Patents for H05K 1 - Printed circuits (98,583)
12/2005
12/22/2005US20050280554 Safety arrow tool for pedestrian
12/22/2005US20050280498 Conductive base material with resistance layer and circuit board material with resistance layer
12/22/2005US20050280490 Semiconductor and electronic device with spring terminal
12/22/2005US20050280158 Prefabricated semiconductor chip carrier
12/22/2005US20050280135 Stacking system and method
12/22/2005US20050280130 Printed wiring board and production method for printed wiring board
12/22/2005US20050280112 Semiconductor assembly having substrate with electroplated contact pads
12/22/2005US20050279970 Spherical silver power and method for producing same
12/22/2005US20050279838 Combination SD/MMC flash memory card with thirteen contact pads
12/22/2005US20050279809 Optical structures including liquid bumps and related methods
12/22/2005US20050279529 Wiring board, magnetic disc apparatus, and production method of wiring board
12/22/2005DE4426841B4 Signalübertragungseinrichtung Signal transmission device
12/22/2005DE10355921B4 Elektrische Schaltungsanordnung mit einem elektronischen Chip in einer Aufnahmevorrichtung des Schaltungsträgers An electrical circuit arrangement with an electronic chip in a receiving device of the circuit substrate
12/22/2005DE10257111B4 Chipkarte und Verfahren zur Herstellung einer Chipkarte Chip card and method for manufacturing a smart card
12/22/2005DE102005023234A1 Vorrichtung zur Reduzierung der Strahlungsemission elektronischer Baugruppen An apparatus for reducing the emission of radiation of electronic components
12/22/2005DE102004028603A1 Verfahren zur Beschichtung einer Seite einer Leiterplatte, beschichtete Leiterplatte sowie Beschichtungs-Material A method for coating one side of a printed circuit board, coated circuit board and coating material
12/22/2005DE102004025609A1 Anordnung in Schraub- Druckkontaktierung mit einem Leistungshalbleitermodul Assembly screw in pressure contact with a power semiconductor module
12/22/2005DE102004016847A1 Leuchtdiodenanordnung und Verfahren zum Herstellen einer Leuchtdiodenanordnung Light emitting diode device and method of manufacturing a light emitting diode array
12/21/2005EP1608210A1 Wiring Board, Magnetic Disc Apparatus, and Method of Manufacturing Wiring Board
12/21/2005EP1608209A1 Conductive base material with resistance layer and circuit board material with resistance layer
12/21/2005EP1608016A2 Capacitor-built-in-type wiring substrate, printed wiring substrate, and capacitor
12/21/2005EP1607977A2 Electronic device with built-in disk device
12/21/2005EP1607457A2 Electrical anisotropic conductable hot-melt adhesive for implanting electric modules in a card body
12/21/2005EP1606981A2 Method and device for aligning a substrate and a printing screen during solder paste printing
12/21/2005EP1606859A1 Interconnection system with improved high frequency performance
12/21/2005EP1606854A2 A circuit assembly and electronic device incorporating such an assembly
12/21/2005EP1606551A2 Led symbol signal
12/21/2005EP1606108A1 Double-sided metallic laminate and method for manufacturing the same
12/21/2005EP1323015B1 Security module
12/21/2005EP0943170A4 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
12/21/2005CN2747821Y 电路板 Circuit board
12/21/2005CN2747820Y Circuit board having fixer for component
12/21/2005CN2747819Y Printed circuit board preventing ESD
12/21/2005CN1711811A Multi-layer circuit assembly and process for preparing the same
12/21/2005CN1711809A A mechanism to cross high-speed differential pairs
12/21/2005CN1711636A Components, methods and assemblies for multi-chip packages
12/21/2005CN1711518A Acoustic wave touch detecting apparatus
12/21/2005CN1711009A Spherical grid array package body and bearing device
12/21/2005CN1710003A Electrically anisotropically conductive hotmelt adhesive
12/21/2005CN1709619A Spherical silver power and method for producing same
12/21/2005CN1233205C Mfg. method of circuit device
12/21/2005CN1233203C Electronic circuit unit
12/21/2005CN1232885C Positive type photosensitive epoxy resin composition and printed circuit board using same
12/21/2005CN1232881C Camera
12/21/2005CN1232873C Liquid crystal display
12/21/2005CN1232695C Nonwoven fabric for electrical insulation, prepreg, and laminate
12/20/2005US6978328 Bus system, memory system, printed circuit board and directional coupler
12/20/2005US6978226 Deterioration diagnostic method and equipment thereof
12/20/2005US6977820 Electronic circuit board
12/20/2005US6977709 Flat display apparatus
12/20/2005US6977707 Display device and wiring substrate including electric wiring formed of conductive film
12/20/2005US6977626 Low-loss printed circuit board antenna structure and method of manufacture thereof
12/20/2005US6977498 Measurement probe, in particular for an apparatus for measurement of the thickness of thin layers
12/20/2005US6977441 Interconnect substrate and method of manufacture thereof, electronic component and method of manufacturing thereof, circuit board and electronic instrument
12/20/2005US6977440 Stacked packages
12/20/2005US6977432 Prefabricated semiconductor chip carrier
12/20/2005US6977347 Flexible printed circuit board
12/20/2005US6977346 Vented circuit board for cooling power components
12/20/2005US6977345 Vents with signal image for signal return path
12/20/2005US6977339 Surface mounting package
12/20/2005US6977338 Underfill diffusion prevention layer of photosensitive polyimide between mounted electronic part and conductor cover layer; prevents underfill on highly wettable surface; allows high density circuit design
12/20/2005US6977284 Polymerizable composition and cured resin composition
12/20/2005US6977055 Securing electrical conductors
12/20/2005US6976881 Grouped element transmission channel link termination assemblies
12/20/2005US6976854 Arrangement for connecting the terminal contacts of an electronic component to a printed circuit board and conductor support for such an arrangement
12/20/2005US6976849 Pinless solder joint for coupling circuit boards
12/20/2005US6976848 Sockets for module extension and memory system using same
12/20/2005US6976415 Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel
12/20/2005CA2201412C Overtemperature protection circuit having plural thermal components
12/15/2005WO2005120140A1 Circuit board, and metal paste and method for manufacturing the same
12/15/2005WO2005120139A1 Surface-treated copper foil and flexible copper-clad laminate plate and film carrier tape manufactured by use of the surface-treated copper foil
12/15/2005WO2005119771A1 Organic matrices containing nanomaterials to enhance bulk thermal conductivity
12/15/2005WO2005119765A2 Assembly including vertical and horizontal joined circuit panels
12/15/2005WO2005119743A1 Substrate for electronic application comprising a flexible support and method for production thereof
12/15/2005WO2005119633A1 Led assembly with vented circuit board
12/15/2005WO2005118279A2 Laminate composition for producing reduced curl flat thin core laminate
12/15/2005WO2005118244A2 Fuel cell bipolar plates of conductive loaded resin-based materials
12/15/2005WO2005118212A1 Solder mask enhancement and method of inspecting printed circuit board assemblies
12/15/2005WO2005099202A3 Magnetically differential input
12/15/2005WO2005081595A3 Preferential assymmetrical via positioning for printed circuit boards
12/15/2005WO2005067539A3 Multilayer ceramic substrate with single via anchored pad and method of forming
12/15/2005US20050278679 Device for estimating number of board layers constituting board, system including the device, and method for estimating the same and program for executing the method
12/15/2005US20050277743 Curable resin composition and its use
12/15/2005US20050277550 Lead-free and cadmium-free conductive copper thick film pastes
12/15/2005US20050277351 Structured resin systems with high thermal conductivity fillers
12/15/2005US20050277350 Fabrics with high thermal conductivity coatings
12/15/2005US20050277339 Electrical connector with improved crosstalk compensation
12/15/2005US20050277310 System and method for processor power delivery and thermal management
12/15/2005US20050276975 Resin-impregnated substrate
12/15/2005US20050276958 Electrical insulating resin composition, and laminate for circuit board
12/15/2005US20050276934 heat decaying polymer containing a polyoxyalkylene resin as the principal ingredient formed by crosslinking a crosslinkable group containing hydrolyzing silyl group, an epoxy group, an acid anhydride group, a carboxyl group, a hydroxyl group; a decomposition promoter (SnO2 )
12/15/2005US20050276912 Wiring substrate, semiconductor device and manufacturing method thereof
12/15/2005US20050276547 Fiber optic transceiver module with rigid and flexible circuit boards
12/15/2005US20050276030 Reference layer openings
12/15/2005US20050276029 Mounting a voltage regulator on top of a processor
12/15/2005US20050276027 Electronic device for shielding EMI
12/15/2005US20050276024 Flexi-rigid printed circuit board with integral flexible heat sink area
12/15/2005US20050275923 Display device using printed circuit board as substrate of display panel
12/15/2005US20050275552 Apparatus and method for PCB smoke and burn detection and prevention
12/15/2005US20050275397 Non-intrusive power monitor