Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/2012
06/07/2012WO2012074405A1 Method and apparatus for assembling electric components on a flexible substrate as well as assembly of an electric component with a flexible substrate
06/07/2012WO2012074345A2 Flexible printed circuit board and a production method therefor
06/07/2012WO2012074136A1 Polymerizable composition, and photosensitive layer, permanent pattern, wafer-level lens, solid-state imaging device and pattern forming method, each using the composition
06/07/2012WO2012074015A1 Anisotropic conductive material and method for manufacturing same
06/07/2012WO2012073981A1 Visual inspection device and printed solder inspection device
06/07/2012WO2012073917A1 Wiring check device and wiring check system
06/07/2012WO2012073814A1 Method for producing laminate having metal film
06/07/2012WO2012073739A1 Substrate module
06/07/2012WO2012073669A1 Multilayer flexible substrate
06/07/2012WO2012073572A1 Semiconductor device, and process for manufacture of semiconductor device
06/07/2012WO2012073466A1 Substrate, semiconductor device, and method for manufacturing substrate
06/07/2012WO2012073400A1 Resistor-embedded substrate and current detection module provided with same
06/07/2012WO2012072968A1 Wire holder and method of terminating wire conductors
06/07/2012WO2012072914A2 Machine for exposing panels
06/07/2012WO2012072448A1 Luminous device and process for producing a luminous device
06/07/2012WO2012072263A1 Method for making electric circuit pattern
06/07/2012WO2012037509A3 Electrically conductive adhesive for temporary bonding
06/07/2012WO2012016258A3 Adhesive for fixing and/or embedding an electronic component and method and use
06/07/2012WO2012000485A3 Component carrier, in particular motor vehicle door lock
06/07/2012US20120142222 Connector and display apparatus having the same
06/07/2012US20120142117 Biosensor provided with code electrode, method for manufacturing the same, and method for obtaining sensor information from the same
06/07/2012US20120141665 Method of and apparatus for forming a metal pattern
06/07/2012US20120141114 Three-pole tilt control system for camera module
06/07/2012US20120140492 Insulated glass units incorporating emitters, and/or methods of making the same
06/07/2012US20120140442 Light source for illumination apparatus and method of manufacturing the same
06/07/2012US20120140432 Radio frequency circuit with impedance matching
06/07/2012US20120140418 Fixing structure for heat source element and heat conducting member, and method of fixing heat source element and heat conducting member
06/07/2012US20120140401 Remote attachable flash drive
06/07/2012US20120140377 Multilayer ceramic electronic component and fabricating method thereof
06/07/2012US20120140375 Conductive paste for inner electrode and multilayer ceramic electronic component having the same
06/07/2012US20120138354 Method of preparing conductive gaskets on a chassis, the chassis with conductive gaskets, and method of assembling an electric device including the same
06/07/2012US20120138346 Wiring board, electronic component embedded substrate, method of manufacturing wiring board, and method of manufacturing electronic component embedded substrate
06/07/2012US20120138337 Printed circuit board and method of manufacturing the same
06/07/2012US20120138335 High Aspect Ratio Microelectrode Arrays Enabled to Have Customizable Lengths and Methods of Making the Same
06/07/2012US20120137514 Methods for fabricating an overmolded semiconductor package with wirebonds for electromagnetic shielding
06/07/2012US20120137512 Method for Stacking Microelectronic Devices
06/07/2012US20120137506 Apparatus for forming a wireless communication device
06/06/2012EP2461659A1 Printed wiring board, build-up multi-layer board, and production method therefor
06/06/2012EP2461658A1 Method and apparatus for assembling electric components on a flexible substrate as well as assembly of an electric component with a flexible substrate
06/06/2012EP2461657A1 Electric assembly and method for producing an assembly
06/06/2012EP2461656A2 Circuit board and connection substrate
06/06/2012EP2461655A1 Hybrid materials for printing conductive or semiconductive elements
06/06/2012EP2460393A1 A method of manufacturing substrates having asymmetric buildup layers
06/06/2012EP2460212A1 Arrangement for connecting electrical conductors to terminal connections of interconnected cells
06/06/2012EP2459778A2 Composition for metal plating comprising suppressing agent for void free submicron feature filling
06/06/2012EP2130418B1 Method for inserting a pin into a receiving opening in a circuit board
06/06/2012EP2099612B1 Printing system with conductive element
06/06/2012EP1816653B1 Conductive paste and method for manufacturing multilayer printed wiring board using same
06/06/2012EP1811823B1 Multilayer printed wiring board
06/06/2012DE10321509B4 Verfahren zum Füllen blinder Durchkontaktierungen und zum Bilden einer Elektrode Method for filling blind vias and for forming an electrode
06/06/2012DE102011087659A1 Verfahren zum Ausbilden eines Leitermusters A method for forming a conductor pattern
06/06/2012DE102008021655B4 Strahlungsquelle und Solarzelle Radiation source and solar cell
06/06/2012CN202269146U 插件元件辅助装配治具 Plug-member auxiliary assembly fixture
06/06/2012CN202269099U 电子元件焊接结构 The electronic component soldering structure
06/06/2012CN202264000U 一种全自动焊锡机 A fully automatic soldering machine
06/06/2012CN102487600A Electronic component aligning device, electronic component packaging body, and electronic component mounting board
06/06/2012CN102487579A Preparation method of metamaterial and the same
06/06/2012CN102487578A Circuit board and manufacturing method thereof
06/06/2012CN102487577A Manufacturing method of circuit board with combination of flexible circuit board and hard circuit board
06/06/2012CN102487576A Method for processing smear on flex-rigid circuit board and flexible circuit board
06/06/2012CN102487574A Flexible printed circuit board structure and manufacturing method thereof
06/06/2012CN102485482A Circuit board filming equipment and circuit board wet filming method
06/06/2012CN102485400A Crest welder cooling device
06/06/2012CN102485399A Heat recycling backflow welding machine
06/06/2012CN102485398A Wave crest generator with solder recovery function
06/06/2012CN102485397A Separable lead-free dip brazing tin furnace
06/06/2012CN102485396A Energy-saving wave crest welder
06/06/2012CN102485395A Low-capacity wave crest generator
06/06/2012CN102485394A Wave crest generator with adjustable wave crest width
06/06/2012CN102080252B Rapid printed circuit board feeding and clamping device and electroplating equipment thereof
06/06/2012CN102006727B Method for machining built-in slot of PCB
06/06/2012CN101986772B Method for manufacturing flexible circuit board
06/06/2012CN101980590B Multi-piece substrate and method of manufacturing the substrate
06/06/2012CN101935836B Surface treatment process of reddened copper foil for high-grade FR-4 copper-clad plate
06/06/2012CN101911842B Circuit board and method for mounting electronic component on printed board
06/06/2012CN101909409B Manufacturing process for high-frequency multilayer mixed compression signal plate
06/06/2012CN101841968B Circuit board with step-shaped blind hole
06/06/2012CN101831247B Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
06/06/2012CN101808473B Precise and fine circuit binding force improving device and manufacturing method thereof
06/06/2012CN101754589B Demolding film
06/06/2012CN101720167B Method for producing circuit board by filling resin in holes on inner core plate
06/06/2012CN101715273B Printed circuit board (PCB) packaging structure and manufacturing method thereof
06/06/2012CN101594740B Circuit board with imbedded electronic device and method of imbedding electronic device therein
06/06/2012CN101574023B Method of producing conductive circuit board
06/06/2012CN101572997B Method for forming conducting wire on insulated heat-conducting metal substrate in a vacuum sputtering way
06/06/2012CN101400716B Heat curable resin composition, overcoating agent for flexible circuit board, and surface protective film
06/06/2012CN101377624B Exposure device and exposure process
06/06/2012CN101257004B Wiring structure, forming method of the same and printed wiring board
06/06/2012CN101166778B Composite, prepreg, laminated plate clad with metal foil, circuit board connecting member, and multilayer printed wiring board and method for manufacture thereof
06/05/2012US8193628 Printed wiring board, a method of manufacturing printed wiring board, a sensor module, and a sensing device
06/05/2012US8193468 Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure
06/05/2012US8193456 Electrical inspection substrate unit and manufacturing method therefore
06/05/2012US8191758 Method for manufacturing semiconductor device
06/05/2012US8191452 Device for punching green sheets
06/05/2012US8191244 Fabricating method of circuit board
06/05/2012US8191243 Method for making contact with a contact surface on a substrate
05/2012
05/31/2012WO2012071002A1 A method and an apparatus for forming electrically conductive vias in a substrate, an automated robot-based manufacturing system, a component comprising a substrate with via holes, and an interposer device
05/31/2012WO2012070471A1 Rolled copper foil for flexible printed wiring board, copper-clad laminated board, flexible wiring board, and electronic device
05/31/2012WO2012070381A1 Mounting structure and mounting method
05/31/2012WO2012070264A1 Reflow soldering device and reflow soldering method