Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2014
10/16/2014US20140304984 Device for assembling a chip on a substrate by providing a solder-forming mass
10/16/2014US20140304977 Fabrication process of stepped circuit board
10/14/2014US8863046 Controlling impedance and thickness variations for multilayer electronic structures
10/14/2014US8861221 Integrated circuit packaging system with a shield and method of manufacture thereof
10/14/2014US8861220 Method for generating an electronic system, method for generating a freeform surface having such a system, and electronic system and freeform surfaces having such a system
10/14/2014US8861217 Systems and methods for providing vias through a modular component
10/14/2014US8860296 Illumination devices and methods for making the same
10/14/2014US8860205 Method of stiffening coreless package substrate
10/14/2014US8860203 Stretchable base plate and stretchable organic light-emitting display device
10/14/2014US8860048 Three dimensional light emitting diode systems, and compositions and methods relating thereto
10/14/2014US8859907 Method for assembling a circuit board
10/14/2014US8859420 Structure and method of making interconnect element, and multilayer wiring board including the interconnect element
10/14/2014US8859170 Photosensitive modified polyimide resin composition and use thereof
10/14/2014US8859138 Electrical part, nonaqueous electrolyte cell, and lead wire and sealable container which are used therein
10/14/2014US8859086 Bonded structure of touch screen with flexible circuit board for preventing overflow and bonding method thereof
10/14/2014US8859077 Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate
10/14/2014US8858865 Silicon nitride substrate manufacturing method, silicon nitride substrate, silicon nitride circuit substrate, and semiconductor module
10/14/2014US8858751 Method for producing flexible metal laminate
10/14/2014US8858241 Socket connector with contact terminal having waveform arrangement adjacent to tail portion perfecting solder joint
10/14/2014US8857330 Screen printer and screen printing method
10/14/2014US8857050 Methods of making an environment protection coating system
10/14/2014US8857045 Method of assembling a circuit board assembly
10/14/2014US8857021 Laser welded bonding pads for piezoelectric print heads
10/09/2014WO2014165638A1 Method of forming transistor with metal contacts in barrier layer
10/09/2014WO2014164587A1 Azeotrope-like compositions comprising 1-chloro-3,3,3-trifluoropropene
10/09/2014WO2014163839A1 Microcavity carrier with image enhancement for laser ablation
10/09/2014WO2014162867A1 Method for manufacturing wiring board
10/09/2014WO2014162478A1 Component-embedded substrate and manufacturing method for same
10/09/2014WO2014162255A1 High modulus laser direct structuring polycarbonate composites with enhanced plating performance and broad laser window and methods for the manufacture and use thereof
10/09/2014WO2014162146A1 Printing screen
10/09/2014US20140302333 Thick film conductive inks for electronic devices
10/09/2014US20140302292 Inkjet printed electronic device
10/09/2014US20140301797 Device and a Method for Machining Printed Circuit Boards
10/09/2014US20140301106 Appliance displays having modular light guides and methods of assembling the same
10/09/2014US20140301093 Product packaging
10/09/2014US20140301056 Method and System for Optimizing Routing Layers and Board Space Requirements for a Ball Grid Array Land Pattern
10/09/2014US20140301052 Conductive Mechanical Support at Interface of Printed Circuit Board
10/09/2014US20140300946 Analog imod having a color notch filter
10/09/2014US20140300001 Printed circuit board and manufacturing method thereof, and semiconductor package including the printed circuit board
10/09/2014US20140299366 Hot melt ink composition, method for preparing a hot melt ink composition and use thereof
10/09/2014US20140299365 Flexible touch sensor with fine pitch interconnect
10/09/2014US20140299364 Electrically conductive article with high optical transmission
10/09/2014US20140299363 Structure of via hole of electrical circuit board and manufacturing method thereof
10/09/2014US20140299362 Stretchable electric device and manufacturing method thereof
10/09/2014US20140299360 Conductive sheet and method for fabricating the same
10/09/2014US20140299356 Protective film with dye materials for laser absorption enhancement for via drilling
10/09/2014US20140298648 Electronic component-embedded printed circuit board and method of manufacturing the same
10/09/2014DE102014204729A1 Dickschicht-Leitfähigkeitstinten für Elektronikvorrichtungen Thick-film conductivity inks for electronics devices
10/09/2014DE102013205998A1 Optoelektronische Baugruppe und Verfahren zum Herstellen einer optoelektronischen Baugruppe The optoelectronic assembly and method of making an optoelectronic assembly
10/09/2014DE102013103370A1 Verfahren zum Einbringen von Durchbrechungen in ein Glassubstrat sowie ein derart hergestelltes Glassubstrat A method for introducing perforations into a glass substrate and a glass substrate thus produced
10/08/2014EP2787799A1 Board with embedded component and method for manufacturing same, and package with board with embedded component
10/08/2014EP2787798A2 Lighting device
10/08/2014EP2787797A1 Method for manufacturing an electronic module by sequential attachment of the components
10/08/2014EP2787796A1 Conductive film forming method, copper fine particle-dispersed liquid, and circuit board
10/08/2014EP2786645A1 Method of providing an electronic device structure and related electronic device structures
10/08/2014EP2786592A2 Electro-acoustic transducer for mounting on a substrate
10/08/2014EP2786407A2 Method for depositing materials on a substrate
10/08/2014EP2785893A2 Material deposition system for depositing materials on a substrate
10/08/2014EP2785792A1 Conductive metal composition
10/08/2014EP2785528A1 Printing screen
10/07/2014USRE45175 Process for silver plating in printed circuit board manufacture
10/07/2014US8856718 Congestion estimation based on routing resources of programmable logic devices
10/07/2014US8856717 Shielded pattern generation for a circuit design board
10/07/2014US8853865 Semiconductor device with overlapped lead terminals
10/07/2014US8853864 Semiconductor device and a method of manufacturing the same
10/07/2014US8853561 Printed wiring board with improved corrosion resistance and yield
10/07/2014US8853557 Wiring board and mount structure
10/07/2014US8853552 Multilayer printed wiring board and method for manufacturing multilayer printed wiring board
10/07/2014US8853550 Circuit board including mask for controlling flow of solder
10/07/2014US8853549 Circuit substrate and method of manufacturing same
10/07/2014US8853547 Flexible printed board
10/07/2014US8853546 Printed circuit board and method of manufacturing the same
10/07/2014US8853102 Manufacturing method of circuit structure
10/07/2014US8852999 System-in-a-package based flash memory card
10/07/2014US8852754 Surface-treated copper foil, method for producing same, and copper clad laminated board
10/07/2014US8852728 Conductive film
10/07/2014US8852417 Electrolytic process using anion permeable barrier
10/07/2014US8851733 Light signal transmitter and light receiver for an optical sensor
10/07/2014US8850701 Method for manufacturing multilayer printed circuit board having mounting cavity
10/07/2014US8850700 Wiring board and method for making the same
10/07/2014US8850699 Method of forming a land grid array with discrete pads
10/07/2014US8850698 Method for the sealed assembly of an electronic housing
10/07/2014US8850697 Method for manufacturing a radiation imaging panel comprising imaging tiles
10/02/2014WO2014159537A1 Mitigating pcb voltage stresses in high-voltage devices
10/02/2014WO2014159368A1 Ground and heat transfer interface on a printed circuit board
10/02/2014WO2014157716A1 Printed wiring board and manufacturing method for mounting substrate using printed wiring board
10/02/2014WO2014157581A1 Laminate and circuit board
10/02/2014WO2014157468A1 Laminate, laminated sheet, printed circuit board, and production method for laminate and laminated sheet
10/02/2014WO2014157446A1 Curable epoxy composition, film, multilayer film, prepreg, laminate, cured product, and composite body
10/02/2014WO2014157342A1 Wiring board and mounting structure using same
10/02/2014WO2014157339A1 Drift plate and jet flow device
10/02/2014WO2014157303A1 Composition for forming conductive films and method for producing conductive film using same
10/02/2014WO2014157290A1 Wiring board
10/02/2014WO2014157281A1 Wiring board
10/02/2014WO2014157206A1 Method for manufacturing multilayer wiring substrate
10/02/2014WO2014157031A1 High-frequency transmission line and electronic device
10/02/2014WO2014156930A1 Connection method for circuit member, and assembly
10/02/2014WO2014156844A1 Thermoplastic resin film base for optical firing, conductive circuit board using same, and method for manufacturing said conductive circuit board
10/02/2014WO2014156835A1 Apparatus and method for producing (metallic plate)-(ceramic plate) laminate, and apparatus and method for producing substrate for power modules
10/02/2014WO2014156832A1 Composition for forming conductive film, conductive film, and wiring board
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