Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
11/2005
11/02/2005EP1268665B1 Flame retardant phosphorus element-containing epoxy resin compositions
11/02/2005EP0776385B1 High fatigue ductility electrodeposited copper foil
11/02/2005CN2738524Y Photoelectric integration plate
11/02/2005CN1692687A Multichip module including substrate with an array of interconnect structures
11/02/2005CN1692683A Circuit board with plug connector
11/02/2005CN1692507A Light-emitting apparatus
11/02/2005CN1692496A Electronic member, method for making the same, and semiconductor device
11/02/2005CN1692283A Sheet-form connector and production method and application therefor
11/02/2005CN1692248A 发光模块 Emitting module
11/02/2005CN1692090A Process for the manufacture of metal-ceramic compound material in particular metal-ceramic substrates and metal-ceramic compound material especially metal-ceramic substrate manufactured according to t
11/02/2005CN1692006A Laminates
11/02/2005CN1692003A Sheet-cutting apparatus
11/02/2005CN1691877A Manufacturing method of laminated substrate, and semiconductor device for module and manufacturing apparatus
11/02/2005CN1691874A Method for manufacturing embedded film resistor of printed circuit board
11/02/2005CN1691872A Electronic circuit board
11/02/2005CN1691871A Multilayer substrate including components therein
11/02/2005CN1691492A Power module and electric transportation apparatus incorporating the same
11/02/2005CN1691433A Alien next compensation for adjacently placed connectors
11/02/2005CN1691343A Structure of image sensor module and wafer level package and its forming method
11/02/2005CN1691313A Power module and method of manufacturing the same
11/02/2005CN1691223A Inductor and transformer
11/02/2005CN1691216A Ru-M-O micropowder, its production method, thick film resistor composition using same
11/02/2005CN1690813A Coupling structure of electronic components
11/02/2005CN1690746A Method and structure for coupling optical fibers with printed wiring board embedded waveguides
11/02/2005CN1690136A Ink jet printable thick film ink compositions and processes
11/02/2005CN1690015A Method for producing dielectric ceramic powder and method for producing composite dielectric material
11/02/2005CN1225951C Copper alloy foil for laminated plate
11/02/2005CN1225949C Printed circuit board
11/02/2005CN1225785C Wiring base board and method for producing belt type wiring base board
11/02/2005CN1225730C Optical pickup equipment and disc equipment
11/02/2005CN1225508C Laminate for PC board and resin composition for mfg. same
11/02/2005CN1225502C Laminate for printed circuit board and resin composition for producing same
11/01/2005US6961515 PTC heater with flexible printed circuit board
11/01/2005US6961285 Drug delivery management system
11/01/2005US6961245 High frequency module
11/01/2005US6961231 Interposer providing low-inductance decoupling capacitance for a packaged integrated circuit
11/01/2005US6961230 Capacitor, capacitor equipped semiconductor device assembly, capacitor equipped circuit substrate assembly and electronic unit including semiconductor device, capacitor and circuit substrate
11/01/2005US6961110 Display device
11/01/2005US6960822 Solder mask and structure of a substrate
11/01/2005US6960758 Encoder system and method of assembling an encoder system
11/01/2005US6960735 Multi-shot molded touch switch
11/01/2005US6960636 Does not require solvent to provide viscosity for handling; low moisture uptake; for adhesives
11/01/2005US6960420 Photosensitive resin composition, process for forming relief pattern, and electronic component
11/01/2005US6960391 Carrier-attached copper foil and printed board using the copper foil
11/01/2005US6960366 Plated terminations
11/01/2005US6960282 Apparatus for cleaning residual material from an article
11/01/2005US6959856 Solder bump structure and method for forming a solder bump
10/2005
10/27/2005WO2005101941A1 Electromagnetic wave absorber
10/27/2005WO2005101937A1 Process for manufacturing a power electronic appliance by bending
10/27/2005WO2005101935A1 Connection structure of inner conductor and multilayer substrate
10/27/2005WO2005101934A1 Composite electronic component and method for producing the same
10/27/2005WO2005101928A1 Hybrid printed circuit board assembly system for the compact assembly of electric components
10/27/2005WO2005101588A1 Electrical connector with improved crosstalk compensation
10/27/2005WO2005101565A1 Miniature broadband switched filter bank
10/27/2005WO2005101503A2 Device, in particular intelligent power module with planar connection
10/27/2005WO2005101501A1 Housing formed by a metallic layer
10/27/2005WO2005101495A1 Flexible printed circuit board for mounting semiconductor chip
10/27/2005WO2005101493A2 Improved bonding arrangement and method for ltcc circuitry
10/27/2005WO2005101458A2 Method and use of a device for applying coatings onto band-shaped structures during the production of semiconductor components
10/27/2005WO2005101427A1 Conducting metal nano particle and nano-metal ink containing it
10/27/2005WO2005101352A1 Display
10/27/2005WO2005101183A1 Interchangeable graphics card for a computing device
10/27/2005WO2005100448A1 Resin curable with actinic energy ray, photocurable/thermosetting resin composition containing the same, and cured article obtained therefrom
10/27/2005WO2005100435A1 Epoxy resin composition
10/27/2005WO2005100433A1 Thermosetting resin composition, laminated body using it, and circuit board
10/27/2005WO2005100432A1 A thermosetting resin composition and its article
10/27/2005WO2005099941A1 Colloidal solution of fine metal particles, electroconductive pasty material, electroconductive ink material and method for producting them
10/27/2005WO2005099939A1 Silver powder coated with silver compound and manufacturing method thereof
10/27/2005WO2005088730A3 Method for forming a structure
10/27/2005WO2005082034A3 An interconnect structure and method for connecting buried signal lines to electrical devices
10/27/2005WO2005069681A8 A condenser microphone mountable on main pcb
10/27/2005WO2005050546A3 Acoustic wave touch detecting apparatus
10/27/2005WO2005025001A8 Embedded rf vertical interconnect for flexible conformal antenna
10/27/2005US20050240888 Multiple propagation speeds of signals in layered circuit apparatus
10/27/2005US20050240020 Functional fluorescent dyes
10/27/2005US20050239418 Radio frequency transceivers
10/27/2005US20050239347 Structure for repairing or modifying surface connections on circuit boards
10/27/2005US20050239342 Light emitting module
10/27/2005US20050239338 Alien next compensation for adjacently placed connectors
10/27/2005US20050239236 Printed circuit board and fabrication method thereof
10/27/2005US20050238896 Polyimide film and method for production thereof, and polyimide/metal laminate using polyimide
10/27/2005US20050238889 Layered components, materials, methods of production and uses thereof
10/27/2005US20050238878 Device mounting board
10/27/2005US20050238858 Printed circuit board
10/27/2005US20050238804 Nano-powder-based coating and ink compositions
10/27/2005US20050238278 Material for substrate mounting optical circuit-electric circuit mixedly and substrate mounting optical circuit-electric circuit mixedly
10/27/2005US20050237776 System and method for patient controlled communication of DICOM protected health information
10/27/2005US20050237760 Vehicular lamp
10/27/2005US20050237739 Illumination panel with reverse mounted solid-state light generating source array
10/27/2005US20050237725 Flexible printed circuit board
10/27/2005US20050237722 Power module comprising at least two substrates and method for producing the same
10/27/2005US20050237695 Method for producing dielectric ceramic powder and method for producing composite dielectric material
10/27/2005US20050237663 Insulator with pocket features
10/27/2005US20050237136 Electronic circuit board having microstrip lines
10/27/2005US20050237126 Printed wiring board
10/27/2005US20050236973 Electroluminescent assembly
10/27/2005US20050236706 Semiconductor device and hybrid integrated circuit device
10/27/2005US20050236603 Conductive ink
10/27/2005US20050236182 Board for printed wiring, printed wiring board, and method for manufacturing them
10/27/2005US20050236181 Novel ECP method for preventing the formation of voids and contamination in vias
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