Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
07/2014
07/23/2014CN203734931U Smt专用治具 Smt special fixture
07/23/2014CN203734930U 简易smt贴片固化箱 Simple smt chip curing box
07/23/2014CN203734929U 简易贴片贴装装置 Simple SMD placement apparatus
07/23/2014CN203734928U 一种smt压紧装置 One kind smt clamping device
07/23/2014CN203734927U 一种smt用治具 One kind smt with fixture
07/23/2014CN203734926U 贴片快速压紧装置 Chip Quick clamping device
07/23/2014CN203734925U Smt自动清洁pcb装置 Smt pcb automatic cleaning device
07/23/2014CN203734924U 高可靠性传感器贴背胶的装置 High reliability sensor device gum paste
07/23/2014CN203734923U 柔性线路板的背胶贴合装置 Flexible circuit board adhesive bonding device
07/23/2014CN203734922U 柔性线路板的覆盖膜偏移检测系统 Flexible circuit board covered with membrane offset detection system
07/23/2014CN203734921U Pcb自动打码扫码除静电传输机构 Pcb automatic coding scan code in addition to static transmission mechanism
07/23/2014CN203734920U 一种pcb除静电扫码传输机构 One kind pcb addition to static scan code transmission mechanism
07/23/2014CN203734919U 一种pcb除静电冷却传输机构 One kind of transport mechanism pcb addition to static cooling
07/23/2014CN203734918U 一种pcb冷却输送机构 One kind of transport mechanism pcb cooling
07/23/2014CN203734917U Pcb自动打码扫码装置 Pcb automatic coding device scan code
07/23/2014CN203728947U 一种pcb电镀铜缸 One kind of pcb plated copper cylinder
07/23/2014CN203725976U 一种新型本压机 A novel of the press
07/23/2014CN103947307A 布线电路、布线基板及布线基板的制造方法 The method of manufacturing a wiring circuit, the wiring substrate and the wiring substrate
07/23/2014CN103947306A 包覆金属的柔性基材、用于制备包覆金属的柔性基材的方法、印刷线路板、多层柔性印刷线路板和柔性-刚性印刷线路板 Flexible substrate coated with metal, the method for the preparation of flexible substrates coated metals, printed circuit boards, multilayer flexible printed circuit boards and flexible - rigid printed circuit boards
07/23/2014CN103947305A 导电图案形成方法以及通过光照射或微波加热来形成导电图案的导电图案形成用组合物 The composition for forming a conductive pattern forming method and a conductive pattern formed by a conductive pattern by light irradiation or microwave heating
07/23/2014CN103947304A 导电图案形成方法以及通过光照射或微波加热来形成导电图案的导电图案形成用组合物 The composition for forming a conductive pattern forming method and a conductive pattern formed by a conductive pattern by light irradiation or microwave heating
07/23/2014CN103947303A 导电图案形成方法 A conductive pattern forming method
07/23/2014CN103946262A 含羧基树脂、阻焊剂用树脂组合物和含羧基树脂的制造方法 Carboxyl group-containing resin, a solder resist resin composition and a method for producing carboxyl group-containing resin,
07/23/2014CN103945683A 对电路基板作业系统 Operating system on a circuit board
07/23/2014CN103945660A 一种多层电路板的生产工艺 A production process of a multilayer circuit board
07/23/2014CN103945659A 一种六层铜基电路板制作方法 One kind of six copper-based circuit board production methods
07/23/2014CN103945658A 一种制作金属化半孔板的方法 Metal plates made by the method of semi-
07/23/2014CN103945657A 一种在印制电路板上制作铜柱的方法 A printed circuit board manufacture copper pillar approach
07/23/2014CN103945656A 一种有树脂塞孔及沉头孔的双面铝基板制作方法 A double-sided aluminum plate resin plug holes and spigot production methods
07/23/2014CN103945655A 全自动贴片机 Automatic placement machine
07/23/2014CN103945654A 钝化线路板非金属化孔中残留钯离子的方法及此方法制备的线路板 PCB board passivation holes remaining in the non-metallic palladium ions preparation method and this method
07/23/2014CN103945653A 柔性线路板印刷的多自由度平台的自动校正方法 Automatic calibration method of the flexible printed circuit board platform for multi-degree of freedom
07/23/2014CN103945652A 一种柔性电路板的制造方法 A method of manufacturing a flexible circuit board
07/23/2014CN103945651A 电路板的制造方法 The method of manufacturing a circuit board
07/23/2014CN103945650A 高密度互联线路板基板镭射钻孔的方法 The method of high-density interconnect PCB substrate laser drilling
07/23/2014CN103945649A 一种用于柔性电路板的胶片自动贴敷设备 A flexible circuit board of the automatic film sticking apparatus
07/23/2014CN103945648A 一种高频电路板生产工艺 A high-frequency circuit board production process
07/23/2014CN103945647A 一种线路板压合时盲槽底部凸起去除方法 Line the bottom of a blind slot raised pressure plate timely removal method
07/23/2014CN103945644A 齐平线路板及其制作方法 Flush with the board and its manufacturing method
07/23/2014CN103945643A 一种透明电路膜片及其制备方法 A transparent circuit membrane and preparation method
07/23/2014CN103945642A 布线电路基板及其制造方法 The method of manufacturing a wiring circuit board and
07/23/2014CN103945641A 高导热线路板及其制作方法 High thermal circuit board and manufacturing method thereof
07/23/2014CN103945640A 防静电线路板及其制作方法 Anti-static board and its production method
07/23/2014CN103945639A 一种pcb保护片层及其生产工艺 One kind of protective sheet layer pcb and its production process
07/23/2014CN103934537A 一种pcb板上插件焊接工艺及焊接载具 One kind pcb board plug-welding technology and welding vehicle
07/23/2014CN102638946B 一种印制线路板层间铜连接的制作工艺 An inter-layer printed circuit board production process of copper connections
07/23/2014CN102597319B 催化剂赋予溶液以及使用其的非电解镀敷方法及直接镀敷方法 The catalyst solution and the use thereof to give an electroless plating method and the direct plating method
07/23/2014CN102573292B 一种内埋置电阻器的印刷电路板及其制造方法 An internal resistor embedded printed circuit board and its manufacturing method
07/23/2014CN102548247B 一种软硬结合板制造方法 One kind Flex PCB manufacturing method
07/23/2014CN102438436B 元件逐个送料机构 Element-by-feeding mechanism
07/23/2014CN102438409B 切锡送锡一体化贴片机喂料设备 Cut integration Mounter send tin tin feeding equipment
07/23/2014CN102301836B 产生印制或涂布功能件用基板的方法、基板、功能装置及其用途 Printing or coating a functional element produced by the method of the substrate, the substrate, functional devices and use thereof
07/23/2014CN102272185B 含羧基的聚氨酯 Carboxyl group-containing polyurethane
07/23/2014CN102098884B 标准压合板的制作方法及标准压合板 Standard production methods and standards laminated board laminated board
07/23/2014CN102053092B 布线电路基板的检查方法、制造方法和检查装置 Check method of a wired circuit board manufacturing method and inspection apparatus
07/22/2014US8786510 Radio frequency (RF) antenna containing element and methods of making the same
07/22/2014US8784974 Sub-10 NM line features via rapid graphoepitaxial self-assembly of amphiphilic monolayers
07/22/2014US8784953 Method of forming a conductive image on a non-conductive surface
07/22/2014US8784952 Method of forming a conductive image on a non-conductive surface
07/22/2014US8784638 Resin board to be subjected to ozone treatment, wiring board, and method of manufacturing the wiring board
07/22/2014US8784634 Electrolytic method for filling holes and cavities with metals
07/22/2014US8782882 Method of manufacturing multi-layer printed circuit board
07/22/2014US8782881 Mounting method for mounting a circuit board in a housing and associated mounting tool
07/22/2014CA2599137C Electrical components and circuits constructed as textiles
07/18/2014DE202013101614U1 Halter zum Niederhalten oder Auflegen einer zu prüfenden Platine in einer Prüfanordnung Holder for holding or placing a board to be tested in a test set
07/17/2014WO2014110247A1 Integrated circuit module
07/17/2014WO2014049340A3 Method and apparatus for improving selective soldering
07/17/2014US20140199533 Adhesive film, multilayer printed wiring board using adhesive film, and method for manufacturing multilayer printed wiring board
07/17/2014US20140199473 Apparatus and method for providing an embedded structure and for providing an electro-optical device including the same
07/17/2014US20140198469 Electronic circuit, light source device, and method of manufacturing electronic circuit
07/17/2014US20140198463 Printed circuit board and magnetic field or current sensor
07/17/2014US20140198266 Touch screen panel and method for manufacturing the same
07/17/2014US20140197914 Transformer assemblies with moveable terminal blocks
07/17/2014US20140197904 Method for Fabricating Miniature Structures or Devices such as RF and Microwave Components
07/17/2014US20140197827 XMR-Sensor and Method for Manufacturing the XMR-Sensor
07/17/2014US20140197537 Void-Free Metallic Filled High Aspect Ratio Openings
07/17/2014US20140197131 Fluid oscillations on structured surfaces
07/17/2014US20140197037 Treatment method of electrodeposited copper for wafer-level-packaging process flow
07/17/2014US20140196944 Method for producing a receptacle for a sensor element
07/17/2014US20140196940 Through mold via relief gutter on molded laser package (mlp) packages
07/17/2014US20140196939 Wiring board
07/17/2014US20140196935 Ceramic substrate and process for producing same
07/17/2014US20140196283 Press cushion
07/17/2014DE102014100236A1 Verfahren zum Herstellen eines Halbleiter-Chippanels A method of manufacturing a semiconductor chip Panels
07/17/2014DE102013200697A1 Verfahren zur Herstellung von strukturierten elektrischen Trägermaterialien A process for producing patterned electrical carrier materials
07/17/2014DE102010046930B4 Verfahren zur Oberflächenmontage A method of surface mounting
07/17/2014DE102009033321B4 Leistungshalbleitervorrichtung Power semiconductor device
07/17/2014DE102009022299B4 Verfahren und Vorrichtung zum Aufbringen eines elektronischen Bauelements auf ein Substrat Method and apparatus for applying an electronic component to a substrate
07/16/2014EP2755456A1 Assembly having a flexible circuit board and a heat sink
07/16/2014EP2754732A1 Aqueous composition for etching of copper and copper alloys
07/16/2014EP2754340A2 Conductor track unit for a motor vehicle
07/16/2014EP2754202A1 Barrier layer dielectric for rfid circuits
07/16/2014EP2754169A1 Soldering relief method and semiconductor device employing same
07/16/2014CN203722939U 适用于线束元器件的波峰焊治具 Harness components suitable for wave soldering fixture
07/16/2014CN203722938U 用于贴片机的智能电动喂料器 For smart electric feeder placement machine
07/16/2014CN203722937U 用于贴片机的带有传感器的智能电动喂料器 For placement machine intelligent electric feeders with sensors
07/16/2014CN203722936U 连接器组装机 Connector assembly machine
07/16/2014CN203722935U 一种吸嘴结构 One kind of nozzle structure
07/16/2014CN203722934U 一种用于柔性电路板沉金作业的辅助治具 Auxiliary fixture for flexible circuit board immersion gold operations
07/16/2014CN203722933U 一种电路板夹具 A circuit board fixture
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