Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
07/2014
07/09/2014CN203708648U 一种ccd滑台式分拣系统 One kind ccd sliding desktop sorting system
07/09/2014CN203708647U 一种用于pcb板防焊对位的装置 A device on a bit of solder pcb board for
07/09/2014CN203708646U 一种基板强碱退洗槽 A substrate alkali wash tank back
07/09/2014CN203708645U 一种薄板电镀药水槽 One kind of drug thin plating tank
07/09/2014CN203708644U 一种用于pth制程的pcb薄板载具 Pcb sheet for pth process of carrier
07/09/2014CN203708643U Pcb板托盘 Pcb board tray
07/09/2014CN203708642U Pcb板更换装置 Pcb board replacement device
07/09/2014CN203708641U 高孔位精度要求的线路板及其实现装置 Board and its implementation means high accuracy requirements holes
07/09/2014CN203708640U 一种电路板微调纠偏装置 A circuit board trimming corrective devices
07/09/2014CN203708639U 采用液晶高分子聚合物材料的柔性线路板的压合结构 Laminated structure using liquid crystal polymer material is flexible circuit board
07/09/2014CN203708630U 丝网印刷灌孔的上下层线路导通结构 Conduction structure on the lower line screen printing filling holes
07/09/2014CN203708629U 一种经拉丝处理的铝基覆铜板 One kind of brushed aluminum by CCL
07/09/2014CN203706834U 一种防爆隔离变压器 One kind of isolation transformer explosion
07/09/2014CN203700519U 用于薄板沉镍金的挂篮 Nickel plate hanging basket for gold
07/09/2014CN103918357A 用以制作具有金属间化合物及相关电路板的多层电路板的方法 Method for the production of an intermetallic compound having a circuit board and associated multilayer circuit board
07/09/2014CN103918356A 元器件内置基板的制造方法以及使用该方法制成的元器件内置基板 The method of manufacturing the component-embedded board and the method using a component-embedded substrate made
07/09/2014CN103918071A 电子部件、集合基板及电子部件的制造方法 Manufacturing an electronic component, the collective substrate and the electronic component
07/09/2014CN103918045A 用于制作电感应器和相关感应器装置的方法 Production of electrical sensors and associated method for sensing means
07/09/2014CN103917582A 热塑性液晶聚合物薄膜以及使用其的层叠体和电路基板 The thermoplastic liquid crystal polymer film and the use thereof in the laminate and the circuit board
07/09/2014CN103917062A 多层线路板叠加定位的方法 Multi-layer circuit board superimposed positioning method
07/09/2014CN103917061A 半涂覆铜的pcb通孔的制备方法及pcb板 Preparation and pcb pcb through-hole semi-coated copper plate
07/09/2014CN103917060A 一种印刷电路板板件塞孔制作方法 A printed circuit fabrication method jack plate board member
07/09/2014CN103917059A 一种印刷线路板盲孔制造方法及其结构 A printed wiring board manufacturing method and structure of the blind hole
07/09/2014CN103917058A 插接手指类柔性电路板的制造方法 Plug type method for producing a flexible circuit board finger
07/09/2014CN103917057A 一种印刷线路板小开窗焊盘的制作方法 Method of making a printed wiring board pads small fenestration
07/09/2014CN103917056A 一种焊接工艺和电路板 A welding process and circuit board
07/09/2014CN103917055A 基于机器视觉的触摸板贴合对位系统 Based on machine vision alignment system touchpad fit
07/09/2014CN103917054A 一种电子器件或者电路图的制备方法 Method for preparing a circuit diagram of an electronic device or
07/09/2014CN103917053A 镍作为碱性蚀刻抗蚀层材料的应用 Nickel as an alkaline etching resist layer material applied
07/09/2014CN103917052A 一种用激光直接成型技术加工电路板的方法 One kind of direct molding technique using laser machining methods board
07/09/2014CN103917051A 电路宽度变细缺陷防止装置及方法 Apparatus and method for a circuit defect prevent narrowing of the width
07/09/2014CN103917050A 一种pcb板特殊器件手工印刷方法 One kind of special devices pcb board manual printing method
07/09/2014CN103917049A 一种采用次外层芯材减铜的激光钻孔板加工方法 One kind of using sub-outer core drilling laser cut copper plate processing method
07/09/2014CN103917048A 一种柔性电路板的制作方法及柔性电路板 A method of manufacturing a flexible circuit board and the flexible circuit board
07/09/2014CN103917047A 一种电路板制造工艺和电路板 A circuit board manufacturing process and circuit board
07/09/2014CN103917046A 包含盲孔的线路板及其制作方法 Circuit board contains blind holes and production methods
07/09/2014CN103917045A 印刷电路板及其制造方法 A printed circuit board and manufacturing method thereof
07/09/2014CN103917044A 一种柔性电路板及其制造方法 A flexible circuit board and manufacturing method thereof
07/09/2014CN103917041A 一种柔性电路板及其制作方法 A flexible circuit board and its manufacturing method
07/09/2014CN103917040A 电路基板、电路基板的制造方法和电子组件 The method of manufacturing a circuit board and electronic components, circuit board
07/09/2014CN103915684A 一种导电线路、手机天线的制备方法及手机天线 A conductive line, preparation and cell phone antenna cell phone antenna
07/09/2014CN103914195A 一种电容触摸屏线路成型的制作方法 A method of making a capacitive touch screen lines forming
07/09/2014CN102792226B 感光性树脂组合物、干膜以及印刷电路板 The photosensitive resin composition, and a printed circuit board dry film
07/09/2014CN102647862B 一种采取不同电流参数组合的电镀填盲孔方法 Take a blind hole plating method to fill the current parameters of different combinations
07/09/2014CN102576584B 使用铜类纳米颗粒高浓度分散液的导体膜及其制造方法 Conductor film and manufacturing method using the copper-based nanoparticle dispersion liquid of high concentration
07/09/2014CN102510670B 制造柔性电路板的方法及工具 Methods and tools manufacturing flexible circuit board
07/09/2014CN102481598B 介电材料、由其形成子组件的方法以及由此形成的子组件 The method of dielectric material, forming the sub-assembly and its sub-assembly thus formed
07/09/2014CN102469700B 制作电路板的方法及电路板 The method of making a circuit board and circuit board
07/09/2014CN102415227B 陶瓷多层基板的制造方法 The method of manufacturing a ceramic multilayer substrate
07/09/2014CN102365723B 部件的布置方法 Layout of components
07/09/2014CN102348527B 激光加工方法以及激光加工装置 The laser processing method and laser processing apparatus
07/09/2014CN102348336B 一种对电路板导电孔进行树脂塞孔的方法 One kind of holes on the circuit board conductive resin plug hole method
07/09/2014CN102334389B 连接单元 Connection unit
07/09/2014CN102101215B 具有激光束分析器的激光加工装置 The laser processing apparatus having a laser beam analyzer
07/09/2014CN102036485B 喷淋装置以及药水槽 Sprinklers and medicine sink
07/09/2014CN101677492B 一种pcb板的制作工艺 Production process for pcb board
07/09/2014CN101320212B 光固化性热固化性树脂组合物及使用其得到的印刷电路板 Photocurable and thermosetting resin composition and the use thereof to obtain a printed circuit board
07/08/2014US8773865 Electronic circuit module and method of making the same
07/08/2014US8771495 Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers
07/08/2014US8770462 Solder paste transfer process
07/08/2014US8770017 Method of manufacturing a molded sensor subassembly
07/08/2014US8769812 Propagating pin corrections through physically mating devices
07/08/2014US8769811 Method of shielding an electronic component from electromagnetic interference (EMI)
07/08/2014US8769810 Part mounting method
07/08/2014US8769809 Method for mounting a component
07/08/2014US8769808 Method for fixed and replaceable module architecture
07/08/2014CA2522694C Printed circuit device with integrated antenna and implantable sensor processing system with integrated printed circuit board antenna
07/04/2014DE202014004191U1 Reinigungsanlage in Kombination mit Veredelungsanlage Cleaning system in combination with upgrading facility
07/03/2014WO2014105435A1 Geometrics for improving performance of connector footprints
07/03/2014WO2014104860A1 Flexible printed circuit board and method for manufacturing same
07/03/2014WO2014104654A1 Printed circuit board, and method for manufacturing same
07/03/2014WO2014104559A1 Led heat-dissipation flexible module using carbon fiber substrate and method for manufacturing same
07/03/2014WO2014104328A1 Layered body with support substrate, method for fabricating same, and method for fabricating multi-layer wiring substrate
07/03/2014WO2014104300A1 Wiring board, electronic device, and light-emitting device
07/03/2014WO2014104218A1 Method for manufacturing circuit board to which electronic component is joined
07/03/2014WO2014104154A1 Desmearing method and desmearing device
07/03/2014WO2014104053A1 Conductive paste for screen printing, method for producing wiring line, and method for producing electrode
07/03/2014WO2014103946A1 Gas-blowing-hole array structure and soldering device
07/03/2014WO2014103945A1 Gas-intake-hole array structure and soldering device
07/03/2014WO2014103923A1 Insulating sheet, wiring substrate, touch panel
07/03/2014WO2014103772A1 Circuit board
07/03/2014WO2014103637A1 Adhesive agent, adhesive film, and semiconductor device and method for manufacturing same
07/03/2014WO2014103541A1 Electronic component and method for manufacturing same
07/03/2014WO2014103530A1 Substrate with built-in component
07/03/2014WO2014103516A1 Photosensitive resin composition, photosensitive film, and method for forming resist pattern
07/03/2014WO2014103510A1 Multilayer substrate and manufacturing method for same
07/03/2014WO2014103370A1 Component mounting apparatus, component mounting system, and component mounting method
07/03/2014WO2014103262A1 Paste transfer unit, electronic component mounting device, and transferred film thickness measuring method
07/03/2014WO2014103032A1 Screen printer
07/03/2014WO2014102904A1 Printing method, printing device, and production method for solar cell using same
07/03/2014WO2014102903A1 Printing method, printing device, and production method for solar cell
07/03/2014WO2014102054A1 Conductor track arrangement and method for the production thereof
07/03/2014WO2014101707A1 Recording apparatus for reflow soldering machine and reflow soldering machine
07/03/2014WO2014101705A1 Temperature control method for reflow soldering machine
07/03/2014WO2014101050A1 Electronic component, power amplifier, and transceiver
07/03/2014WO2014100848A1 Semi-finished product for the production of a printed circuit board and method for producing the same
07/03/2014WO2014100845A1 Printed circuit board
07/03/2014US20140187112 Prepreg, method for manufacturing the same, and copper clad laminate using the same
07/03/2014US20140186651 Printed circuit board having copper plated layer with roughness and method of manufacturing the same
07/03/2014US20140186581 Primer-coated copper foil having superior adhesive strength and method for producing the same
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