| Patents for H05K 1 - Printed circuits (98,583) |
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| 03/31/2005 | US20050067715 Electronic parts built-in substrate and method of manufacturing the same |
| 03/31/2005 | US20050067703 Electronic member, method for making the same, and semiconductor device |
| 03/31/2005 | US20050067683 Memory expansion and chip scale stacking system and method |
| 03/31/2005 | US20050067472 Method for connecting connection members to board |
| 03/31/2005 | US20050067293 Producing method of flexible wired circuit board |
| 03/31/2005 | US20050067267 Trip-free PCB mountable relay configuration and method |
| 03/31/2005 | US20050067188 Thin film circuit integrating thick film resistors thereon and method of fabricating the same |
| 03/31/2005 | US20050067187 Printed circuit board and interleaving routing scenario thereof |
| 03/31/2005 | US20050067186 Hybrid integrated circuit device and method of manufacturing the same |
| 03/31/2005 | US20050067177 Module and method of manufacturing module |
| 03/31/2005 | US20050066523 Method of making an interposer with contact structures |
| 03/31/2005 | DE19781846B4 Schaltungsgehäuse, insbesondere Flip-Chip- oder C4-Gehäuse mit Stromversorgungs- und Masseebenen Circuit case, in particular flip-chip or C4-housing with power and ground planes |
| 03/31/2005 | DE10341453A1 Schaltungsträger Circuit board |
| 03/31/2005 | DE10340297A1 Circuit for active and passive electric and electronic components for modular construction of a circuit having a pressure element for pressing a spring element |
| 03/31/2005 | DE10340289A1 Fuse unit for hardware circuits or modules in electronic circuits whereby an attempt to rmove the fuse unit from the circuit board causes a break in a contact |
| 03/31/2005 | DE10339901A1 Mobile communications device used e.g. as a mobile telephone comprises a transparent electrically conducting layer arranged on or in front of an image recording sensor of a camera |
| 03/31/2005 | DE10339692A1 Heat sink with electrically-insulating, thermally-conductive layer on which semiconductor components are mounted, comprises metallic body with surface-oxidation |
| 03/31/2005 | DE102004039806A1 Memory module for computer system, includes buffer for buffering signal for memory chips, which is placed on circuit boards |
| 03/30/2005 | EP1519642A1 Electronic component mounting method and electronic component mounting structure |
| 03/30/2005 | EP1519641A2 Module and method of manufacturing module |
| 03/30/2005 | EP1519640A1 Producing method of flexible wired circuit board |
| 03/30/2005 | EP1519415A2 Electronic parts built-in substrate and method of manufacturing the same |
| 03/30/2005 | EP1519413A1 Via placement for layer transitions in flexible circuits with high density ball grid arrays |
| 03/30/2005 | EP1519412A2 Method of mounting wafer on printed wiring substrate |
| 03/30/2005 | EP1519364A1 Thin film magnetic recording head |
| 03/30/2005 | EP1519105A2 Light emitting diode carrier, in particular for automobiles |
| 03/30/2005 | EP1518886A1 Multi layered, oriented, with electromagnetic radiation patternable foil made of thermoplastic polyester for the production of selectively metallized foils |
| 03/30/2005 | EP1518885A1 Oriented, with electromagnetic radiation patternable and aminosilane coated foil made of thermoplastic polyester for the production of selectively metallized foils |
| 03/30/2005 | EP1518847A2 Aluminum/ceramic bonding substrate and method for producing same |
| 03/30/2005 | EP1518448A1 Carriers for printed circuit board marking |
| 03/30/2005 | EP1518447A1 Printed board for electronic devices controlling a motor vehicle |
| 03/30/2005 | EP1518267A2 Electronic component with a housing packaging |
| 03/30/2005 | EP1518260A2 Apparatus for enhancing impedance-matching in a high-speed data communications system |
| 03/30/2005 | EP1517959A1 Polyester-type formaldehyde free insulation binder |
| 03/30/2005 | EP1517939A1 Biaxially oriented polyester film and laminates thereof with copper |
| 03/30/2005 | EP1517794A1 Ink jet printhead chip with predetermined micro-electromechanical systems height |
| 03/30/2005 | EP1433220A4 Inverted coplanar waveguide coupler with integral microstrip connection ports |
| 03/30/2005 | EP1075782B1 Adapted electrically conductive layer |
| 03/30/2005 | CN2689651Y Multi-layer circuit board structure with separated column |
| 03/30/2005 | CN2689288Y Cameras |
| 03/30/2005 | CN1602372A Multi-component fibers having reversible thermal properties and methods of manufacturing thereof |
| 03/30/2005 | CN1602144A Method of mounting wafer on printed wiring substrate |
| 03/30/2005 | CN1602141A Single board able to realize live-wire insertion and its realizing method |
| 03/30/2005 | CN1602139A Hybrid integrated circuit device and method of manufacturing the same |
| 03/30/2005 | CN1602138A Printed circuit board test access point structures and method for making the same |
| 03/30/2005 | CN1602137A 电路装置 Circuit means |
| 03/30/2005 | CN1602135A Printed circuit board and its wiring method |
| 03/30/2005 | CN1602134A Flexible printed circuit board |
| 03/30/2005 | CN1601740A Carrier-belt automatic bonding type semiconductor device |
| 03/30/2005 | CN1601739A Land pattern configuration |
| 03/30/2005 | CN1601736A Semiconductor integrated circuit and electronic apparatus having the same |
| 03/30/2005 | CN1601712A Reinforced solder bump structure and method for forming a reinforced solder bump |
| 03/30/2005 | CN1601611A Suspension board with circuit and procuding method thereof |
| 03/30/2005 | CN1600760A Solidified ethylene benzo compounds, mfg for same and substrate for high frequency |
| 03/30/2005 | CN1600458A Method and equipment for breaking down and reclaiming electronic components and solder of discarded circuit board |
| 03/30/2005 | CN1195397C Electric circuit board production and its repairing method |
| 03/30/2005 | CN1195395C Copper alloy foil for integrated board |
| 03/30/2005 | CN1195394C Substrate of circuit board |
| 03/29/2005 | US6873800 Hot pluggable optical transceiver in a small form pluggable package |
| 03/29/2005 | US6873534 Arrangement of integrated circuits in a memory module |
| 03/29/2005 | US6873530 Stack up assembly |
| 03/29/2005 | US6873529 High frequency module |
| 03/29/2005 | US6873520 Portable apparatus |
| 03/29/2005 | US6873519 Electronic component assembly, and intermediate connector and unit body for the same |
| 03/29/2005 | US6873513 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 03/29/2005 | US6873241 High frequency transformers and high Q factor inductors formed using epoxy-based magnetic polymer materials |
| 03/29/2005 | US6873230 High-frequency wiring board |
| 03/29/2005 | US6873228 Buried self-resonant bypass capacitors within multilayered low temperature co-fired ceramic (LTCC) substrate |
| 03/29/2005 | US6873219 Printed circuit board noise attenuation using lossy conductors |
| 03/29/2005 | US6873179 Signal transmitting device suited to fast signal transmission |
| 03/29/2005 | US6873162 System and method for determining a dielectric property associated with a substrate |
| 03/29/2005 | US6873042 Plurality of power elements with gate interconnections having equal lengths |
| 03/29/2005 | US6872962 Radio frequency (RF) filter within multilayered low temperature co-fired ceramic (LTCC) substrate |
| 03/29/2005 | US6872896 Elongated bridge shunt |
| 03/29/2005 | US6872893 Wiring board provided with passive element and cone shaped bumps |
| 03/29/2005 | US6872671 Insulators for high density circuits |
| 03/29/2005 | US6872595 Technique for electrically interconnecting signals between circuit boards |
| 03/29/2005 | US6872579 Thin-film coil and method of forming same |
| 03/29/2005 | US6872468 Peelable circuit board foil |
| 03/29/2005 | US6872436 Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel |
| 03/29/2005 | US6872081 Electronic device, method of manufacturing the same and method of designing the same, and circuit board and electronic instrument |
| 03/29/2005 | US6872007 Optical line-of-sight inter-board data transfer |
| 03/29/2005 | US6871776 Manufacture of solid-solder-deposit PCB utilizing electrically heated wire mesh |
| 03/29/2005 | US6871396 Transfer material for wiring substrate |
| 03/29/2005 | US6871392 Method of constructing an integrated lead suspension |
| 03/24/2005 | WO2005027606A1 Method for manufacturing double-sided printed glass board |
| 03/24/2005 | WO2005027605A1 Method for manufacturing double-sided printed glass board |
| 03/24/2005 | WO2005027602A1 Method for manufacturing an electronic module |
| 03/24/2005 | WO2005027599A1 Methods and devices for manufacturing of electrical components and laminated structures |
| 03/24/2005 | WO2005027598A1 Flexible circuit support arrangement |
| 03/24/2005 | WO2005027597A1 Substrate for flexible printed wiring board and method for manufacturing same |
| 03/24/2005 | WO2005027596A2 Printed circuit board for a radio module |
| 03/24/2005 | WO2005027589A1 Photocontrol devices having flexible mounted photosensors and methods of calibrating the same |
| 03/24/2005 | WO2005027579A1 Heater and the method for producing the same using pcb |
| 03/24/2005 | WO2005027578A1 Warming apparatus with heater produced by pcb |
| 03/24/2005 | WO2005027221A1 Chip on flex tape with dimension retention pattern |
| 03/24/2005 | WO2005027197A2 Coupler resource module |
| 03/24/2005 | WO2005027193A2 Embedded toroidal inductors |
| 03/24/2005 | WO2005027164A1 Vehicle comprising an on-board electrical power system and a pushbutton |
| 03/24/2005 | WO2005027020A1 Electric connector and marking method |