Patents for H05K 1 - Printed circuits (98,583)
05/2005
05/05/2005US20050095435 Crosslinking using brominated bisphenol a,or diglycidyl ether thereof; laminate for electronics, printed circuits
05/05/2005US20050095434 Halogen-free flame retarders; mixture of polymaleimide with epoxy , phenolic resin
05/05/2005US20050095410 Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating
05/05/2005US20050094922 Printed circuit board including waveguide and method of producing the same
05/05/2005US20050094833 Encapsulated composite electrostatic loudspeaker stator
05/05/2005US20050094832 Method of mounting condenser microphone on main PCB and condenser microphone adapted for the same
05/05/2005US20050094465 Printed circuit board memory module with embedded passive components
05/05/2005US20050094425 Double-high memory ststem compatible with termination schemes for single-high memory systems
05/05/2005US20050094392 Light reflector and barrier for light emitting diodes
05/05/2005US20050094383 Substrate for use in forming electronic package
05/05/2005US20050094382 Connection pad layouts
05/05/2005US20050094381 Substrate includes an amorphous glass phase having a positive coefficient of thermal expansion, a crystal phase including microcrystallites having a negative coefficient of thermal expansion, mean size < than 4 lambda R.,after surface treatment, has high spatial frequency roughness < than lamda R/30 rms
05/05/2005US20050094356 Circuit assembly, producing method of the same, distribution unit and bus bar substrate
05/05/2005US20050093672 Electronic transformer/inductor devices and methods for making same
05/05/2005US20050093661 Printed bandpass filter for a double conversion tuner
05/05/2005US20050093642 Circuit board transmitting high frequency signal
05/05/2005US20050093558 Carrier for cleaning sockets for semiconductor components having contact balls
05/05/2005US20050093153 BGA package with component protection on bottom
05/05/2005US20050093133 High density microvia substrate with high wireability
05/05/2005US20050093132 RFIC die-package configuration
05/05/2005US20050093129 Semiconductor device and manufacturing method thereof
05/05/2005US20050093120 Detachable on package voltage regulation module
05/05/2005US20050093114 Tape circuit substrate and semiconductor apparatus employing the same
05/05/2005US20050093071 Substrate based ESD network protection for a flip chip
05/05/2005US20050092849 Information card with fault tolerant printing of encoded information
05/05/2005US20050092814 Electrical circuit apparatus and method
05/05/2005US20050092521 Microvia structure and fabrication
05/05/2005US20050092520 Printed circuit board with low noise
05/05/2005US20050092518 Multilayer printed wiring board and its manufacturing method
05/05/2005US20050092513 Grouped element transmission channel link termination assemblies
05/05/2005US20050092508 Circuit device
05/05/2005US20050092478 Metal foam heat sink
05/04/2005EP1528847A1 Heat dissipating insert, circuit comprising said insert and production method
05/04/2005EP1528083A1 Flame retardant resin composition, process for producing the same, flame-retardant-resin formed article, and process for producing flame-retardant fine particle
05/04/2005EP1527659A1 Method for producing electric conductive structures for use in high-frequency technology
05/04/2005EP1527464A1 Device comprising a circuit arrangement with an inductive element
05/04/2005EP1527027A1 Glass/ceramic composite material, ceramic film, layer composite, or microhybrid comprising said composite material and method for production thereof
05/04/2005EP1474959B1 Method for embedding a component in a base and forming a contact
05/04/2005EP1460890B1 Method of soldering the constituent layers of a multilayer printed circuit and the machine used for same
05/04/2005EP1401659A4 Corrosion prevention for cac component
05/04/2005EP1061784A4 Radio-electronic unit
05/04/2005EP0776538B1 Electric power distribution system
05/04/2005DE202005002177U1 Electrical control device for automotive applications with electrical component secured to circuit board via retaining elements having security element preventing loss of component secured to circuit board via solder connections
05/04/2005CN2698017Y Printed circuit board with contact surface for connecting with antenna
05/04/2005CN1612670A Earthing structure for electronic card connector
05/04/2005CN1612669A Printed circuit board capable of preventing high temperature warping
05/04/2005CN1612668A High-radiating multi-layer circuit board
05/04/2005CN1612366A Low cost lighting circuits manufactured from conductive loaded resin-based materials
05/04/2005CN1612337A 存储器系统和存储器模块 Memory systems and memory modules
05/04/2005CN1612329A Circuit-component carrying substrate
05/04/2005CN1612310A Manufacturing method of semiconductor device and semiconductor device
05/04/2005CN1612273A Film capacitor, built-in high-density assembled substrate thereof and method for making said film capacitor
05/04/2005CN1612048A Method for making printed circuit board
05/04/2005CN1611929A Method and apparatus for improving defective solder joint detection using x-ray inspection of printed assemblies
05/04/2005CN1200467C Surface mounted electronic elements
05/04/2005CN1200459C Electronic equipment
05/04/2005CN1199765C Circuit base board production method
05/03/2005US6889367 Differential via pair impedance verification tool
05/03/2005US6889304 Memory device supporting a dynamically configurable core organization
05/03/2005US6889155 High frequency module board device
05/03/2005US6888723 LED lamp apparatus
05/03/2005US6888427 Flex-circuit-based high speed transmission line
05/03/2005US6888360 Surface mount technology evaluation board having varied board pad characteristics
05/03/2005US6888255 Built-up bump pad structure and method for same
05/03/2005US6888242 Color contacts for a semiconductor package
05/03/2005US6888227 Apparatus for routing signals
05/03/2005US6888218 Embedded capacitor multi-chip modules
05/03/2005US6888071 Layout structure and method for supporting two different package techniques of CPU
05/03/2005US6888061 Feedthrough interconnection assembly
05/03/2005US6887967 Polyimide resin produced by reacting a prepolymer with an isocyanate group at the end obtained by reacting a polyisocyanate compound with a polyol compound having a linear hydrocarbon structure with an anhydride
05/03/2005US6887950 Phosphine oxide hydroxyaryl mixtures with novolac resins for co-curing epoxy resins
05/03/2005US6887792 Embossed mask lithography
05/03/2005US6887738 Method of making semiconductor device with flip chip mounting
05/03/2005US6887580 Adhesive polyimide resin and adhesive laminate
05/03/2005US6887574 Curable flame retardant epoxy compositions
05/03/2005US6887560 Multilayer flexible wiring circuit board and its manufacturing method
05/03/2005US6887330 Machine for punching out electronic circuitry parts, method for replacing tape supply reels, and method for producing electronic circuitry parts from tape
05/03/2005US6887109 Electrical adapter for protecting electrical interfaces
05/03/2005US6887096 Connector, electronic equipment and control method for electronic equipment
05/03/2005US6886751 Compact display assembly
05/03/2005US6886248 Conductive material and method for filling via-hole
05/03/2005US6886246 Method for making an article having an embedded electronic device
05/03/2005US6886243 Method for manufacturing a flat panel display module
04/2005
04/28/2005WO2005039263A1 Multi-layer ceramic substrate, method for manufacturng the same and electronic device using the same
04/28/2005WO2005039262A1 Method of producing module with embedded component and module with embedded component
04/28/2005WO2005039260A1 Electronic device and method of manufacturing thereof
04/28/2005WO2005039259A1 Ceramic substrates having integrated mechanical structures for direct capture of optical components
04/28/2005WO2005039258A1 Polyimide resin base material and wiring board therefrom
04/28/2005WO2005039257A1 Circuit board
04/28/2005WO2005039256A1 Printed circuit board including a fuse
04/28/2005WO2005039254A2 Electrical circuit apparatus and method for assembling same
04/28/2005WO2005038986A2 Electrical circuit apparatus and methods for assembling same
04/28/2005WO2005038976A1 Electrical adaptation network comprising a transformation line
04/28/2005WO2005038825A1 Varnish for insulating film and insulating film
04/28/2005WO2005038702A2 Method for production of a card with a double interface and microcircuit card obtained thus
04/28/2005WO2005037538A1 Copper-clad laminate
04/28/2005WO2005011342A3 Embedded directional impedance control channels for pc boards
04/28/2005WO2005010808A3 Memory card with raised portion
04/28/2005WO2004113427A3 Nanoporous laminates
04/28/2005WO2004107826A3 Multi functional timepiece module with application specific printed circuit boards