprising a sinterable layer made of at least one metal powder and a solder layer
08/06/2014CN203761695U 一种防止pcb板在压合过程中滑动的装置 A pcb board lamination process, the device prevents sliding
08/06/2014CN203761694U 一种组装发散配光整体透镜的治具 A method of assembling the whole lens diverging light fixture
08/06/2014CN203761693U 一种多转轴pcb板焊接吹风夹紧治具 A multi-plate welding pcb hair shaft clamping fixture
08/06/2014CN203761692U 一种pcb板定位热压治具 One kind of hot pcb board positioning fixture
08/06/2014CN203761691U 一种pcb板定位限行程热压夹紧治具 One kind pcb board positioning clamping fixtures pressing stroke limit
08/06/2014CN203761690U 一种pcb板焊接吹气夹紧治具 One kind of welding pcb board inflatable clamping fixture
08/06/2014CN203761689U 一种fpc装配贴辅材的简易夹具 One kind of simple auxiliary fpc assembly jig stick
08/06/2014CN203761688U 一种火焰检测器灌胶用装置 Glue one kind of flame detector with device
08/06/2014CN203761687U 一种pcb板限位固定冷却治具 Limit one kind pcb board fixed cooling fixture
08/06/2014CN203761686U 一种带有固定缓冲功能的pcb板热压治具 Pcb board pressing jig with a fixed buffer function of
08/06/2014CN203761685U 自动贴导板机 Automatic paste guides machine
08/06/2014CN203761673U 具有二次阻焊保护层的pcb板 Pcb board solder having a secondary protective layer
08/06/2014CN203754831U 一种全自动pcb均匀电镀装置 Even a fully automated electroplating unit pcb
08/06/2014CN203754830U 一种应用于pcb电镀装置的电流导向结构 Applied to the current guide structure pcb plating apparatus
08/06/2014CN203751480U 一种用于回流焊炉的低含氧量进出口通道 Low oxygen levels and export channel for a reflow oven
08/06/2014CN203751476U 一种新型pcb板预热装置 A new pcb board preheating device
08/06/2014CN203751473U 炉膛正面及背面均可打开的回流焊炉 Front and back of the furnace can be opened reflow oven
08/06/2014CN203751472U 喷射式波峰焊机 Jet wave soldering machine
08/06/2014CN103975655A 基板作业装置 Substrate working device
08/06/2014CN103975654A 导电膜形成方法、铜微粒分散体和电路板 A conductive film forming method, a copper microparticle dispersion and the circuit board
08/06/2014CN103975427A 互连衬底的功率管理应用 Power management applications interconnection substrate
08/06/2014CN103975274A 黑色感光性树脂组合物及其利用 Black photosensitive resin composition and use
08/06/2014CN103974601A 电气装置的散热结构及其制造方法 Thermal structure and method of manufacturing an electrical device
08/06/2014CN103974564A Pcb同轴电缆的制作方法及pcb同轴电缆 Pcb coaxial cable coaxial cable and pcb production methods
08/06/2014CN103974563A 印刷电路板的pth镀金方法 Pth gilded method of printed circuit boards
08/06/2014CN103974562A 多层印刷线路板的制作方法及多层印刷线路板 Multilayer printed wiring board fabrication method and multilayer printed circuit boards
08/06/2014CN103974561A 一种超厚铜电路板bga的制作方法 One kind of thick copper circuit board production methods bga
08/06/2014CN103974560A 用于制造半导体模块装置的方法 The method for manufacturing a semiconductor device module
08/06/2014CN103974559A 刚挠结合板及其制作方法 Rigid-flex board and its manufacturing method
08/06/2014CN103974558A 一种刷锡膏装置 Paste one kind of brush device
08/06/2014CN103974557A 对ic载板进行裸晶片贴装的方法及治具 Ic carrier board for bare chip mounting method and fixtures
08/06/2014CN103974556A 一种在焊接前协助对准排针的方法及工具 A pin alignment before welding assistance of methods and tools
08/06/2014CN103974555A 印刷电路板的制作方法和印刷电路板 The method of making a printed circuit board and the printed circuit board
08/06/2014CN103974554A 承载大电流的电路板及其制作方法 Carrying a large current of the circuit board and its manufacturing method
08/06/2014CN103974553A 矩阵式贴片机 Matrix Mounter
08/06/2014CN103974552A 贴片机取料吸嘴 Mounter nozzle Reclaimer
08/06/2014CN103974551A 电路基板传送装置 Circuit board transfer device
08/06/2014CN103974550A 承载大电流的电路板及其制作方法 Carrying a large current of the circuit board and its manufacturing method
08/06/2014CN103974549A 一种电路板线路的制作方法 A method of manufacturing a circuit board traces
08/06/2014CN103974548A 一种掩模板的制作方法 A method of making a mask template
08/06/2014CN103974547A 一种利用喷墨技术的印制电路板制造方法 Printed circuit board manufacturing method using inkjet technology
08/06/2014CN103974546A 承载大电流的电路板及其制作方法 Carrying a large current of the circuit board and its manufacturing method
08/06/2014CN103974545A 一种设置过孔的方法和装置 A method and apparatus are provided vias
08/06/2014CN103974544A 压合板温自动监控测温方法 Laminated board automatic temperature monitoring temperature measurement
08/06/2014CN103974543A 一种基于激光加工的多层柔性电路板微小孔加工工艺 A laser processing of a multilayer flexible circuit board based on micro-hole processing
08/06/2014CN103974542A 基板固定装置、基板作业装置以及基板固定方法 Substrate fixing means, the substrate and the substrate operation means fixing method
08/06/2014CN103974541A 金属线路的制作方法和印刷电路板 The method of manufacturing a metal wiring and printed circuit boards
08/06/2014CN103974539A 集成电路贴片及其制造方法 IC placement and manufacturing method thereof
08/06/2014CN103974536A 陶瓷层叠元器件 Layered ceramic components
08/06/2014CN103974531A 一种印刷电路板的制作方法、印刷电路板及电子器件 A method of manufacturing a printed circuit board, printed circuit boards and electronic devices
08/06/2014CN103974530A 大电流电路板的制作方法及其输入输出端子 The method of making large-current circuit board and input and output terminals
08/06/2014CN103974522A 布线基板及其制造方法 Wiring board and manufacturing method thereof
08/06/2014CN103974521A 多层线路板以及其制造方法 Multilayer wiring board and its manufacturing method
08/06/2014CN103969947A 碱显影型感光性树脂组合物、其干膜及其固化物以及使用其而形成的印刷电路板 Alkali developable photosensitive resin composition, and the use of dry film and cured product which is formed of a printed circuit board
08/06/2014CN103966647A 电镀槽挡水吸水装置 Plating tank retaining suction device
08/06/2014CN103966601A 非金属基体导电线路的制作方法及其产品 Non-metallic conductive matrix forming method and product lines
08/06/2014CN103962714A 环境温度的球焊接头 Ambient temperature solder ball head
08/06/2014CN102811560B 一种高低频混压印制电路板的制备方法 A high frequency mixed pressure preparation of printed circuit boards
08/06/2014CN102625574B 一种低介电常数pcb基板及其制造方法 A low dielectric constant substrate and manufacturing method pcb
08/06/2014CN102595794B 一种软性电路板压接设备 A soft board crimping equipment
08/06/2014CN102548226B 一种柔性线路加工中折皱现象的处理工艺 A flexible line processing blushing treatment process
08/06/2014CN102523701B 一种阶梯凸台vip孔树脂塞孔板制作方法 One kind of ladder boss vip orifice plug hole resin production methods
08/06/2014CN102523690B 一种盲槽内含有ic脚的pcb板制作方法 Pcb board production method of a blind tank containing ic foot
08/06/2014CN102460685B 半导体封装件以及该半导体封装件的安装构造 Structure for mounting the semiconductor package and the semiconductor package
08/06/2014CN102443136B 感光性树脂、固化性树脂组合物、干膜以及印刷电路板 Photosensitive resin, the curable resin composition, and a printed circuit board dry film
08/06/2014CN102438399B 一种金属基pcb板无间距拼板及其切割方法 No metal base pcb board spacing and cutting methods puzzle
08/06/2014CN102422729B 电路基板及其制造方法 Circuit board and manufacturing method thereof
08/06/2014CN102387660B 一种金属基pcb板及其制造方法 Metal base pcb board and its manufacturing method
08/06/2014CN102277124B 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置 Adhesive composition, a circuit connecting material, a circuit member connection structure and a semiconductor device
08/06/2014CN102131346B 线路板及其制作方法 Circuit board and its manufacturing method
08/06/2014CN101980861B 用于降低半导体加工期间挠性基材的翘曲度和弯曲度的组件和方法 Components and methods for reducing warpage during semiconductor processing and bending of the flexible substrate
08/06/2014CN101885096B 锡焊装置 Soldering equipment
08/05/2014US8796848 Circuit board and chip package structure
08/05/2014US8796847 Package substrate having main dummy pattern located in path of stress
08/05/2014US8796556 Flakes made of materials such as glass
08/05/2014US8796158 Methods for forming circuit pattern forming region in an insulating substrate
08/05/2014US8796145 Method of manufacturing metal-base substrate and method of manufacturing circuit board
08/05/2014US8796112 Geometry and design for conformal electronics
08/05/2014US8795815 Laminated structure
08/05/2014US8794797 Hybrid illuminator
08/05/2014US8794499 Method for manufacturing substrate
08/05/2014US8793868 Chip embedded substrate and method of producing the same
07/2014
07/31/2014WO2014116534A1 Micro-wire pattern for electrode connection
07/31/2014WO2014113937A1 Flexible conductive ink
07/31/2014US20140211444 Discrete component assembly
07/31/2014US20140211441 Wireless apparatus and method for manufacturing same
07/31/2014US20140211439 Circuit assembly
07/31/2014US20140211438 Methods and Apparatus for Transmission Lines in Packages
07/31/2014US20140211437 Component built-in board mounting body and method of manufacturing the same, and component built-in board
07/31/2014US20140209582 Systems and methods for forming apertures in microfeature workpieces
07/31/2014US20140209563 Achieving greater planarity between upper surfaces of a layer and a conductive structure residing therein
07/31/2014US20140209371 Printed circuit board having orthogonal signal routing
07/31/2014US20140209370 Pcb having offset differential signal routing
07/31/2014US20140209361 Wiring board and method for manufacturing the same
07/31/2014US20140209356 Multilayer wiring substrate, probe card, and method for manufacturing multilayer wiring substrate
07/31/2014US20140208590 Process for manufacturing a printed circuit board having high density microvias formed in a thick substrate
07/31/2014US20140208588 Method for manufacturing an electronic module and an electronic module
07/31/2014US20140208587 Electronic component mounting line and electronic component mounting method
07/31/2014DE10225680B4 Herstellverfahren für eine Metallschicht sowie Herstellverfahren für ein laminiertes keramisches Elektronikbauelement Production method for a metal layer and manufacturing method for a laminated ceramic electronic component
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