| Patents for H05K 1 - Printed circuits (98,583) |
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| 01/04/2006 | CN1716480A Thick film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards |
| 01/04/2006 | CN1716461A Dielectric ceramic and multilayer ceramic substrate |
| 01/04/2006 | CN1716458A Thick-film conductor paste |
| 01/04/2006 | CN1716147A Hierarchical module |
| 01/04/2006 | CN1716135A Circuit base board, method for producing circuit base board and electronic clock |
| 01/04/2006 | CN1715979A Fiber optic transceiver module with rigid and flexible circuit boards |
| 01/04/2006 | CN1715355A Heat-activable adhesive tape for bonding electronic components and conductor tracks |
| 01/04/2006 | CN1715353A Heat-activable adhesive tape for bonding electronic components and conductor tracks |
| 01/04/2006 | CN1715313A Films |
| 01/04/2006 | CN1715030A Structure of parts made from plural composite pieces and method of building those parts |
| 01/04/2006 | CN1235457C Circuit substrate and its making method and display apparatus |
| 01/04/2006 | CN1235456C Method for manufacturing ceramic multilayer circuit board |
| 01/04/2006 | CN1235454C Copper foil with insulation layer and its manufactuing method and printed wiring board using the copper foil with insulation layer |
| 01/04/2006 | CN1235453C Integrated circuit carrier with recesses |
| 01/04/2006 | CN1235452C Method of manufacturing an integrated circuit carrier |
| 01/04/2006 | CN1235451C Method for mfg. printed-circuit board |
| 01/04/2006 | CN1235450C Circuit board |
| 01/04/2006 | CN1235337C Electronic device and its producing method |
| 01/04/2006 | CN1235336C Multi-layer LC composite element and mfg. method thereof |
| 01/04/2006 | CN1235233C Mountable electrical conductors |
| 01/04/2006 | CN1235081C Light-emitting assembly |
| 01/04/2006 | CN1234915C Copper foil coated with stable layer, coating method and laminate piece including insulation substrate and copper foil |
| 01/04/2006 | CN1234890C Copper alloy foil for laminated board |
| 01/04/2006 | CN1234794C Adhesive material |
| 01/04/2006 | CN1234791C Process for preparing resin paint |
| 01/04/2006 | CN1234761C Flame retardant resin compositions containing phosphoamides, and method for making same |
| 01/04/2006 | CN1234743C Cross-linked low dielectric high polymer material and film, base plate and electronic part using the same |
| 01/03/2006 | US6983168 Back light holder for a mobile phone |
| 01/03/2006 | US6982892 Apparatus and methods for a physical layout of simultaneously sub-accessible memory modules |
| 01/03/2006 | US6982876 Printed circuit board assembly |
| 01/03/2006 | US6982869 Folded interposer |
| 01/03/2006 | US6982861 Sole structure for electrostatic dissipative footwear and method of making same |
| 01/03/2006 | US6982490 Interface device including a video BIOS component |
| 01/03/2006 | US6982387 Method and apparatus to establish circuit layers interconnections |
| 01/03/2006 | US6982386 Interconnecting substrates for electrical coupling of microelectronic components |
| 01/03/2006 | US6981881 Socket and contact of semiconductor package |
| 01/03/2006 | US6981859 Method for manufacturing electronic component and apparatus for manufacturing the same |
| 01/03/2006 | US6981320 Circuit board and fabricating process thereof |
| 01/03/2006 | US6981319 Method of manufacturing devices to protect election components |
| 01/03/2006 | US6981318 Printed circuit board manufacturing method |
| 01/03/2006 | US6981316 Method of manufacturing vehicle electric power distribution system |
| 12/29/2005 | WO2005125298A2 Method for manufacturing an electronics module comprising a component electrically connected to a conductor- pattern layer |
| 12/29/2005 | WO2005124445A2 Rearview mirror element having a circuit mounted to the rear surface of the element |
| 12/29/2005 | WO2005124374A1 Non-intrusive power monitor |
| 12/29/2005 | WO2005123378A1 Textile structures for heating or warming |
| 12/29/2005 | WO2005123377A2 Functional elastic textile structures |
| 12/29/2005 | WO2005123376A1 Perforated functional textile structures |
| 12/29/2005 | WO2005123375A1 Functional textile structures |
| 12/29/2005 | WO2005123308A1 Copper-containing tin powder and method for producing the copper-containing tin powder, and electroconductive paste using the copper-containing tin powder |
| 12/29/2005 | WO2005122695A2 A system for mapping defective printed circuits |
| 12/29/2005 | WO2005096350A3 Electromagnetic bandgap structure for suppressing electromagnetic coupling in microstrip and flip chip on board applications |
| 12/29/2005 | WO2005029928A3 Closed loop backdrilling system |
| 12/29/2005 | WO2005002121A3 Environmental protection of serial ata and other electronic devices |
| 12/29/2005 | US20050289575 Electronic device with built-in disk device |
| 12/29/2005 | US20050288424 Ethoxysilane containing fiberglass binder |
| 12/29/2005 | US20050288392 Modular board device and high frequency module and method for producing them |
| 12/29/2005 | US20050288173 Rare earth titanate dielectric component that may also contain Li, Ca and'or Sr, which after being fired, shows the presence of a main phase having a perovskite structure and an acicular phase containing a rare-earth element; may also contain a bismuth glass |
| 12/29/2005 | US20050288172 Obtained by firing a mixture of a bismuth glass component and a rare earth titanate dielectric component that may also contain Li, Ca and'or Sr, which can be sintered even at a low temperature of 1,000 degrees C. or below |
| 12/29/2005 | US20050288167 Glass: 46 to 60 mass % SiO2, 0.5 to 5 % B2O3, 6 to 17.5 % Al2O3, and 25 to 45 % alkaline earth metal oxide at least 60 % of which is SrO; alumina, titania and cordierite; controlled coefficient of linear thermal expansion; high dielectric constant; reduced warpage of fired product |
| 12/29/2005 | US20050287871 Device, method, and program for computer aided design of flexible substrates |
| 12/29/2005 | US20050287840 Connector holding structure |
| 12/29/2005 | US20050287835 Flat connector, ink jet head and method of manufacturing them |
| 12/29/2005 | US20050287829 Patch substrate for external connection |
| 12/29/2005 | US20050287789 Substrate with patterned conductive layer |
| 12/29/2005 | US20050287783 Microelectronic devices and methods for forming interconnects in microelectronic devices |
| 12/29/2005 | US20050287704 Carrier for substrate film |
| 12/29/2005 | US20050287377 Method for making layers and wiring board made thereby |
| 12/29/2005 | US20050286283 Method and system for expanding flash storage device capacity |
| 12/29/2005 | US20050286240 Circuit board electrode connection structure |
| 12/29/2005 | US20050286238 Device and method of manufacture of an interconnection structure for printed circuit boards |
| 12/29/2005 | US20050286237 Space effective structure and method for retaining printed circuit boards within a housing |
| 12/29/2005 | US20050286198 Universal energy conditioning interposer with circuit architecture |
| 12/29/2005 | US20050286192 Integrated circuit with multiple independent power supply zones |
| 12/29/2005 | US20050285973 System and method for mounting an image capture device on a flexible substrate |
| 12/29/2005 | US20050285534 Surface mounting discharge tube |
| 12/29/2005 | US20050285274 Lead solder indicator and method |
| 12/29/2005 | US20050285264 High density package with wrap around interconnect |
| 12/29/2005 | US20050285255 Device and method for tilted land grid array interconnects on a coreless substrate package |
| 12/29/2005 | US20050285253 Forming buried via hole substrates |
| 12/29/2005 | US20050285248 Method and system for expanding flash storage device capacity |
| 12/29/2005 | US20050285147 Circuit apparatus and method of manufacturing the same |
| 12/29/2005 | US20050285084 Conductive ink composition, reflective member, circuit substrate, and electronic apparatus |
| 12/29/2005 | US20050284941 Combined electromagnetic and optical communication system |
| 12/29/2005 | US20050284658 Components with posts and pads |
| 12/29/2005 | US20050284657 Double-sided printed circuit board without via holes and method of fabricating the same |
| 12/29/2005 | US20050284655 Circuit board with asymmetrical structure and method for fabricating the same |
| 12/29/2005 | US20050284654 Structure of terminal member |
| 12/29/2005 | US20050284653 Condition display method and wiring board for wiring board design |
| 12/29/2005 | US20050284607 Cooling-assisted, heat-generating electrical component and method of manufacturing same |
| 12/29/2005 | US20050284561 Common carrier |
| 12/29/2005 | US20050283975 Circuit board |
| 12/29/2005 | DE202005015927U1 Balanced high frequency resistor especially a termination resistor with a planar layer structure and having a notch spaced from the side surfaces of the resistive layer |
| 12/29/2005 | DE19636735B4 Mehrschichtiges Schaltungssubstrat und Verfahren zu seiner Herstellung A multi-layer circuit substrate and method for its preparation |
| 12/29/2005 | DE112004000245T5 Verbund-Kupferfolie, Verfahren zu deren Herstellung und Hochfrequenz-Übertragungsschaltung unter Verwendung einer Verbundkupferfolie Composite copper foil, to processes for their preparation and high-frequency transmission circuit using a composite copper foil |
| 12/29/2005 | DE102005024950A1 Elektronische Leiterplatte mit einer darin integrierten Brennstoffzelle Electronic circuit board with a built-in fuel cell |
| 12/29/2005 | DE102004048203A1 Stackable semiconductor module for electronics packaging has electronic component with vertical opening provided with continuous metallization with layer of soldering paste to connect it to contact of another electronic component |
| 12/29/2005 | DE102004038297B3 Manufacture of housing for a position sensor involves a three-dimensional mask during deposition of electrical contact material for fitting components |
| 12/29/2005 | DE102004029589A1 Elektrisch anisotrop leitfähiger Schmelzkleber zur Implantierung von elektrischen Modulen in einen Kartenkörper Electrically conductive anisotropic melt adhesive for implanting electrical modules in a card body |
| 12/29/2005 | DE102004028211A1 Circuit board made from epoxy resin for chip structures comprises fixing sections for holding the circuit board, a fixing section in which components are soldered and a structure for changing the board stiffness |
| 12/29/2005 | DE102004001107B4 Strukturierung auf Oberflächen mittels Folie Structuring of surfaces by film |