Patents for H05K 1 - Printed circuits (98,583)
11/2005
11/24/2005US20050257958 Package modification for channel-routed circuit boards
11/24/2005US20050257957 Printed wiring board with conductive constraining core including resin filled channels
11/24/2005US20050257956 Structurally integrated circuit and associated method
11/24/2005US20050257954 Structure for mounting electronic component on wiring board
11/24/2005US20050257953 Method of creating gold contacts directly on printed circuit boards and product thereof
11/24/2005US20050257952 Flexible printed wiring board and manufacturing method thereof
11/24/2005US20050257948 Electrical transmission line and a substrate
11/24/2005US20050257643 Spherical silver powder and method for producing same
11/24/2005DE19742072B4 Verfahren zur Herstellung druckdichter Durchkontaktierungen A process for producing a pressure-tight vias
11/24/2005DE10223509B4 Vorrichtung zum definierten Materialabtrag sowie Verfahren zur Steuerung einer Vorrichtung Apparatus for defined removal of material as well as methods for controlling a device
11/24/2005DE102005011373A1 Interconnection for test measurement and logical analysis systems and probes for integrated circuits has flexible layers with contact bumps sandwiching rigid layer with holes
11/24/2005DE102004022118A1 Anordnung zur Kühlung einer Elektronikeinheit sowie Herstellung einer solchen Anordnung Arrangement for cooling an electronic unit and the production of such an arrangement
11/24/2005DE102004021226A1 Semiconductor circuit module, e.g. for memory chips, has chips in two groups aligned at 180 degrees to each other so that each branch of signal line ends lies in y-direction
11/24/2005DE102004021062A1 Verfahren zur Herstellung von Leiterplatten und/oder entsprechenden Konstrukten Process for the preparation of printed circuit boards and / or corresponding constructs
11/24/2005DE102004020670A1 Electrical component for controlling permittivity in a dielectric has an electrode structure and a dielectric with a fluid like water and an anisotropic material to be electrically aligned
11/24/2005DE10153725B4 Struktur zum Herausführen flexibler Leiterelemente Structure for leading flexible conductor elements
11/23/2005EP1599081A2 Thermal management system and method for electronic equipment mounted on coldplates
11/23/2005EP1599077A1 Method of creating gold contacts directly on printed circuit boards and product thereof
11/23/2005EP1599076A1 Wired circuit board
11/23/2005EP1598944A1 Tuner unit, receiver, electronic apparatus
11/23/2005EP1598931A1 Constant temperature type crystal oscillator
11/23/2005EP1598863A1 Semiconductor device and radiation detector employing it
11/23/2005EP1598862A1 Semiconductor device and radiation detector employing it
11/23/2005EP1598839A2 Translator for high frequency device arranged directly on a circuit board
11/23/2005EP1598591A2 Light emitting assembly
11/23/2005EP1598383A1 Thermosetting polycarbodiimide copolymer
11/23/2005EP1598328A1 Dielectric ceramic composition, dielectric ceramic and laminated ceramic part including the same
11/23/2005EP1598327A1 Ceramic composition and ceramic wiring board
11/23/2005EP1598198A2 Terminals for circuit board
11/23/2005EP1597949A1 An electronics box having internal circuit cards interconnected to external connectors without using a motherboard
11/23/2005EP1597948A1 A circuit board and arrangement for minimizing thermal and electromagnetic effects
11/23/2005EP1597947A1 Method for manufacturing an electronic module
11/23/2005EP1597946A1 Method for manufacturing an electronic module, and an electronic module
11/23/2005EP1597945A1 Method for electrically contacting a component to a flat cable
11/23/2005EP1597070A1 Hybrid composite of silicone and organic resins
11/23/2005EP1517939B1 Biaxially oriented polyester film and laminates thereof with copper
11/23/2005EP1516404B1 Integrated device providing overcurrent and overvoltage protection and common-mode filtering to data bus interface
11/23/2005EP1412307B1 Method for the production of metal-ceramic composite materials, especially metal-ceramic substrates
11/23/2005EP0891603B1 Non-conductive substrate forming a band or panel, on which are formed a plurality of support elements
11/23/2005CN1701646A Electronic control unit
11/23/2005CN1701437A 电子装置 Electronic devices
11/23/2005CN1701401A Surface mounting type part
11/23/2005CN1701093A Thermosetting resin composition for high speed transmission circuit board
11/23/2005CN1701050A Aluminum nitride sintered compact
11/23/2005CN1700850A Semiconductor device, noise reduction method, and shield cover
11/23/2005CN1700844A Flat sheet type packaging of circuit assembly having metal block shaped electric contact terminal and method for making the same
11/23/2005CN1700843A Board connecting component and three-dimensional connecting structure using thereof
11/23/2005CN1700842A Flexible printed circuit film
11/23/2005CN1700841A Printed circuit board for connecting with external connector
11/23/2005CN1700840A Flexible printed circuit film and liquid crystal display device including the same
11/23/2005CN1700839A A printed wiring board and production method thereof
11/23/2005CN1700459A Semiconductor chip package
11/23/2005CN1700453A Structure of forming pressure contact with power semiconductor module
11/23/2005CN1700436A Wired circuit board
11/23/2005CN1700373A Method for manufacturing stratify electronic apparatus
11/23/2005CN1700360A Spherical silver powder and method for producing same
11/23/2005CN1699438A Thermosetting polycarbodiimide copolymer
11/23/2005CN1229007C Method for mfg. multilayer printed wiring board and multilayer printed wiring board thereby
11/23/2005CN1229006C Circuit forming board producing method, circuit forming board, material for circuit forming board
11/23/2005CN1229005C Distributing base board device
11/23/2005CN1229004C Apparatus for fixed thread reel to printed circuit board using in transformer
11/23/2005CN1229003C Wire circuit board
11/23/2005CN1229002C Circuit formed substrate and method of manufacturing circuit formed substrate
11/23/2005CN1229001C Copper alloy foil for lamina plate
11/23/2005CN1229000C Soft circuit board capable of providing for identification
11/23/2005CN1228836C Base-plate terminal structure, liquid crystal device and electronic device
11/23/2005CN1228765C Magnetic head for conducting slider and bracket by conductivity resin
11/23/2005CN1228385C Flameproof thermoplastic molding compounds
11/23/2005CN1228178C Method of manufacturing ceramic laminated body
11/23/2005CN1228165C Device and method for printing marks on copper coated laminating boards
11/22/2005US6968481 Method and device for adapting/tuning signal transit times on line systems or networks between integrated circuits
11/22/2005US6968300 Computer system and printed circuit board manufactured in accordance with a quasi-Monte Carlo simulation technique for multi-dimensional spaces
11/22/2005US6967849 One system module for electric/electronic appliance
11/22/2005US6967843 System and method for dissipating heat from an electronic board
11/22/2005US6967834 Electronic apparatus
11/22/2005US6967705 Lamination of liquid crystal polymer dielectric films
11/22/2005US6967640 Microencapsulated electrophoretic display with integrated driver
11/22/2005US6967401 Semiconductor device, semiconductor module and hard disk
11/22/2005US6967398 Module power distribution network
11/22/2005US6967391 Electronic control device
11/22/2005US6967290 Circuit board
11/22/2005US6967282 Flip chip MMIC on board performance using periodic electromagnetic bandgap structures
11/22/2005US6967183 Electrocatalyst powders, methods for producing powders and devices fabricated from same
11/22/2005US6967163 Metal film and manufacturing method therefor, and laminated ceramic electronic component and manufacturing method therefor
11/22/2005US6967138 Process for manufacturing a substrate with embedded capacitor
11/22/2005US6967124 Imprinted integrated circuit substrate and method for imprinting an integrated circuit substrate
11/22/2005US6966787 Clockspring with flat cable
11/22/2005US6966784 Flexible cable interconnect assembly
11/22/2005US6966674 Backlight module and heat dissipation structure thereof
11/17/2005WO2005109980A1 Arrangement for cooling an electronic unit and production of such an arrangement
11/17/2005WO2005109978A1 Releasable electrical contact of three-dimensional moulded interconnect devices
11/17/2005WO2005109975A2 Broadband balance-to-unbalance transformer
11/17/2005WO2005109974A2 Fusion bonded assembly with attached leads
11/17/2005WO2005109973A1 Trimming of embedded passive components using pulsed heating
11/17/2005WO2005109972A2 Design and method for plating pci express (pcie) edge connector
11/17/2005WO2005109458A2 Method of laminating low temperature co-fired ceramic (ltcc) material and product formed thereby
11/17/2005WO2005109450A1 Compliant electrical contact assembly
11/17/2005WO2005109097A1 Lithographic method products obtained and use of said method
11/17/2005WO2005108507A1 Composition, image-forming method employing the composition, and method for forming electroconductive pattern
11/17/2005WO2005108488A1 Epoxy resin composition for copper clad laminate