| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 09/10/2014 | EP2775807A1 Base material for forming electroconductive pattern, circuit board, and method for producing each |
| 09/10/2014 | EP2775732A1 Protection device for a contact strip of a distribution device |
| 09/10/2014 | EP2774945A1 Thermoplastic liquid crystal polymer film, and laminate and circuit board using same |
| 09/10/2014 | EP2774461A1 Circuit board made of ain with copper structures |
| 09/10/2014 | EP2774211A1 Device for emc filtering on a printed circuit |
| 09/09/2014 | US8832630 Apparatus and method for aiding in designing electronic circuits |
| 09/09/2014 | US8831918 System for manufacturing laminated circuit boards |
| 09/09/2014 | US8830691 Printed circuit board and method of manufacturing printed circuit board |
| 09/09/2014 | US8830690 Minimizing plating stub reflections in a chip package using capacitance |
| 09/09/2014 | US8830689 Interposer-embedded printed circuit board |
| 09/09/2014 | US8830653 Graphene mounted on aerogel |
| 09/09/2014 | US8829776 Light-source circuit unit, illumination device, and display device |
| 09/09/2014 | US8829689 Module substrate with feature for replacement of faulty chips, semiconductor module having the same, and method for manufacturing the semiconductor module |
| 09/09/2014 | US8829537 Integrated apparatus including driver chips, a power supply and LED chips on an isolative substrate |
| 09/09/2014 | US8829358 Z-directed pass-through components for printed circuit boards |
| 09/09/2014 | US8829357 Wiring board and method for manufacturing the same |
| 09/09/2014 | US8829356 Packaging substrate having a passive element embedded therein and method of fabricating the same |
| 09/09/2014 | US8829355 Multilayer printed wiring board |
| 09/09/2014 | US8828555 Method for forming patterned conductive film |
| 09/09/2014 | US8828554 Electroconductive layer, laminate using the same, and producing processes thereof |
| 09/09/2014 | US8828543 Conductive particles comprising complex metal layer with density gradient, method for preparing the particles, and anisotropic conductive adhesive composition comprising the particles |
| 09/09/2014 | US8828525 Flexible printed circuit board integrated with reinforcing plate, and method for manufacturing flexible printed circuit board integrated with reinforcing plate |
| 09/09/2014 | US8828521 Corrugated interfaces for multilayered interconnects |
| 09/09/2014 | US8828497 Method and use of a binder for providing a metallic coat covering a surface |
| 09/09/2014 | US8828245 Fabricating method of flexible circuit board |
| 09/09/2014 | US8828131 Catalyst application solution, electroless plating method using same, and direct plating method |
| 09/09/2014 | US8826530 Method for manufacturing substrate with metal film |
| 09/09/2014 | US8826529 Method of forming a micro-electromechanical system device |
| 09/09/2014 | US8826528 Electrical connections for anodized thin film structures |
| 09/09/2014 | US8826527 Electronic component-embedded printed circuit board and method of manufacturing the same |
| 09/09/2014 | US8826526 Method of manufacturing multilayer wiring substrate |
| 09/09/2014 | CA2585168C Laying device, contacting device, advancing system, laying and contacting unit, production system, method for the production and a transponder unit |
| 09/04/2014 | WO2014133688A1 Two-sided laser patterning on thin film substrates |
| 09/04/2014 | US20140248423 Method of roll to roll printing of fine lines and features with an inverse patterning process |
| 09/04/2014 | US20140248422 Method of fabricating a conductive pattern with high optical transmission and low visibility |
| 09/04/2014 | US20140248421 Methods for continuously moving a fluid dispenser while dispensing amounts of a fluid material |
| 09/04/2014 | US20140247573 Package substrate with testing pads on fine pitch traces |
| 09/04/2014 | US20140247572 Printed circuit board |
| 09/04/2014 | US20140247570 Circuit board structure having electronic components embedded therein and method of fabricating the same |
| 09/04/2014 | US20140247400 Touch screen panel |
| 09/04/2014 | US20140247242 Touch screen panel |
| 09/04/2014 | US20140246771 Package substrate, method of manufacturing the package substrate and semiconductor package including the package substrate |
| 09/04/2014 | US20140246227 Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby |
| 09/04/2014 | US20140246226 Method of fabricating copper-nickel micro mesh conductors |
| 09/04/2014 | US20140246224 Substrate for suspension, and production process thereof |
| 09/04/2014 | DE112012004940T5 Herstellung einer Leiterbahnstruktur und Substrat mit solcher Struktur Production of a conductor track structure and the substrate with such structure |
| 09/04/2014 | DE102013003542A1 Verfahren zur Herstellung einer funktionalisierten und umgeformten thermoplastischen Kunststofffolie und gemäß diesem Verfahren bearbeitete Kunststofffolie A process for producing a functionalized thermoplastic and the formed plastic film and processed in accordance with this method, plastic film |
| 09/04/2014 | DE102013003541A1 Verfahren zur Herstellung einer funktionalisierten thermoplastischen Kunststofffolie mit hybriden Schichtstrukturen und gemäß diesem Verfahren bearbeitete Kunststofffolie A process for producing a functionalized thermoplastic plastic film with hybrid layer structures and according to this method machined plastic film |
| 09/04/2014 | DE102013003527A1 Vorrichtung zum Niedertemperatur-Drucksintern, Verfahren zum Niedertemperatur-Drucksintern und leistungselektronische Baugruppe Apparatus for low temperature pressure sintering method for low-temperature and high-pressure sintering electronic assembly |
| 09/03/2014 | EP2773169A1 Circuit board and electronic apparatus provided with same |
| 09/03/2014 | EP2773167A1 System for and method of providing high resolution images using monolithic arrays of light emitting diodes |
| 09/03/2014 | EP2772797A2 Display device |
| 09/03/2014 | EP2772124A1 Continuous extrusion process for manufacturing a z-directed component for a printed circuit board |
| 09/02/2014 | US8824164 Laminate printed board and manufacturing method thereof |
| 09/02/2014 | US8824146 Directly injected forced convection cooling for electronics |
| 09/02/2014 | US8823187 Semiconductor package, semiconductor package manufacturing method and semiconductor device |
| 09/02/2014 | US8822839 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| 09/02/2014 | US8822837 Wiring board, electronic component embedded substrate, method of manufacturing wiring board, and method of manufacturing electronic component embedded substrate |
| 09/02/2014 | US8822836 Bonding sheet, electronic circuit device and its manufacturing method |
| 09/02/2014 | US8822833 Touch sensor assembly and method of making the same |
| 09/02/2014 | US8822830 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| 09/02/2014 | US8822828 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| 09/02/2014 | US8822352 Devices containing carbon nanomaterial electrical interconnects overcoated with metal nitride films and methods for production thereof |
| 09/02/2014 | US8822323 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 09/02/2014 | US8822034 Film-forming composition, diffusing agent composition, method for manufacturing film-forming composition, and method for manufacturing diffusing agent composition |
| 09/02/2014 | US8821793 Sensor substrate and method of fabricating same |
| 09/02/2014 | US8821764 Method of manufacturing conductive particle, anisotropic conductive adhesive having the same, and method of manufacturing display apparatus using the same |
| 09/02/2014 | US8821708 Method of surface treatment for the inhibition of whiskers |
| 09/02/2014 | US8821639 Apparatus for spatial and temporal control of temperature on a substrate |
| 09/02/2014 | US8821187 Board connector |
| 09/02/2014 | US8820232 Screen printing device and screen printing method |
| 09/02/2014 | US8819932 Method of manufacturing a ceramic electronic component |
| 09/02/2014 | US8819931 Enhanced-reliability printed circuit board for tight-pitch components |
| 09/02/2014 | US8819930 Method for improving the adhesion between silver surfaces and resin materials |
| 09/02/2014 | US8819929 Component mounting method |
| 09/02/2014 | US8819928 Ultrasonic imaging catheters |
| 08/28/2014 | WO2014130256A1 Enhancing silver conductivity |
| 08/28/2014 | WO2014080963A4 Printed wiring board and printed circuit board |
| 08/28/2014 | US20140244078 Modular flight management system incorporating an autopilot |
| 08/28/2014 | US20140242350 Process For The Production Of A Layered Body And Layered Bodies Without Masking Obtainable Therefrom |
| 08/28/2014 | US20140242294 Method of manufacturing a resistive touch sensor circuit by flexographic printing |
| 08/28/2014 | US20140240940 Electronic component connection structure |
| 08/28/2014 | US20140240938 Carrier-less silicon interposer |
| 08/28/2014 | US20140240934 Multilayer wiring board for an electronic device |
| 08/28/2014 | US20140240929 Heterogeneous thermal interface |
| 08/28/2014 | US20140240616 Touch panel and manufacturing method thereof |
| 08/28/2014 | US20140240485 Device for assembling photoelectric element onto substrate |
| 08/28/2014 | US20140240135 Tornado Warning System |
| 08/28/2014 | US20140239331 Light emitting device, light emitting element mounting method, and light emitting element mounter |
| 08/28/2014 | US20140238733 Systems and methods for frequency shifting resonance of an unused via in a printed circuit board |
| 08/28/2014 | US20140238731 Film constructions for interdigitated electrodes with bus bars and methods of making same |
| 08/28/2014 | US20140238728 Plastic Film having Lines for a Multi-Modal Input Device and Method for Producing |
| 08/28/2014 | US20140238725 Method of flattening surface of conductive structure and conductive structure with flattened surface |
| 08/28/2014 | US20140238724 Fabrication of three-dimensional printed circuit board structures |
| 08/28/2014 | US20140237817 Liquid crystal alignment layers and method of fabrication |
| 08/28/2014 | US20140237816 Extrusion Process for Manufacturing a Z-Directed Component for a Printed Circuit Board |
| 08/28/2014 | DE102014203755A1 Elektronisches teil und elektronische steuereinheit Electronic part and electronic control unit |
| 08/28/2014 | DE102013213135B3 Verfahren zum Weichlöten von Halbleiterchips auf Substrate und Verfahren zum Herstellen eines Leistungshalbleitermoduls A method of soft soldering semiconductor chips to substrates and method for producing a power semiconductor module |
| 08/28/2014 | DE102013208395B3 Bauteil mit metallhaltiger, selbstorganisierter Schicht, Verfahren zu deren Herstellung sowie Verwendung Component with metal-containing self-assembled layer, processes for their preparation and use |
| 08/28/2014 | DE102013203398A1 Verfahren zur Herstellung einer Solarzelle A process for producing a solar cell |