Patents for H05K 1 - Printed circuits (98,583)
04/2005
04/26/2005US6884938 Compact circuit module
04/26/2005US6884838 Aqueous solution of polyester as binder
04/26/2005US6884655 Semiconductor package, method of manufacturing the same, and semiconductor device
04/26/2005US6883933 Lighting apparatus whose light emitting elements are hard to be taken off
04/26/2005CA2357290C Resistor component with multiple layers of resistive material
04/26/2005CA2154156C A circuit board arrangement including shielding grids, and constructing thereof
04/21/2005WO2005036940A1 Telescoping blind via in three-layer core
04/21/2005WO2005036939A1 Substrate and method for producing same
04/21/2005WO2005036938A1 Electronic control unit
04/21/2005WO2005036937A2 Mechanism for disabling an electronic assembly
04/21/2005WO2005036644A2 Electronic device and carrier substrate
04/21/2005WO2005036587A2 Electronic component, circuit carrier assembly and electronic unit comprising a heat accumulator
04/21/2005WO2005036435A2 Adulteration control device for retail outlet
04/21/2005WO2005036221A1 Method for the production of electrooptical printed circuit boards comprising polysiloxane wave guides and use thereof
04/21/2005WO2005035456A2 Glass compositions, glass fibers, and methods of inhibiting boron volatization from glass compositions
04/21/2005WO2005035240A1 Peelable circuit board foil
04/21/2005WO2005021862A3 A flexible flat cable termination structure for a clockspring
04/21/2005WO2004109719A3 Polymer thick film resistor, layout cell, and method
04/21/2005WO2004082345A3 Method and device for aligning a substrate and a printing screen during solder paste printing
04/21/2005US20050086418 Circuit and system for accessing memory modules
04/21/2005US20050086413 Capacity Expansion of Flash Memory Device with a Daisy-Chainable Structure and an Integrated Hub
04/21/2005US20050085108 Bent wafer and PCB assembly for refrigerator provided with the same
04/21/2005US20050085105 Arrangement for producing an electrical connection between a BGA package and a signal source, and method for producing such a connection
04/21/2005US20050085104 Arrangement for connecting the terminal contacts of an electronic component to a printed circuit board and conductor support for such an arrangement
04/21/2005US20050085103 High speed, high density interconnect system for differential and single-ended transmission systems
04/21/2005US20050085013 Ball grid array resistor network
04/21/2005US20050085011 Thermally enhanced packaging structure and fabrication method thereof
04/21/2005US20050085007 Joining material stencil and method of use
04/21/2005US20050084675 Sizing composition for glass fibers
04/21/2005US20050084661 immersion of conductors in lead-free liquid containing metals, group 1B and acyclic oxy acid and salts, then precipitating the metals on the surfaces and coating in electroless plating solutions; supports for semiconductors, capacitors or resistors
04/21/2005US20050083742 Packaging structure of a driving circuit for a liquid crystal display device and packaging method of a driving circuit for a liquid crystal display device
04/21/2005US20050083666 Fitting substrate for connection and fitting substrate for connection for use in disk array control apparatus
04/21/2005US20050083665 Power conversion module device and power unit using the same
04/21/2005US20050083664 Sockets for module extension and memory system using same
04/21/2005US20050083663 Electronic device and method for manufacturing the same
04/21/2005US20050083590 Lens barrel and imaging apparatus
04/21/2005US20050083502 Exposure device
04/21/2005US20050083473 Liquid crystal display module
04/21/2005US20050083163 ESD protection devices and methods of making same using standard manufacturing processes
04/21/2005US20050083152 Signal transmission structure
04/21/2005US20050083148 Signal transmission structure
04/21/2005US20050083147 Circuit board and method in which the impedance of a transmission-path is selected by varying at least one opening in a proximate conductive plane
04/21/2005US20050082686 Circuitized substrate for fixing solder beads on pads
04/21/2005US20050082671 Ball grid array resistor network
04/21/2005US20050082663 Semiconductor device and semiconductor module
04/21/2005US20050082648 Ceramic package and chip resistor, and method for manufacture thereof
04/21/2005US20050082580 Structure of wafer level package with area bump
04/21/2005US20050082377 Oven controlled crystal oscillator for high stability
04/21/2005US20050082280 Flexible electric circuit for heating comprising a metallised fabric
04/21/2005US20050082089 Stacked interconnect structure between copper lines of a semiconductor circuit
04/21/2005US20050082088 Apparatus and method for improving coupling across plane discontinuities on circuit boards
04/21/2005US20050082087 Dielectric structure for printed circuit board traces
04/21/2005US20050082086 Unbending printed circuit board
04/21/2005US20050081913 Apparatus comprising electronic and/or optoelectronic circuitry and method for realizing said circuitry
04/21/2005US20050081377 Method for forming an electronic assembly
04/21/2005US20050081349 Embedded capacitor structure in circuit board and method for fabricating the same
04/21/2005DE10392507T5 Wärmehärtbare Harzzusammensetzung und Prepreg und laminierte Platte unter Verwendung desselben The same thermosetting resin composition and prepreg and laminated board using
04/21/2005CA2578839A1 Adulteration control device for retail outlet
04/20/2005EP1524893A1 Electronic control unit, in particular for motor vehicles, with improved heat dissipation system
04/20/2005EP1524892A2 Operating circuit with heat sink for lamp
04/20/2005EP1524691A2 Power unit comprising a heat sink, and assembly method
04/20/2005EP1524335A1 Copper electrolyte comprising amine compound having specific skeleton and organic sulfur compound and electrolytic copper foil prepared using the same
04/20/2005EP1524298A1 Sulfone polymer composition
04/20/2005EP1524297A1 Sulfone polymer composition
04/20/2005EP1524060A2 Methods of positioning components using liquid prime movers and related structures
04/20/2005EP1523869A1 Process for creating vias for circuit assemblies
04/20/2005EP1523867A1 Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions
04/20/2005EP1523791A1 Suppressor device
04/20/2005EP1523683A1 Assembling method and sensor assembly including stacked printed circuit boards with common attachment
04/20/2005EP1314172B1 Method for producing a large-mass ohmic resistor for protecting electronic assemblies from surges, and an electronic assembly
04/20/2005CN1608400A Chip scale stacking system and method
04/20/2005CN1608320A Package for a non-volatile memory device including integrated passive devices and method for making the same
04/20/2005CN1608316A High density area array solder microjoining interconnect structure and fabrication method
04/20/2005CN1608298A Use of conductor compositions in electronic circuits
04/20/2005CN1608296A Electro-conductive composition, electro-conductive coating and method for producing the coating
04/20/2005CN1608225A Flip-chip opto-electronic circuit
04/20/2005CN1608100A Resin composition, prepreg, laminate, and semiconductor package
04/20/2005CN1607897A Technique for interconnecting multilayer circuit boards
04/20/2005CN1607895A Flexible printed circuit board and liquid crystal display having the same
04/20/2005CN1607894A Flexible base boards
04/20/2005CN1607893A Method for making resistor on base plate
04/20/2005CN1607892A Method for reinforcing the connection of flat cable member and method for manufacturing image display unit
04/20/2005CN1607891A Electrostatic discharge protecting conductor
04/20/2005CN1607890A Printed circuit board without rough cutting edge
04/20/2005CN1607586A Recording/playback apparatus with electric wave transmission
04/20/2005CN1198498C Element mounting system and mounting method
04/20/2005CN1198492C Method for manufacturing PC board and used substrate therein
04/20/2005CN1198491C Printed wiring substrate structure and manufacturing method thereof
04/20/2005CN1198490C Laser processing method and processing device
04/20/2005CN1198489C Manufacturing method of high frequency assembly
04/20/2005CN1198488C Electro-deposition copper foil through surface processing and its producing method and use
04/20/2005CN1198487C Module substrate and its manufacturing method
04/20/2005CN1198486C Printed-wiring board with cavity for mounting electronic component
04/20/2005CN1198401C R-T unit
04/20/2005CN1198333C Circuit board and its making method and high-output module
04/20/2005CN1198332C Wiring beard, semiconductor device, and method of mfg. wiring board
04/20/2005CN1197830C Porous silicon nitride ceramic and its manufacturing method
04/20/2005CN1197822C Insulation ceramic press block
04/20/2005CN1197702C Aerogel substrate and method for preparing the same
04/19/2005US6883157 BWB transmission wiring design system