| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 01/15/1991 | US4985512 High-lubricity film |
| 01/15/1991 | US4985509 Heat curable resin composition |
| 01/15/1991 | US4985376 Conductive paste compositions and ceramic substrates |
| 01/15/1991 | US4985308 Tetrafluoroethylene |
| 01/15/1991 | US4985297 Metal sheet and composite of fluoropolymer impregnated with fluorine-containing polyimide |
| 01/15/1991 | US4985294 Copper foil laminated to insulating layer of blend of epoxy resin and acrylonitrile-butadiene rubber |
| 01/15/1991 | US4985293 Polymer blend for molded circuit boards and other selectively conductive molded devices |
| 01/15/1991 | US4985116 Three dimensional plating or etching process and masks therefor |
| 01/15/1991 | US4985098 Method of manufacturing ceramic laminate |
| 01/15/1991 | CA1278912C Overprint copper composition |
| 01/10/1991 | WO1991000627A1 Ferrite rod antenna |
| 01/10/1991 | WO1991000309A1 Process for making fibre-reinforced substrate materials for the electrical sector |
| 01/10/1991 | WO1990013990A3 Circuit boards with recessed traces |
| 01/10/1991 | DE3922238A1 Intercommunication arrangement between electronic circuit boards - has back plane system with communication bus and separate power system |
| 01/10/1991 | CA2019528A1 Polyetherimide precursor reinforced laminates and the preparation thereof |
| 01/09/1991 | EP0407156A2 Circuit module |
| 01/09/1991 | EP0407129A2 Process for producing molding for precision fine line-circuit |
| 01/09/1991 | EP0407108A1 Improved method of assembly and apparatus for a small electrical device |
| 01/09/1991 | EP0407099A1 Multi-layered ceramic elements and method for producing same |
| 01/09/1991 | EP0406959A2 Maleimide composition |
| 01/09/1991 | EP0406911A1 Process for preparation of polysilsesquioxane |
| 01/09/1991 | EP0406859A2 Process for producing a resin molded article having a metal plated layer thereon |
| 01/09/1991 | EP0406829A2 Printed circuit board |
| 01/09/1991 | EP0406496A2 Switch provided with indicator |
| 01/09/1991 | EP0406376A1 Improved method for making printed circuits |
| 01/09/1991 | EP0253833B1 Multilayer printed circuit board |
| 01/08/1991 | US4984064 Semiconductor device |
| 01/08/1991 | US4984057 Semiconductor element string structure |
| 01/08/1991 | US4983804 Localized soldering by inductive heating |
| 01/08/1991 | US4983456 Compositions convertible to reinforced conductive components and articles incorporating same |
| 01/08/1991 | US4982892 Solder interconnects for selective line coupling |
| 01/08/1991 | CA1278878C Cooling method and apparatus for an integrated circuit casing |
| 01/06/1991 | CA2020367A1 Multi-layered ceramic elements and method for producing same |
| 01/03/1991 | DE4004844C1 Copper metallisation on ceramic substrate - obtd. by bonding copper foil directly to whole surface of substrate, then masking and etching |
| 01/03/1991 | DE3920232A1 Pluggable wiring foil with conductive tracks - has several, loosely stacked foil circuits, with specified raster of soldering eyelets |
| 01/03/1991 | DE3919632A1 Installations-bauelementensatz Installation Components rate |
| 01/03/1991 | CA2019978A1 Process for producing molding for precision fine-line circuit |
| 01/02/1991 | EP0405947A2 Method of manufacturing thick-film devices |
| 01/02/1991 | EP0405838A2 Header device |
| 01/02/1991 | EP0405828A1 Solder assembly of components |
| 01/02/1991 | EP0405482A1 Improved wire scribed circuit boards and methods of their manufacture |
| 01/02/1991 | EP0405089A2 Method for the preparation of a covering film for flexible printed circuit board |
| 01/02/1991 | EP0404940A1 Memory testing system |
| 01/02/1991 | EP0404891A1 Process for the manufacture of electrically conductive structures. |
| 01/02/1991 | CA1278471C Multilayer printed wiring boards |
| 01/01/1991 | US4982376 Method of mounting electrical and/or electronic components on a single-sided printed board |
| 01/01/1991 | US4982265 Semiconductor integrated circuit device and method of manufacturing the same |
| 01/01/1991 | US4982177 Arrangement for monitoring the temperature in flow soldering of flat modules |
| 01/01/1991 | US4982056 Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxide |
| 01/01/1991 | US4981941 Fluorinated epoxy resins with high glass transition temperatures |
| 01/01/1991 | US4981753 Fabric for printed circuit substrate and printed circuit substrate |
| 01/01/1991 | US4981248 Electronically controlled wave solder mask shield |
| 12/31/1990 | CA2019437A1 Header device |
| 12/27/1990 | WO1990016141A1 Printed circuit board and method of mounting circuit parts |
| 12/27/1990 | WO1990016102A1 Installation component set |
| 12/27/1990 | WO1990015682A1 Bonding additives for refractory metallization inks |
| 12/27/1990 | EP0404156A2 Personal computer having condition indicator |
| 12/27/1990 | EP0404049A2 Process for etching polyimide resin |
| 12/27/1990 | EP0403975A2 Circuit structure formed by insert molding of electric and/or optical transmission medium and method for manufacturing such a circuit structure. |
| 12/27/1990 | EP0403862A2 Printed circuit with circumferential connections |
| 12/27/1990 | EP0403851A2 Excimer induced topography of flexible interconnect structures |
| 12/27/1990 | EP0403788A2 Sensor coil arrangement |
| 12/27/1990 | EP0403643A1 Uniform current and voltage distribution device |
| 12/27/1990 | EP0403602A1 Improvements relating to printed circuit boards |
| 12/27/1990 | EP0297139B1 Flexible printed circuit board and process for its production |
| 12/27/1990 | CA1278398C Nitrogenized electronic conductive polymers, their preparation processes, electrochromic display cell and electro-chemical generator using these polymers |
| 12/25/1990 | US4980802 Flexible printed circuit |
| 12/25/1990 | US4980663 Automated adjustment of air-core coil inductance |
| 12/25/1990 | US4980659 Microwave dual level transition |
| 12/25/1990 | US4980246 Dense ceramic alloys and process of making same |
| 12/25/1990 | US4980239 Having sufficient adhesion strength |
| 12/25/1990 | US4980225 Coating of metal, butyl acetate, toluene and carbon on a substrates |
| 12/25/1990 | US4980219 Sprocket holes at predetermined intervals in side edge areas |
| 12/25/1990 | US4980217 Printed circuit board fabrication |
| 12/25/1990 | US4979787 Optical-electronic interface module |
| 12/24/1990 | CA2019258A1 Process for manufacturing fiber-reinforced base materials for the electrical industry |
| 12/20/1990 | DE4016663A1 DC servomotor with integrated speed controller - has chopper on PCB with interference screen due to housing protrusion |
| 12/20/1990 | DE3919249A1 Two-layer tape-automated-bonding film carrier prodn. - without use of environmentally polluting solvents |
| 12/19/1990 | EP0403335A2 Method of fabrication of a case for electronic circuits and such a case, especially for motor vehicles, obtained by this method |
| 12/19/1990 | EP0403288A2 Bus structure |
| 12/19/1990 | EP0403208A1 Heat sinking substrate |
| 12/19/1990 | EP0402750A1 Process for surface treatment of polyamide articles and the articles obtained |
| 12/19/1990 | EP0402546A2 Printed circuit board |
| 12/19/1990 | EP0402446A1 High dielectric multilayer capacitor |
| 12/18/1990 | US4979090 Power converter circuit board |
| 12/18/1990 | US4979076 Hybrid integrated circuit apparatus |
| 12/18/1990 | US4979075 Method and apparatus for controlling circuit expansion for consumer electronic systems |
| 12/18/1990 | US4979019 Printed circuit board with inorganic insulating matrix |
| 12/18/1990 | US4978914 Laminated board for testing electronic components |
| 12/18/1990 | US4978844 Optical element carrying printed substrate and optical head device using the substrate |
| 12/18/1990 | US4978574 Formation of organic membranes |
| 12/18/1990 | US4977668 Method of making socket connector |
| 12/18/1990 | CA1277947C Continuous process for fabricating metallic patterns on a thin film substrate |
| 12/18/1990 | CA1277829C Polymer thick film inks |
| 12/17/1990 | WO1990015706A1 Liquid crystal polymer film |
| 12/15/1990 | CA2018187A1 Radial type of parallel system bus structure with printed, twisted conductor lines |
| 12/13/1990 | WO1990015089A1 Epoxy-terminated polyoxazolidones, process of preparation, and electrical laminates therefrom |
| 12/13/1990 | DE3918423A1 Double layer through-hole coupled rigid and flexible circuits - have support boards coupled together using adhesive bond to secure flexible unit in slot |
| 12/12/1990 | EP0402055A2 Method and apparatus for a rapid interconnection to a computer bus |
| 12/12/1990 | EP0402053A2 Signal carrier supports |