Patents for H05K 1 - Printed circuits (98,583)
04/2005
04/19/2005US6882858 Flexible board and method of fabricating the same
04/19/2005US6882762 Waveguide in a printed circuit board and method of forming the same
04/19/2005US6882544 Thin type printed circuit board with an enclosed capacitor of a large capacitance;
04/19/2005US6882542 Electronic apparatus
04/19/2005US6882541 IC card
04/19/2005US6882538 Intelligent power module
04/19/2005US6882537 Electrical assemblage and method for removing heat locally generated therefrom
04/19/2005US6882536 Wrap-around cooling arrangement for printed circuit board
04/19/2005US6882266 Ball grid array resistor network having a ground plane
04/19/2005US6882259 Using a circuit board for ignition coil internal connections
04/19/2005US6882247 RF filtered DC interconnect
04/19/2005US6882241 Method, memory system and memory module board for avoiding local incoordination of impedance around memory chips on the memory system
04/19/2005US6882046 Single package containing multiple integrated circuit devices
04/19/2005US6882044 High speed electronic interconnection using a detachable substrate
04/19/2005US6882038 Plating tail design for IC packages
04/19/2005US6882034 Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methods
04/19/2005US6881906 Printed circuit board comprising a contact sleeve that is mounted thereon
04/19/2005US6881895 Radio frequency (RF) filter within multilayered low temperature co-fired ceramic (LTCC) substrate
04/19/2005US6881811 Improved heat resistance and low relative permittivity; insulating films for electronic devices/multilayerd wiring boards
04/19/2005US6881691 Use of zeolites in preparing low temperature ceramics
04/19/2005US6881609 Component connections using bumps and wells
04/19/2005US6881293 Process for producing a multi-layer printer wiring board
04/19/2005US6881274 Test carrier for temporarily packaging bumped semiconductor components in which contact balls on the components are protected during test procedures; made of wear resistant material
04/19/2005US6881240 Copper powder for electrically conductive paste
04/19/2005US6881096 Compact serial-to-ethernet conversion port
04/19/2005US6881078 Interconnecting device that allows for connections in small space
04/19/2005US6881076 Coaxial module with surge protector
04/19/2005US6881071 Power semiconductor module with pressure contact means
04/19/2005US6880970 Method and apparatus for isolating an ambient air temperature sensor
04/19/2005US6880955 Lamp on sheet and manufacturing method thereof
04/19/2005US6880244 Circuit board having simultaneously and unitarily formed wiring patterns and protrusions
04/19/2005US6880243 Comprising U-shaped elongated horizontal assembly having a horizontal surface, an elongated vertical member extending downward from and coupled to one of the elongated horizontal assembly members opposite the assembly's curved edge
04/14/2005WO2005034598A1 High reliability multilayer circuit substrates and methods for their formation
04/14/2005WO2005034594A1 Method of forming through hole in photosensitive glass substrate
04/14/2005WO2005034593A2 Substrate comprising a tuneable electrical component and use of the same
04/14/2005WO2005034592A1 Multilayer ceramic substrate and its manufacturing method
04/14/2005WO2005034591A1 Connection sheet
04/14/2005WO2005034578A1 Hearing aid with printed circuit board and microphone suspension
04/14/2005WO2005034293A1 Electrical connection component
04/14/2005WO2005034280A1 Dielectric resonator, oscillator and transmitter/receiver
04/14/2005WO2005034236A1 Plastically deformable cooling body for electric and/or electronic components
04/14/2005WO2005034146A1 Cable and production method therefor
04/14/2005WO2005033787A1 Device and method of making a device having a flexible layer structure
04/14/2005WO2005033216A1 Coated magnesium oxide powder capable of being highly filled and method for production thereof, and resin composition comprising the powder
04/14/2005WO2005033215A1 Spherical coated magnesium oxide powder and method for production thereof, and resin composition comprising the powder
04/14/2005WO2005033214A1 Coated magnesium oxide powder exhibiting high flowability, and resin composition comprising the powder
04/14/2005WO2005033209A1 Resin composition for composite dielectric body, composite dielectric body, and electrical circuit board using such composite dielectric body
04/14/2005WO2005033175A1 Radially multi-branched polymer and porous film using the same
04/14/2005WO2005033161A2 Epoxy resin compositions, processes utilzing same and articles made therefrom
04/14/2005WO2005033033A1 Glass component having through hole and production method therefor
04/14/2005WO2005020253A3 Printed circuit board with integrated inductor
04/14/2005WO2005012445A3 Conducting inks
04/14/2005WO2005006821A3 Component for a printed circuit board and method for fitting a printed circuit board with this component
04/14/2005WO2005004182A3 Method of layering green sheet and method of producing laminated ceramic electronic component
04/14/2005WO2005001157A3 Device and method for coating roll substrates in vacuum
04/14/2005WO2004084265A3 Led symbol signal
04/14/2005WO2004070768A3 Direct mount led lamp
04/14/2005WO2004036799B1 Pcb incorporating integral optical layers
04/14/2005US20050081049 Mobile terminal, circuit board, circuit board design aiding apparatus and method, design aiding program, and storage medium having stored therein design aiding program
04/14/2005US20050080183 Dielectrics accuracy; heat dissipation ; glass transition temperature; heat resistance; copper cladding laminate ; high speed signal transfer
04/14/2005US20050080175 Polymer/ceramic composite paste for embedded capacitor and method for fabricating capacitor using same
04/14/2005US20050079901 Hinge assembly for a multi-configuration portable electronic device
04/14/2005US20050079746 Circuit board assembly, main and connector boards, and connector pins for same
04/14/2005US20050079707 Interconnection substrate and fabrication method thereof
04/14/2005US20050079652 Method of producing multilayer wired circuit board
04/14/2005US20050079450 Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet
04/14/2005US20050079375 Peelable circuit board foil
04/14/2005US20050079338 Method of heat treatment, method for forming wiring pattern, method for manufacturing electro-optic device, and electro-optic device and electronic apparatus
04/14/2005US20050079329 Metal/ceramic bonding substrate and method for producing same
04/14/2005US20050078467 Power distribution system
04/14/2005US20050078459 Flexible printed circuit board and liquid crystal display having the same
04/14/2005US20050078458 Operating circuit for a lamp with a heat sink
04/14/2005US20050078433 Ceramic substrate for thin-film electronic components, method for producing the substrate, and thin-film electronic component employing the substrate
04/14/2005US20050078415 Integrated lead suspension and method of construction
04/14/2005US20050078207 Optical device and production method thereof
04/14/2005US20050078158 Ink-jet inks containing metal nanoparticles
04/14/2005US20050078152 Circuit board and liquid discharging apparatus
04/14/2005US20050078035 Method for forming radio frequency antenna
04/14/2005US20050077977 System and method for crosstalk reduction
04/14/2005US20050077634 Optimization of routing layers and board space requirements for a ball grid array package
04/14/2005US20050077625 Optimization of routing layers and board space requirements for a ball grid array land pattern
04/14/2005US20050077609 Circuit package and method of plating the same
04/14/2005US20050077451 Optical device and production method thereof
04/14/2005US20050077362 Stacked small memory card
04/14/2005US20050077083 Telescoping blind via in three-layer core
04/14/2005US20050077079 Printed circuit board unit with detachment mechanism for electronic component
04/14/2005US20050077078 Tear resistant flexible substrate
04/14/2005US20050077077 Chip package with degassing holes
04/14/2005DE202004020378U1 Conductive set for use in vehicle, designed in order to use insulated surface of vehicle component as replacement for insulating layer
04/14/2005DE20122323U1 Trägersubstrat für elektronische Bauteile Substrate for electronic components
04/14/2005DE10392312T5 Multichipmodul mit einem Substrat, das eine Gruppierung von Verbindungsanordnungen aufweist Multichip module having a substrate having an array of connector assemblies
04/14/2005DE10341404A1 Switch carrier e.g. for electrical switching assemblies, has substrate made from steel, having two sides and recess with dielectric applied to both sides of substrate and into recess
04/14/2005DE10340438A1 Sendemodul mit verbesserter Wärmeabführung Transmitter module with improved heat dissipation
04/14/2005DE10339417A1 Fahrzeugleuchte Vehicle light
04/14/2005DE102004043464A1 Schaltungsplatte mit einer Metallplatte, gedruckte Schaltungsplatte und flexible Schaltungsplatine Circuit board having a metal plate, printed circuit board and flexible circuit board
04/14/2005CA2484471A1 Operating circuit for a lamp with a heat sink
04/13/2005EP1523231A1 Method of producing multilayer wired circuit board
04/13/2005EP1523230A1 Circuit board assembly main and connector boards and connector pins for same
04/13/2005EP1523228A2 Mobile terminal, circuit board, circuit board design aiding apparatus and method, design aiding program, and storage medium having stored therein design aiding program
04/13/2005EP1523045A2 Optical device and production method thereof