Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/2014
05/22/2014WO2014077119A1 Wiring substrate and electronic device using same
05/22/2014WO2014076989A1 Method for manufacturing printed circuit board and surface treatment device for same
05/22/2014WO2014076969A1 Electronic-component-mounting system and electronic-component mounting method
05/22/2014WO2014076968A1 Electronic component mounting system
05/22/2014WO2014076779A1 Method for production of embedded board
05/22/2014WO2014076233A1 Angle-adjustable and/or angled printed circuit board structure having at least two printed circuit board sections and method for producing same
05/22/2014WO2014075758A1 Video endoscope and method for production thereof
05/22/2014WO2014075559A1 Multi-layer thick copper circuit board manufacturing method and dual-side thick copper circuit board manufacturing method
05/22/2014WO2014075251A1 Printed circuit board, component and circuit assembly
05/22/2014US20140141572 Semiconductor assemblies with multi-level substrates and associated methods of manufacturing
05/22/2014US20140141238 Process for producing conductive coating film, and conductive coating film
05/22/2014US20140141156 Method of forming electric wiring using inkjet printing
05/22/2014US20140141155 Method of forming electric wiring using inkjet printing and inkjet printing apparatus
05/22/2014US20140140019 Display apparatus and method of manufacturing the same
05/22/2014US20140139319 Remotely Readable Input Forms
05/22/2014US20140138635 Stretchable base plate, stretchable organic light-emitting display device using the same, and method of manufacturing the stretchable base plate and the stretchable organic light emitting display device
05/22/2014US20140138345 Methods of forming conductive patterns using inkjet printing methods
05/22/2014US20140138253 Composition and method for the deposition of conductive polymers on dielectric substrates
05/22/2014US20140138142 Interposed substrate and manufacturing method thereof
05/22/2014US20140138139 Multilayer wiring board and method for manufacturing the same
05/22/2014US20140138132 Printed circuit board and manufacturing method thereof
05/22/2014US20140138131 Conductive trace hiding materials, articles, and methods
05/22/2014US20140138129 Substrate having a low coefficient of thermal expansion (cte) copper composite material
05/22/2014US20140138126 Method of manufacturing multilayer printed wiring board and multilayer wiring board obtained thereby
05/22/2014US20140138125 Circuit board and method of manufacturing the same, touch panel sensor sheet and screen printing plate
05/22/2014US20140138124 Method of manufacturing an electronic high-current circuit by means of gas injection technology and sealing with an insulating polymer
05/22/2014US20140138027 Method and system for depositing an object onto a wiring board
05/22/2014US20140137402 Sensor Device and Method for Manufacture
05/22/2014DE102012221002A1 Abwinkelbare und/oder abgewinkelte Leiterplattenstruktur mit zumindest zwei Leiterplattenabschnitten und Verfahren zu deren Herstellung Be angled and / or bent circuit board structure comprising at least two circuit board portions, and methods for their preparation
05/22/2014DE102012106135A1 Baluns for use in amplifier unit of high frequency amplifier of e.g. base station of radio system, have layered structure provided with underside that is connected to temperature heat sink element directly or indirectly over metallic layer
05/22/2014DE102012022669A1 Selektiv-Lötanlage Selective soldering
05/21/2014EP2732883A1 Droplet discharge device and method
05/21/2014EP2732680A1 Method of manufacturing a printed circuit board or a sub-assembly thereof as well as printed circuit board or a sub-assembly thereof and use thereof
05/21/2014CN203608466U 半固化片自动叠料装置 Prepreg stack automatic feeding device
05/21/2014CN203608465U 电路板移植结构 Board structure of the transplanted
05/21/2014CN203608464U 一种bga芯片焊盘印刷锡膏定位治具 One kind of bga chip pad printing paste positioning fixture
05/21/2014CN203608463U 贴片机平台及贴片机 Placement machine platform and Mounter
05/21/2014CN203608462U 全自动高速插针机 High-speed automatic pin machine
05/21/2014CN203608461U 一种免焊压接电子产品的拔出治具 A no-solder electronic products crimp pull Fixture
05/21/2014CN203608460U 手机pcba多联板分板生产线 Phone pcba multi-board sub-board production line
05/21/2014CN203608459U 刮风嘴检测装置及具有该装置的涂布机烘箱 Wind detecting means and the mouth of an oven having a coater of the apparatus
05/21/2014CN203608458U 软性pc电路板补强钢片自动冲切编带式包装一体化设备 Flexible pc board reinforcing steel automatic punching taping packaging equipment integration
05/21/2014CN203608457U 一种承载装置、承载组件以及传送装置 A carrying device, and transmitting means bearing assembly
05/21/2014CN203608452U Smt减法高密度封装多层线路板结构 Smt subtraction high-density packaging multilayer circuit board structure
05/21/2014CN203608451U Smt加法高密度封装多层线路板结构 Smt the addition of high-density packaging multilayer circuit board structure
05/21/2014CN203608443U 印刷电路和包括该印刷电路的电子模块 Printed circuits and printed circuit comprising an electronic module
05/21/2014CN203602744U Pcb薄板电镀夹具 Pcb sheet plated fixtures
05/21/2014CN103814630A 用于传输差分信号的通孔结构 Via structure for transmission of differential signals
05/21/2014CN103814629A 电子组件及其制造方法 Electronic components and its manufacturing method
05/21/2014CN103814627A 用于将嵌入的芯片连接到印刷电路板中的方法和设备 Embedding the chip for connecting to a method and apparatus for a printed circuit board
05/21/2014CN103813659A 印刷电路板的制造方法 The method of manufacturing a printed circuit board
05/21/2014CN103813658A 多层厚铜电路板的制作方法及双面厚铜电路板的制作方法 Production method of making a multilayer thick copper circuit boards and double-thick copper circuit board
05/21/2014CN103813657A 形成有局部镀铜的柔性印刷基板的厚度最小化方法 Local thickness of a flexible printed circuit board copper minimization method of forming
05/21/2014CN103813656A 一种能够承载大电流的电路板及其加工方法 Capable of carrying large current board and the processing method
05/21/2014CN103813655A 一种提高含焊垫结构的印刷电路板信赖性的制作方法 Method for improving the structure containing a pad of a printed circuit board manufacturing method of the trust
05/21/2014CN103813654A 印刷电路板及其塞孔方法 Printed circuit board and plug hole method
05/21/2014CN103813653A 一种盲孔加工方法 Blind hole machining method
05/21/2014CN103813652A 一种盲孔的加工方法 A blind hole machining method
05/21/2014CN103813651A 一种覆铜板的制造方法 Manufacturing method of a CCL
05/21/2014CN103813650A 一种能够承载大电流的电路板及其加工方法 Capable of carrying large current board and the processing method
05/21/2014CN103813649A 一种能够承载大电流的电路板及其加工方法 Capable of carrying large current board and the processing method
05/21/2014CN103813648A 一种能够承载大电流的电路板及其加工方法 Capable of carrying large current board and the processing method
05/21/2014CN103813647A 一种能够承载大电流的电路板及其加工方法 Capable of carrying large current board and the processing method
05/21/2014CN103813646A 一种能够承载大电流的电路板及其加工方法 Capable of carrying large current board and the processing method
05/21/2014CN103813645A 一种高速多功能smt贴片机的自动送板装置及控制方法 An automatic feeding device and method for controlling board smt chip high-speed multifunction machine
05/21/2014CN103813644A Oled柔性电路板真空吸附装置 Oled flexible circuit board vacuum suction device
05/21/2014CN103813643A 部件的粘贴装置及粘贴方法 Paste apparatus and paste method components
05/21/2014CN103813642A 在绝缘金属基板上形成导电线路的方法 The method of forming a conductive line on the insulated metal substrate
05/21/2014CN103813641A 非导电载体上的导体轨道的制造方法 The method of manufacturing a non-conductive conductor tracks on the carrier
05/21/2014CN103813640A 一种全印制电路板及其制造方法 A fully printed circuit board and its manufacturing method
05/21/2014CN103813639A 在柔性基板上形成导电线路的方法 The method of forming a conductive line on the flexible substrate
05/21/2014CN103813638A 用于制造印刷电路板的方法 The method for manufacturing a printed circuit board
05/21/2014CN103813637A 一种能够承载大电流的电路板及其加工方法 Capable of carrying large current board and the processing method
05/21/2014CN103813634A 具有埋入式连接杆的电路板及其制造方法 The method of manufacturing a circuit board having embedded connecting rod
05/21/2014CN103813632A 电路板封装结构及其制造方法 Board packaging structure and manufacturing method
05/21/2014CN103813631A 布线基板和布线基板的制造方法 The method of manufacturing a wiring substrate and a printed circuit board
05/21/2014CN103813630A 复合布线板及复合布线板的制造方法 Method of manufacturing a composite wiring board and the composite wiring board
05/21/2014CN103813629A 配线材料及其制造方法 Wiring Materials and Methods
05/21/2014CN103813628A 带电路的悬挂基板集合体板及其制造方法 A substrate assembly with circuit board and its manufacturing method of a suspension
05/21/2014CN103813622A 电路板及其制造方法 The circuit board and its manufacturing method
05/21/2014CN103813621A 电路板和该电路板的制造方法 And a method of manufacturing a circuit board of the circuit board
05/21/2014CN103813620A 复合布线板 Composite wiring board
05/21/2014CN103813617A 线路板及其制作方法与具有此线路板的光电装置 Board and its production method and has a photoelectric device for this circuit board
05/21/2014CN103813616A 复合式叠构覆盖膜及具有该覆盖膜的电路板及其制法 Composite film having a stacked structure of the cover film covering the circuit board and its preparation method
05/21/2014CN103813612A 覆金属层叠板、印制电路板、多层印制电路板 Metal clad laminated boards, printed circuit boards, multilayer printed circuit boards
05/21/2014CN103811475A 具有背对背内嵌半导体元件及内建定位件的半导体组体板 Embedded semiconductor element having a back to back and built-in spacer plate semiconductor group
05/21/2014CN103811444A 电子装置、系统级封装模块及系统级封装模块的制造方法 The method of manufacturing an electronic device, the system-level and system-level encapsulation module package module
05/21/2014CN103811333A 线路的制造方法 The method of manufacturing lines
05/21/2014CN103806031A 一种高密度高精度印制线路板电镀铜工艺 A high-density printed circuit boards with high precision copper plating process
05/21/2014CN103805997A 湿式蚀刻方法与基板承载装置 Wet etching method and the substrate carrying device
05/21/2014CN103805077A 连接构造体的制造方法及连接方法 The method of manufacturing a connection structure and connection method
05/21/2014CN102974964B 一种利用mark点定位功能固定PCB板的方法 A use of mark-point positioning method of fixing the PCB
05/21/2014CN102548232B 一种防止线路板阻焊油墨塞孔的方法 A method of preventing circuit board solder mask plug hole method
05/21/2014CN102469699B 软硬结合电路板的制作方法 Flex circuit board manufacturing method
05/21/2014CN102257035B 包含均化剂的金属电镀用组合物 A leveling agent comprising a metal plating composition
05/21/2014CN102066044B 焊锡材料及电子部件接合体 Solder materials and electronic components assembly
05/21/2014CN101722427B 工具定位装置 Tool positioning device
05/20/2014US8729426 Method and apparatus for laser machining relatively narrow and relatively wide structures
05/20/2014US8729407 Wiring substrate and method for manufacturing wiring substrate
05/20/2014US8729402 Polyimide precursor composition, use of the of the same, and production method of the same
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