Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
10/2005
10/27/2005US20050236180 Laminate ceramic circuit board and process therefor
10/27/2005US20050236179 Circuit board device and method for board-to-board connection
10/27/2005US20050236178 Fusion bonded assembly with attached leads
10/27/2005US20050236177 Multilayer printed wiring board
10/27/2005US20050236176 Circuit board with identifiable information and method for fabricating the same
10/27/2005US20050235490 Printed circuit board defective area transplant repair method
10/27/2005DE202005011948U1 Electronic component facility for manufacturing electronic subassemblies and/or printed circuit boards uses a programmable device to position a boring head for chips
10/27/2005DE19931944B4 Umlenkende Auskopplung in einer Leiterplatte eingebetteter Lichtleiter Deflecting coupling in a circuit board embedded optical fiber
10/27/2005DE10393395T5 Schaltungsmaterialien, Schaltungen, mehrschichtige Schaltungen und Herstellungsverfahren davon Circuit materials, circuits, multilayer circuits and manufacturing method thereof
10/27/2005DE10200853B4 Optische Lage mit optischen Leitern, Leiterplatte, Herstellungsverfahren für optische Lage mit optischen Leitern und Herstellungsverfahren für Leiterplatte Optical layer with optical conductors, circuit board manufacturing method for optical layer with optical fibers and manufacturing methods for PCB
10/27/2005DE102005016538A1 Laserbearbeitungsvorrichtung für ein plattenförmiges Werkstück A laser machining apparatus for a plate-shaped workpiece
10/27/2005DE102004016205A1 Leiterplatte sowie Verfahren zum Herstellen einer solchen Printed circuit board as well as methods for producing such
10/27/2005DE102004015837A1 Elektrische Verbindungseinrichtung für Einspritzeinrichtungen von Verbrennungsmotoren Electrical connecting device for injectors of internal combustion engines
10/27/2005CA2562936A1 Epoxy resin composition
10/26/2005EP1589799A1 Multi-layer ceramic substrate and method for manufacture thereof
10/26/2005EP1589798A1 Multilayer printed board, electronic apparatus, and packaging method
10/26/2005EP1589797A2 Manufacturing method of laminated substrate, and manufacturing apparatus of semiconductor device for module and laminated substrate for use therein
10/26/2005EP1589796A1 Member for circuit board, method for manufacturing circuit board, apparatus for manufacturing circuit board
10/26/2005EP1589795A1 Laminate ceramic circuit board and process therefor
10/26/2005EP1589794A1 Flexible printed circuit board
10/26/2005EP1589618A1 Electronic device with a contact pin and method for producing such a device
10/26/2005EP1589582A1 Wiring substrate and radiation detector using same
10/26/2005EP1589581A1 Wiring substrate and radiation detector using same
10/26/2005EP1589540A1 Conductive paste, method for producing same, circuit board using such conductive paste and method for producing same
10/26/2005EP1589073A1 Composite deelectric material and substrate
10/26/2005EP1589065A1 Method for producing dielectric ceramic powder and method for producing composite dielectric material
10/26/2005EP1589054A1 Polymerizable composition, thermoplastic resin composition, crosslinked resin, and crosslinked resin composite materials
10/26/2005EP1588596A2 Circuit board stiffener
10/26/2005EP1588319A1 Module for a hybrid card
10/26/2005EP1269505B1 Inverted board mounted electromechanical device
10/26/2005EP1164335B1 Remote controller for air conditioner
10/26/2005EP1105716B1 Inspection of printed circuit boards using color
10/26/2005EP1082473B1 Plasma catalysis of carbon nanofibers
10/26/2005CN2737116Y 3D moulding insulator
10/26/2005CN1689381A Method for the manufacture of printed circuit boards with integral plated resistors
10/26/2005CN1689186A Proton-conducting membrane and use thereof
10/26/2005CN1689175A Film comprising organic semiconductors
10/26/2005CN1688946A Power control for instrumented medication package
10/26/2005CN1688912A Coupling to waveguides that are embedded in printed circuit boards
10/26/2005CN1688870A Dial module, manufacturing method thereof, LED display element, display module, movement module, connector module, and meter using them
10/26/2005CN1688515A Low-temperature, fluoride free fiber glass compositions and products made using same
10/26/2005CN1225157C RF tuner apparatus
10/26/2005CN1225154C Method for producing circuit board
10/26/2005CN1225153C Circuit board device and its mounting method
10/26/2005CN1225063C Demountable clamping mechanism for land grid array connectors
10/26/2005CN1225023C Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer
10/26/2005CN1224989C Surface-mounted capacitor
10/26/2005CN1224963C Method for mfg. support arm assembly of record head
10/26/2005CN1224844C Low-intensity magnetic field sensor using printed circuit board mfg. thchnology and its mfg. method
10/26/2005CN1224516C Ink box, related size reducing method, printing apparatus and circuit
10/26/2005CN1224511C Structure and making method of flexible circuit board for ink-jet printing head
10/26/2005CA2505116A1 Alien next compensation for adjacently placed connectors
10/25/2005US6959353 Signal bus arrangement
10/25/2005US6958941 Circuit board and information storing apparatus equipped therewith
10/25/2005US6958731 Circuit board and SMD antenna for this
10/25/2005US6958666 Filtering circuit and power supply device equipped with same
10/25/2005US6958535 Thermal conductive substrate and semiconductor module using the same
10/25/2005US6958533 High density 3-D integrated circuit package
10/25/2005US6958531 Multi-substrate package and method for assembling same
10/25/2005US6958527 Wiring board having interconnect pattern with land, and semiconductor device, circuit board, and electronic equipment incorporating the same
10/25/2005US6958445 Electromagnetic interference shield for electronic devices on a circuit board
10/25/2005US6958262 Mounting structure of semiconductor device and mounting method thereof
10/25/2005US6957967 Electrical connector with different pitch terminals
10/20/2005WO2005099331A1 Module component and manufacturing method thereof
10/20/2005WO2005099329A1 Rigid-flexible board and manufacturing method thereof
10/20/2005WO2005099328A1 Circuit board and manufacturing method thereof
10/20/2005WO2005099327A1 A method of creating solder bar connections on electronic packages
10/20/2005WO2005099326A2 A method for manufacturing a flexible circuit board having small thickness and flexible board manufactured thereby
10/20/2005WO2005099325A1 Carrier substrate with a thermochromatic coating
10/20/2005WO2005099324A1 Printed wiring board assembled panel, unit sheet for mounting printed wiring board, rigid-flexible board and method for manufacturing them
10/20/2005WO2005099323A2 Light-emitting diode arrangement and method for the production thereof
10/20/2005WO2005099202A2 Magnetically differential input
10/20/2005WO2005099028A2 Embedded capacitors using conductor filled vias
10/20/2005WO2005098950A1 Tamper respondent covering
10/20/2005WO2005098948A1 Semiconductor package with a three-dimensional identification coding using thermochromatic inks
10/20/2005WO2005098947A1 Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist
10/20/2005WO2005098942A1 Al/AlN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE AND PROCESS FOR PRODUCING Al/AlN JOINT MATERIAL
10/20/2005WO2005098941A2 Integrated circuit stacking system and method
10/20/2005WO2005098801A1 Display
10/20/2005WO2005097924A1 Emulsion with discontinuous phase including particle sol
10/20/2005WO2005097882A1 Thermosetting composition and curing method thereof
10/20/2005WO2005097847A1 Modified polytetrafluoroethylene powder and method for producing tetrafluoroethylene polymer
10/20/2005WO2005089034A3 An element for carrying electronic components
10/20/2005US20050235233 Voltage reference signal circuit layout inside multi-layered substrate
10/20/2005US20050234173 Thermosetting resin composition and prepreg and laminated sheet using the same
10/20/2005US20050233770 Wireless substrate-like sensor
10/20/2005US20050233613 Coupling structure of electronic components
10/20/2005US20050233611 Signal transmission device
10/20/2005US20050233607 Orientation equipment with multiple PCBS
10/20/2005US20050233593 Plating of multi-layer structures
10/20/2005US20050233122 Manufacturing method of laminated substrate, and manufacturing apparatus of semiconductor device for module and laminated substrate for use therein
10/20/2005US20050233112 Higher melting substrate is an oxide or nitride of aluminum, titanium or zirconium; layer is silica powder, glass powder, glaze powder, copper oxide, lead oxide, hafnium oxide, or boron oxide and has embedded nanostructure stalagmites or columns extending towards the substrate; no polishing required
10/20/2005US20050232641 Methods for manufacturing lead frame connectors for optical transceiver modules
10/20/2005US20050232095 Optical pickup device
10/20/2005US20050231932 Reinforcement for substrate assemblies
10/20/2005US20050231929 Board mounting method and mounting structure
10/20/2005US20050231927 Method, system and apparatus for controlled impedance at transitional plated-through hole via sites using barrel inductance minimization
10/20/2005US20050231926 Wiring board, balun and apparatus using wiring board, and method of manufacturing wiring board
10/20/2005US20050231925 Semiconductor device and method for manufacturing the same
10/20/2005US20050231922 Functional printed circuit board module with an embedded chip
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