Patents for H05K 1 - Printed circuits (98,583)
04/2005
04/13/2005EP1523042A2 Optical device and production method thereof
04/13/2005EP1523037A2 Metal/ceramic bonding substrate and method for producing same
04/13/2005EP1523018A2 Small coil and method of manufacturing the same
04/13/2005EP1522609A2 Conductive sheet having a metal layer on at least one portion of an insulating substrate, product using the same, and manufacturing method thereof
04/13/2005EP1521811A1 A method for the production of conductive and transparent nano-coatings and nano-inks and nano-powder coatings and inks produced thereby
04/13/2005EP1521713A1 Shatterproof ultra-thin glass and the handling thereof
04/13/2005EP1418833A4 In vivo sensing device with a circuit board having rigid sections and flexible sections
04/13/2005EP0931816B1 Norbornene polymer composition
04/13/2005EP0805614B1 Multilayered wiring board, prefabricated material for multilayered wiring board, process of manufacturing multilayered wiring board, electronic parts package, and method for forming conductive pillar
04/13/2005CN2692965Y Circuitboard wiring structure of information socket
04/13/2005CN2692964Y Connector and circuitboard combination using the same
04/13/2005CN2692944Y Circuitboard for wireless communication circuit
04/13/2005CN1606867A Apparatus and method for sharing signal control lines
04/13/2005CN1606805A Method for making a microcircuit card
04/13/2005CN1606582A Planarized microelectronic substrates
04/13/2005CN1606481A 金属氧化物分散体 Metal oxide dispersion
04/13/2005CN1606401A Method of producing multilayer wired circuit board
04/13/2005CN1606400A Conductive sheet, product using the same, and manufacturing method thereof
04/13/2005CN1606234A High frequency module and communication device
04/13/2005CN1606167A Optical device and production method thereof
04/13/2005CN1606159A Optical device and production method thereof
04/13/2005CN1606152A Semiconductor device and method of fabricating the same
04/13/2005CN1606103A Small coil and method of manufacturing the same
04/13/2005CN1197443C Assembly of an electronic component with spring packaging
04/13/2005CN1197442C 电子电路组件 Electronic circuit assembly
04/13/2005CN1197440C Article having a circuit soldered with parts and method for recycling wastes of the same
04/13/2005CN1197439C Printed circuit board and display device
04/13/2005CN1197211C Ic插座 Ic Socket
04/13/2005CN1197150C Semiconductor device, circuit board, method of mfg. circuit board, and electronic device
04/13/2005CN1197139C Connecting construction body
04/13/2005CN1197137C Semiconductor device and method for manufacture semiconductor equipment
04/13/2005CN1197136C Lead wire frame and method for manufacturing lead wire frame
04/13/2005CN1196957C LCD device
04/13/2005CN1196658C Isolation ceramic, multi-layer ceramic substrate and laminated electronic component
04/12/2005US6879494 Circuit package for electronic systems
04/12/2005US6879493 Module component and method of manufacturing the same
04/12/2005US6879488 Radio frequency module
04/12/2005US6879465 Integrated lead suspension and method of construction
04/12/2005US6879423 Printed circuit board assembly with multi-channel block-type optical devices packaged therein
04/12/2005US6879366 Signal processing circuit substrate used for liquid crystal display unit and method of assembling the same
04/12/2005US6879258 IC card having a mica film for stable resonance frequency and enhanced antenna properties
04/12/2005US6879236 Noise suppressor unit
04/12/2005US6879057 Electrical distribution box for vehicles having two networks with different voltage levels
04/12/2005US6879032 Folded flex circuit interconnect having a grid array interface
04/12/2005US6879011 Magnetically shielded circuit board
04/12/2005US6878901 Laser micromachining and electrical structures formed thereby
04/12/2005US6878884 Wiring board, and electronic device with an electronic part mounted on a wiring board, as well as method of mounting an electronic part on a wiring board
04/12/2005US6878782 Thermoset composition, method, and article
04/12/2005US6878643 Electronic unit integrated into a flexible polymer body
04/12/2005US6878572 High capacitance package substrate
04/12/2005US6878571 Panel stacking of BGA devices to form three-dimensional modules
04/12/2005US6878464 Glass-ceramic composite material and multilayered circuit substrate
04/12/2005US6877994 Electronic device having a USB connector
04/12/2005US6877913 Card type optical transceiver module
04/12/2005US6877912 Electro-optical circuit board having optical transmit/receive module and optical waveguide
04/12/2005US6877222 Method for manufacturing a high frequency electrical connector
04/08/2005CA2484016A1 Circuit board assembly, main and connector boards, and connector pins for same
04/07/2005WO2005032226A1 Multilayer laminated circuit board
04/07/2005WO2005032225A1 Ceramic circuit board, method for making the same, and power module
04/07/2005WO2005032224A1 Printed circuit board comprising a holding device for retaining wired electronic components, method for the production of such a printed circuit board, and use thereof in a soldering furnace
04/07/2005WO2005032223A1 Integrated structure for a flexible printed circuit boards and manufacturing method for the same
04/07/2005WO2005032130A1 Electronic device having bezel structure
04/07/2005WO2005031766A1 Multilayer board incorporating laminated magnetic components
04/07/2005WO2005031760A1 Mixed conductive powder and use thereof
04/07/2005WO2005031419A1 Optical fibers embedded in a printed circuit board
04/07/2005WO2005031418A1 Connecting a component with an embedded optical fiber
04/07/2005WO2005031417A1 Silicon based vias for optical waveguiding
04/07/2005WO2005031296A1 Data capture system and processing system for a roller bearing and roller bearing provided with said type of system
04/07/2005WO2005020254A3 Ultra-thin flexible inductor
04/07/2005WO2003073808A8 Passive transmission line equalization using circuit-board thru-holes
04/07/2005WO2002022354A8 Resin compatibilized starch-oil sizing
04/07/2005US20050075024 Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability
04/07/2005US20050074994 Circuit card
04/07/2005US20050074991 Method and apparatus for determining a position of a location dependent device
04/07/2005US20050074655 Fuel cell
04/07/2005US20050074638 having a defined curvature by positioning ceramic layers of different temperature coefficients of expansion on top of one another; and permanently bonding them; coefficients made by adding nuclei to the ceramic precursor; pressure sensors
04/07/2005US20050074627 Ceramic substrate for thin film electronic component, production method for the same and thin film electronic component using the same
04/07/2005US20050074592 Easily slidable polyimide film and substrate employing it
04/07/2005US20050074590 Dielectric ceramic composition and laminated ceramic device using the same
04/07/2005US20050074589 mixtures of liquid carrier, belts, plates, discs, wires or rods and stabilizers or antiagglomerants, that can be used to form electroconductive paths on substrates; miniaturization
04/07/2005US20050074243 Optical module
04/07/2005US20050073820 Multifunctional peripheral device
04/07/2005US20050073819 Stackable motherboard and related sensor systems
04/07/2005US20050073818 Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor
04/07/2005US20050073805 Integrated circuit package
04/07/2005US20050073789 Solid state multi-pole switching device for plug-in switching units
04/07/2005US20050073386 Small coil and method of manufacturing the same
04/07/2005US20050073049 Semiconductor device and method of fabricating the same
04/07/2005US20050073047 Conductive sheet having metal layer formed on at least a portion of surface of insulating substrate, product using the same, and manufacturing method thereof
04/07/2005US20050073044 Plastic packaging with high heat dissipation and method for the same
04/07/2005US20050073039 Semiconductor device and method of fabricating the same
04/07/2005US20050073034 Package for semiconductor chip
04/07/2005US20050072597 Bonding pad structure for a display device and fabrication method thereof
04/07/2005US20050072596 Printed circuit board for avoiding producing cutting burrs
04/07/2005US20050072595 Method of manufacturing substrate for circuit board and smart label having the substrate
04/07/2005US20050072547 Aluminum/ceramic bonding substrate and method for producing same
04/07/2005US20050071996 Solder paste stencil manufacturing system
04/07/2005US20050071990 Electronic-component alignment method and apparatus therefor
04/07/2005US20050071989 Apparatus used for manufacturing semiconductor device, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method
04/07/2005DE10343065A1 Circuit board arrangement for mobile telephones and laptops comprises a circuit board layer, a component arranged on the circuit board layer, and a positioning element formed on the circuit board layer for fixing the component on the layer