Patents for H05K 1 - Printed circuits (98,583)
11/2005
11/17/2005WO2005108467A1 Polyimide film laminate
11/17/2005WO2005108454A1 Phenolic resin
11/17/2005WO2005108453A1 Novel phenolic resins
11/17/2005WO2005108327A1 Method for producing multilayer dielectric body
11/17/2005WO2005108092A1 Flexible printhead circuit
11/17/2005WO2005091913A3 Midspan patch panel with compensation circuit for data terminal equipment, power insertion and data collection
11/17/2005WO2005088683A3 Wireless substrate-like sensor
11/17/2005US20050255786 Level/position sensor and related electronic circuitry for interactive toy
11/17/2005US20050255381 Secondary battery
11/17/2005US20050255312 Conductive material and manufacturing method thereof
11/17/2005US20050255303 Multilayer substrate including components therein
11/17/2005US20050255302 Printed circuit board
11/17/2005US20050255270 Flame retardancy although it is halogen-free, with good bonding strength, soldering heat resistance and coefficient of thermal expansion; novolak epoxy resin, carboxylic acid-modified acrylonitrile butadiene rubber particles, a triazine ring-containing cresol novolak, phenolic phosphorus compound, filler
11/17/2005US20050255232 Method, system, and apparatus for protective coating a flexible circuit
11/17/2005US20050254821 Multiple channel optical transceiver modules
11/17/2005US20050254680 Electroacoustic transducer
11/17/2005US20050254674 Flexible electronic device with flexible speaker
11/17/2005US20050254551 Temperature monitoring system
11/17/2005US20050254348 Drug delivery management system
11/17/2005US20050254332 Method for bus capacitance reduction
11/17/2005US20050254223 Next high frequency improvement by using frequency dependent effective capacitance
11/17/2005US20050254221 Clock routing in multiple channel modules and bus systems
11/17/2005US20050254220 Electronics unit
11/17/2005US20050254219 Memory card
11/17/2005US20050254218 Printed circuit board with improved heat dissipation efficiency, electronic apparatus having printed circuit board with improved heat dissipation efficiency, CRT display device having printed circuit board with improved heat dissipation efficiency, and recording/reproducing device or video display device incorporating recording/reproducing device having printed circuit board with improved heat dissipation efficiency
11/17/2005US20050254207 Cooling means for a driver semiconductor
11/17/2005US20050254206 Circuit board, device mounting structure, device mounting method, and electronic apparatus
11/17/2005US20050254176 Disc drive integral actuator pins
11/17/2005US20050254175 Method for making noble metal conductive leads for suspension assemblies
11/17/2005US20050254032 Exposure device
11/17/2005US20050253772 Method for forming radio frequency antenna
11/17/2005US20050253664 Integrated RF-front end having an adjustable antenna
11/17/2005US20050253662 Crosstalk compensation with balancing capacitance system and method
11/17/2005US20050253610 Test method for semiconductor components using anisotropic conductive polymer contact system
11/17/2005US20050253275 Flip chip package and process of forming the same
11/17/2005US20050253263 Wiring substrate and process for manufacturing the same
11/17/2005US20050253248 Multilayer wiring substrate and method of manufacturing multilayer wiring substrate
11/17/2005US20050253235 Semiconductor chip and circuit board, manufacturing method of same, and electronic equipment
11/17/2005US20050253233 Power module and electric transportation apparatus incorporating the same
11/17/2005US20050252978 IC card module
11/17/2005US20050252828 Carrier tape, a method of manufacturing an electronic device with the carrier tape, and a tape carrier package with the carrier tape
11/17/2005US20050252778 Finely patterned, excellent elongation and tensile strength at normal and high temperatures; amine is a glycerol derivative with terminal tertiary amine groups and pendant hydroxy groups or an endcapped polyethylene glycol or poly(1,2-propylene glycol); bis(alkylenesulfonic or phosphonic acid) disulfides
11/17/2005US20050252683 Circuit substrate and method of manufacturing plated through slot thereon
11/17/2005US20050252682 Wiring board and semiconductor package using the same
11/17/2005US20050252681 Microelectronic assembly having variable thickness solder joint
11/17/2005US20050252605 RFID label technique
11/17/2005US20050252598 Viscous adhesive material for fastening electronic components
11/17/2005US20050252398 Pattern form object and a manufacturing method thereof
11/17/2005US20050252311 Integrated strain gages for board strain characterization
11/17/2005DE20221422U1 Connection of memory modules to a memory controller on the main-board of a PC using a point-to-point connection system that supports any available number of modules and ensures all connection channels are used
11/17/2005DE202005014705U1 Circuit board system consisting of dielectric support plate(s) with circuit pattern at least at one side, containing metallised through and/or blind bores, with metallising forming element of circuit pattern
11/17/2005DE19649454B4 Platine für integrierte elektronische Schaltungen und Verfahren zur Herstellung einer Platine Board for integrated electronic circuits and methods for producing a circuit board
11/17/2005DE10326141B4 Elektromechanische Baugruppe Electromechanical assembly
11/17/2005DE102005017331A1 Schaltungsplatine Circuit board
11/17/2005DE102004021747A1 Strip conductor structure used in the production of circuit boards comprises a metal layer arranged on metal cores produced by breaking up electrically non-conducting metal compounds by electromagnetic radiation
11/17/2005DE102004019568A1 Substrate for a power semiconductor module has electronic components and connections on metal conductor on an isolation layer and recesses beneath or next to these
11/17/2005DE102004018483A1 Vorrichtung und Verfahren zum Aufbringen von Beschichtungen auf bandförmigen Strukturen in der Halbleiterbauteilefertigung Apparatus and method for applying coatings to the band-shaped structures in the semiconductor devices fabrication
11/17/2005CA2564714A1 Fusion bonded assembly with attached leads
11/17/2005CA2564191A1 Compliant electrical contact assembly
11/16/2005EP1596641A2 Printed circuit board with improved heat dissipation efficiency
11/16/2005EP1596640A1 Cross-connection by permutations using configurable printed circuit boards
11/16/2005EP1596478A2 Cross-talk improvement for high frequency by frequency dependent effective capacity
11/16/2005EP1596435A2 A pattern form object and a manufacturing method thereof
11/16/2005EP1596369A1 Suspension board with circuit
11/16/2005EP1596326A2 IC card module
11/16/2005EP1596209A1 Electromagnetic field measuring device, its control system, and its electronic circuit
11/16/2005EP1595432A1 Device and method for damping cavity resonance in a multi-layer carrier module
11/16/2005EP1595236A1 Telemetry signal collection, process and provision equipment
11/16/2005EP1595138A1 Image recognition apparatus and image recognition method
11/16/2005EP1594929A2 High conductivity inks with low minimum curing temperatures
11/16/2005EP1594928A2 High conductivity inks with improved adhesion
11/16/2005EP1504465A4 Conductive ink
11/16/2005EP1232679B1 Printed circuit board employing lossy power distribution network to reduce power plane resonances
11/16/2005EP0879465B1 Data processing of a bitstream signal
11/16/2005CN2741319Y Circuit substrate
11/16/2005CN1697603A Heating element radiating structure
11/16/2005CN1697598A Substrate for forming specific pattern, and method for manufacturing the same
11/16/2005CN1697596A Circuit board of possessing counter bores
11/16/2005CN1697595A Structure of base plate for packaging ball grid array
11/16/2005CN1697594A Film substrate, fabrication method thereof, and image display substrate
11/16/2005CN1697593A Wiring base board, method of producing thereof, and electronic device
11/16/2005CN1697592A Printed wiring board, production process thereof and semiconductor device
11/16/2005CN1697591A Method of manufacturing copper foil with insulating layer, copper foil with insulating layer obtained with the same method, and printed circuit board
11/16/2005CN1697590A Circuit board, and its fixing method, and electronic equipment using the same circuit board
11/16/2005CN1697589A Shielded film for printed cercuit board and mfg. method
11/16/2005CN1697588A A pattern form object and a manufacturing method thereof
11/16/2005CN1697566A Electroacoustic transducer
11/16/2005CN1697164A Carrier tape, a method of manufacturing an electronic device with the carrier tape, and a tape carrier package with the carrier tape
11/16/2005CN1697163A Wiring board and semiconductor package using the same
11/16/2005CN1697161A Semiconductor chip and circuit board, manufacturing method of same, and electronic equipment
11/16/2005CN1697027A Suspension board with circuit
11/16/2005CN1696972A IC card module
11/16/2005CN1696625A Electronical heating-cost distributor
11/16/2005CN1227957C Method for manufacturing circuit device and circuit device
11/16/2005CN1227956C Flexible wiring board and making method thereof and display device with flexible wiring board
11/16/2005CN1227782C Card edge inserting assembly
11/16/2005CN1227779C Assembling structure for interconnecting device
11/16/2005CN1227735C Installation structure of semi-conductor apparatus, electro-optical apparatus and electronic apparatus
11/16/2005CN1227727C Mfg. appts. of electronic device, its mfg. method
11/16/2005CN1227726C Mfg. appts. of electronic device, mfg. method of electronic device