Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
11/2005
11/08/2005US6963491 Expansion board apparatus and removing method
11/08/2005US6963483 Self-aligned coaxial via capacitors
11/08/2005US6963438 Rearview mirror constructed for efficient assembly
11/08/2005US6963265 Ball grid array resistor network having a ground plane
11/08/2005US6963259 High efficiency resonant line
11/08/2005US6963255 Power splitter
11/08/2005US6963209 Apparatus and method for calibrating equipment for high frequency measurements
11/08/2005US6963143 Method of ball grid array (BGA) alignment, method of testing, alignment apparatus and semiconductor device assembly
11/08/2005US6963034 Multilayer printed board with a double plane spiral interconnection structure
11/08/2005US6963033 Ball grid array attaching means having improved reliability and method of manufacturing same
11/08/2005US6963028 IC module, and wireless information-storage medium and wireless information-transmitting/receiving apparatus including the IC wireless
11/08/2005US6962872 High density chip carrier with integrated passive devices
11/08/2005US6962770 Photosensitive paste; exposure, development, baking cycles
11/08/2005US6962753 comprising soft magnetic powder mixed with an organic binding agent and having an electromagnetic interference suppressing effect, powder excellent in thermal conductivity is further dispersed into the organic binding agent
11/08/2005US6962744 Bifunctional phenylene ether oligomer, its derivatives, its use and process for the production thereof
11/08/2005US6962726 Method for preparing substrate for flexible print wiring board, and substrate for flexible print wiring board
11/08/2005US6962613 Low-temperature fabrication of thin-film energy-storage devices
11/08/2005US6961995 Absorbs the stresses that occur between a chip carrier and a printed wiring board during thermal cycling
11/08/2005CA2171749C Electrical assembly comprising a ptc resistive element
11/03/2005WO2005104637A1 Method and apparatus for accurately applying structures to a substrate
11/03/2005WO2005104636A1 Electronics module and method for manufacturing the same
11/03/2005WO2005104635A1 Heat conduction from an embedded component
11/03/2005WO2005104567A1 Patch panel with modules
11/03/2005WO2005104408A1 Wireless communications devices including circuit substrates with partially overlapping conductors thereon coupling power to/from power amplifier systems
11/03/2005WO2005104324A2 Folded, fully buffered memory module
11/03/2005WO2005104303A1 Wiring branch unit
11/03/2005WO2005104231A2 Multi-substrate circuit assembly
11/03/2005WO2005104230A1 Wiring board, semiconductor device and wiring board manufacturing method
11/03/2005WO2005104229A1 Power semiconductor arrangement
11/03/2005WO2005104227A1 Stacked module systems and methods
11/03/2005WO2005104226A2 Method for production of through-contacts in a plastic mass and semiconductor component with said through contacts
11/03/2005WO2005104149A1 Systems and methods for blocking microwave propagation in parallel plate structures utilizing cluster vias
11/03/2005WO2005103649A1 Method of assessing the risk of whiskers appearing on the surface of a metallic deposit
11/03/2005WO2005103564A1 Led light source module packaged with metal
11/03/2005WO2005103376A1 Aramid paper blend
11/03/2005WO2005102629A1 Punching machine for flexible printed circuit board
11/03/2005WO2005072031A3 Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
11/03/2005WO2005048664B1 High temperature circuits
11/03/2005WO2004079795A3 Coaxial waveguide microstructures and methods of formation thereof
11/03/2005US20050246471 High frequency bus system
11/03/2005US20050245105 Interconnection system
11/03/2005US20050245103 Transceiver module having a flexible circuit
11/03/2005US20050245004 Method for manufacturing wiring substrate and method for manufacturing electronic device
11/03/2005US20050244999 Method, system and apparatus for constructing resistive vias
11/03/2005US20050244677 Hybrid electronic device comprising a low-temperature-cofired-ceramic ltcc-tape
11/03/2005US20050244662 Fluoropolymer composites containing two or more ceramic fillers to achieve independent control of dielectric constant and dimensional stability
11/03/2005US20050244622 Method for processing by laser, apparatus for processing by laser, and three-dimensional structure
11/03/2005US20050244621 Printed circuit board and method for processing printed circuit board
11/03/2005US20050244620 Wired circuit board and production method thereof
11/03/2005US20050244095 Integrated optical sub-assembly having epoxy chip package
11/03/2005US20050243558 LED assembly with reverse circuit board
11/03/2005US20050243536 Printed circuit board, parts mounting method and mounting position verifying method
11/03/2005US20050243532 Packaging structure of electronic card
11/03/2005US20050243530 Printed circuit board and liquid crystal display device having the same
11/03/2005US20050243529 Microelectronic connection components having bondable wires
11/03/2005US20050243528 Board pieces and composite wiring boards using the board pieces
11/03/2005US20050243527 Printed wiring board with enhanced structural integrity
11/03/2005US20050243130 Flexible printhead circuit
11/03/2005US20050242997 Dielectric sheet, method for fabricating the dielectric sheet, printed circuit and patch antenna using the dielectric sheet, and method for fabricating the printed circuit
11/03/2005US20050242961 Signal receiving apparatus
11/03/2005US20050242913 Packaging techniques for a high-density power converter
11/03/2005US20050242437 Method and apparatus for supporting microelectronic substrates
11/03/2005US20050242423 Stacked module systems and methods
11/03/2005US20050242409 Imagine sensor with a protection layer
11/03/2005US20050242408 Structure of image sensor module and a method for manufacturing of wafer level package
11/03/2005US20050241983 Monitored medication package
11/03/2005US20050241854 Layered structure with electric leads for a body worn device
11/03/2005US20050241852 Cross-connecting by permutations using configurable printed circuits
11/03/2005US20050241851 Pin grid array package carrier and process of mounting passive component thereon
11/03/2005US20050241850 Method and structures for implementing customizable dielectric printed circuit card traces
11/03/2005US20050241849 Circuit board
11/03/2005US20050241848 Design and Method for plating PCI express (PCIE) edge connector
11/03/2005US20050241506 Method for printing an electronic circuit component on a substrate using a printing machine
11/03/2005US20050241401 Overstress indication
11/03/2005US20050241128 Method of laminating low temperature co-fired ceramic (LTCC) material and product formed thereby
11/03/2005DE10356882A1 Verfahren zur Herstellung eines elektromechanischen Bauteils A process for producing an electromechanical component
11/03/2005DE102005016830A1 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation
11/03/2005DE102005008491A1 Harzgekapselte Halbleitervorrichtung und Verfahren zu ihrer Herstellung Resin-encapsulated semiconductor device and process for their preparation
11/03/2005DE102004016480A1 Vollintegrierte hybride optisch-elektrische Leiterplatte Fully integrated hybrid optical-electrical circuit board
11/03/2005DE102004014438A1 Leiterplattennutzen mit einer Vielzahl an Schaltungsträgern, Schaltungsträger und Verfahren zum Vereinzeln von Schaltungsträgern aus einem Leiterplattennutzen Circuit board panel with a plurality of circuit boards, interconnect devices and methods for separating of circuit carriers from a circuit board panel
11/03/2005DE10164880B4 Wiring board e.g. for mobile communications device or computer, has insulating pattern formed on substrate, intersecting wiring pattern to define electrode
11/03/2005CA2561505A1 Patch panel with modules
11/03/2005CA2561329A1 Aramid paper blend
11/03/2005CA2505362A1 Change-over switching using configurable printed circuit boards
11/02/2005EP1592290A1 Wired circuit board and production method thereof
11/02/2005EP1592289A1 Method for fabricating embedded thin film resistors
11/02/2005EP1592288A1 Printed circuit board
11/02/2005EP1592124A2 Radio-frequency circuit module and radio communication apparatus
11/02/2005EP1592097A2 Connector with cross-talk compensation
11/02/2005EP1592071A1 Optical semiconductor bare chip, printed wiring board, lighting unit and lighting device
11/02/2005EP1592063A2 Assembly in pressure contact with a power semiconductor module
11/02/2005EP1592062A1 Multi-level package for a memory module
11/02/2005EP1592061A2 Multilayer substrate including components therein
11/02/2005EP1590997A1 A shielding arrangement
11/02/2005EP1590995A1 Heat dissipating arrangement for an electronic appliance
11/02/2005EP1590994A2 Metal base wiring board for retaining light emitting elements, light emitting source, lighting apparatus, and display apparatus
11/02/2005EP1590933A2 Transmission line conductor arrangement
11/02/2005EP1590500A2 Method of forming a conductive metal region on a substrate
11/02/2005EP1590416A1 Method for gluing fpcb's
11/02/2005EP1590415A1 Thermo-activated adhesive material for fpcb agglutinations
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