Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/2014
06/03/2014US8743555 Methods for suppressing power plane noise
06/03/2014US8742874 Coaxial waveguide microstructures having an active device and methods of formation thereof
06/03/2014US8742262 Low temperature co-fired ceramic structure for high frequency applications and process for making same
06/03/2014US8741113 Method and electrode for defining and replicating structures in conducting materials
06/03/2014US8739401 Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member
06/03/2014US8739399 Making electronic storage system having code circuit
06/03/2014US8739398 Method and apparatus for detethering mesoscale, microscale, and nanoscale components and devices
06/03/2014US8739397 Electrode sheet and process for producing electrode sheet
05/2014
05/30/2014WO2014081302A1 Apparatus and method for manufacturing a layered product
05/30/2014WO2014080977A1 Photosensitive resin composition, resist laminate, and articles obtained by curing same (10)
05/30/2014WO2014080976A1 Photosensitive resin composition, resist laminate, and articles obtained by curing same (9)
05/30/2014WO2014080963A1 Printed wiring board and printed circuit board
05/30/2014WO2014080834A1 Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board
05/30/2014WO2014080819A1 Wiring forming apparatus
05/30/2014WO2014080672A1 Laser machining device and laser machining method
05/30/2014WO2014080610A1 Circuit substrate design system, circuit substrate design method, and program recording medium
05/30/2014WO2014079421A1 Potential equalization in a control device for a motor vehicle
05/29/2014US20140147336 Impedance biosensor for electrical impedance biological sensing and manufacturing method thereof
05/29/2014US20140146536 Led component, led module and method for manufacturing the led component
05/29/2014US20140146504 Circuit board, package structure and method for manufacturing same
05/29/2014US20140146501 Electronic device in plastic
05/29/2014US20140146500 Multi-piece substrate
05/29/2014US20140146491 Flexible display apparatus and manufacturing method thereof
05/29/2014US20140146490 Laminated structure, method of manufacturing laminated structure, and electronic apparatus
05/29/2014US20140146489 Surface finish for conductive features on substrates
05/29/2014US20140145978 Touch panel having virtual function button, method of manufacturing the same, and method of identifying touch conflict on the same
05/29/2014US20140145565 Electronic Assembly Group and Method for Producing the Same
05/29/2014US20140145340 Flip Chip Interconnection Structure
05/29/2014US20140144693 Printed circuit board and method of manufacturing the same
05/29/2014US20140144690 Method for producing a structure for microelectronic device assembly
05/29/2014US20140144689 Touch-sensor structure and manufacturing method thereof
05/29/2014US20140144686 Wiring board with built-in electronic component and method for manufacturing wiring board with built-in electronic component
05/29/2014US20140144685 Printed circuit board with circuit visible and method for manufacturing same
05/29/2014US20140144684 Conductive pattern and method for producing the same
05/29/2014US20140144682 Surface finish for conductive features on substrates
05/29/2014US20140144680 Wired circuit board and producing method thereof
05/29/2014US20140144679 Conductive substrate comprising conductive pattern and touch panel comprising same
05/29/2014US20140144676 Electronic component embedded substrate and manufacturing method thereof
05/29/2014US20140144675 Multi-layer printed circuit board and method for manufacturing same
05/29/2014US20140144674 Electrical components and methods of manufacturing electrical components
05/29/2014US20140144575 Insulating layer conduction method
05/29/2014US20140144014 Method of producing a cermet-containing bushing for an implantable medical device
05/28/2014EP2736076A1 Apparatus and method for manufacturing a layered product
05/28/2014EP2735217A1 Batch cleaning apparatus and method for batch cleaning printed circuit boards
05/28/2014EP2735216A1 Structuring antistatic and antireflection coatings and corresponding stacked layers
05/28/2014EP2734693A1 Printed circuit board for use in mortise locks
05/28/2014DE102012023210A1 Kupferband zur Herstellung von Leiterplatten Copper tape for the production of printed circuit boards
05/28/2014DE102010019597B4 Verfahren zum Herstellen einer Elektrodenstruktur sowie Elektrodenstruktur für eine neuronale Schnittstelle A method for producing an electrode structure and electrode structure for a neural interface
05/28/2014CN203618240U 阶梯式印制线路板压合用垫片 Stepped printed circuit boards combined pressure washer
05/28/2014CN203618239U 刚挠结合线路板的压合结构 Rigid-flex PCB lamination structure combined with the
05/28/2014CN203618238U 八轴移动的带视觉定位的芯片返修与贴片装置 Eight-axis movement with visual orientation of the chip and SMD rework equipment
05/28/2014CN203618237U 结合平行移栽机和自动循环线的流水线 Combined with parallel lines transplanting machines and automatic cycle pipeline
05/28/2014CN203618236U 本压装置和连线机 The pressure device and wiring machines
05/28/2014CN203618235U Fpc预压装置和连线机 Fpc preload device and wiring machines
05/28/2014CN203618234U 一种smt生产中散料供料装置 One kind smt production of bulk material feeding device
05/28/2014CN203618233U 一种解pin针的装置 A needle device pin Solutions
05/28/2014CN203618232U 挠性印制线路板等离子除胶夹具 Flexible printed circuit boards, plasma in addition to plastic jig
05/28/2014CN203618231U 自动贴胶纸机 Automatic paste tape machine
05/28/2014CN203618230U 贴胶纸用吸附装置 Stick tape with a suction device
05/28/2014CN203618229U Acf贴附装置和连线机 Acf attached devices and wiring machines
05/28/2014CN203618228U 旋转平台和连线机 Rotating platform and Connection Machine
05/28/2014CN203618215U 防阶梯式印制板翘曲的排板结构 Anti stepped PCB warpage row board structure
05/28/2014CN103828497A 附孔层叠体的制造方法、附孔层叠体、多层基板的制造方法及底层形成用组合物 The method of manufacturing a laminate attachment hole, with the hole laminated body manufacturing method and the underlying multilayer substrate forming composition
05/28/2014CN103828496A 用于传输差分信号的通孔结构 Via structure for transmission of differential signals
05/28/2014CN103828495A 基板制造方法 The method of manufacturing a substrate
05/28/2014CN103828494A 基板及其制造方法 Substrate and manufacturing method
05/28/2014CN103828493A 元器件内置基板的制造方法及使用该制造方法的元器件内置基板 The method of manufacturing a component-embedded substrate and the use of the method of manufacturing the component-embedded substrate
05/28/2014CN103828492A 用于制造用于印刷电路板的z取向的部件的连续挤压工艺 For the manufacture of a printed circuit board means for the orientation of the z continuous extrusion process
05/28/2014CN103827353A 由承载膜和包括由至少一种金属粉末制成的可烧结的层和焊接层的层组件组成的复合层 By the carrier film and comprises a layer component layer and the solder layer can be a sintered metal powder prepared from at least one composite layer consisting of
05/28/2014CN103827236A 膜状各向异性导电粘合剂 The film-like anisotropic conductive adhesive
05/28/2014CN103826395A 印刷线路板的加工方法 A printed wiring board processing method
05/28/2014CN103826394A 软性线路板表面贴装元器件的方法、系统及磁性治具 The method of soft board surface mount components, systems and magnetic fixture
05/28/2014CN103826393A 一种微米级旋转精度的贴装头 One kind of micron-level precision placement head rotation
05/28/2014CN103826392A 高密度互连电路板曝光工艺中的识别结构 High-density interconnect circuit boards in an identification structure of the exposure process
05/28/2014CN103826391A 湿膜在电路板外层线路上制作的方法 The method of wet film on the outer layer of the circuit board production line
05/28/2014CN103826390A 厚铜印制线路板及其制作方法 Thick copper printed circuit board and manufacturing method thereof
05/28/2014CN103826387A 印刷电路板 A printed circuit board
05/28/2014CN103826386A 电子电路及其制造方法以及电子部件 The method of manufacturing an electronic circuit and electronic components
05/28/2014CN103826381A 一种可360°弯折的金属基印刷电路板及其制作工艺 One kind can be 360 ​​° bending metal base printed circuit board and its manufacturing process
05/28/2014CN103822130A 光身led软灯条及用于制造该产品的设备和方法 Light body led flexible light strip and apparatus and method for manufacturing the product
05/28/2014CN102725690B 感光性树脂组合物及其固化物、以及印刷电路板 The photosensitive resin composition and a cured product, and a printed circuit board
05/28/2014CN102656630B 电路基板、电路基板的制造方法、悬架用基板、悬架、带元件悬架及硬盘驱动器 A circuit substrate, the manufacturing method of the circuit substrate, the substrate suspension, the suspension with the suspension element and the hard disk drive
05/28/2014CN102656518B 感光性树脂组合物、其干膜以及使用了它们的印刷电路板 The photosensitive resin composition of the dry film and the use of printed circuit boards are
05/28/2014CN102621810B 光敏性树脂组合物、光敏性元件、抗蚀剂图案的形成方法及印刷电路板的制造方法 Method for producing a photosensitive resin composition, a photosensitive element, resist pattern forming method and printed circuit board
05/28/2014CN102608868B 感光性元件 Photosensitive element
05/28/2014CN102595797B 利用阴阳板镀铜法制作多层软硬结合板的方法 Making use of yin and yang board copper plating method of multilayer rigid-flex PCB
05/28/2014CN102593027B 固晶压板 Solid crystal plate
05/28/2014CN102523695B 板材清洗装置以及板材清洗方法 Apparatus and method for cleaning the plate clean sheet
05/28/2014CN102265715B 柔性基板和电子器件 A flexible substrate and electronic device
05/28/2014CN102037157B 用多官能化合物促进金属对层压板的粘合力 With a polyfunctional compound of the metal to promote the adhesion of the laminate
05/28/2014CN101843181B 内置元件电路板 Built-element circuit board
05/28/2014CN101802118B 粘接剂组合物和连接体 Adhesive composition and linkers
05/28/2014CN101563230B 具有导电元件的打印系统 The printing system of the conductive elements having
05/27/2014US8735739 Wiring board and method for manufacturing the same
05/27/2014US8732943 Method of forming a liner for an appliance
05/27/2014US8732942 Method of forming a high speed interconnect
05/27/2014CA2622775C Led lighting with integrated heat sink and process for manufacturing same
05/22/2014WO2014078361A1 Method for functional printing system
05/22/2014WO2014077406A1 Multilayer film and shielded printed wiring board
05/22/2014WO2014077136A1 Photosensitive conductive paste, multilayer substrate, method for producing conductive pattern, and capacitive touch panel
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