| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 12/29/2005 | CA2571135A1 Copper-containing tin powder and method for producing the copper-containing tin powder, and electroconductive paste using the copper-containing tin powder |
| 12/28/2005 | EP1610599A1 Multilayer substrate and method for producing same |
| 12/28/2005 | EP1610598A1 Anti-hacking printed circuit board having high-molecular material deposited thereon and deposition method for the same |
| 12/28/2005 | EP1610596A1 Heat management in circuit card assemblies |
| 12/28/2005 | EP1610428A2 Surface mounting discharge tube |
| 12/28/2005 | EP1610417A1 Connector holding structure |
| 12/28/2005 | EP1610400A1 Battery with embedded circuits |
| 12/28/2005 | EP1610375A2 Contact carriers for populating substrates with spring contacts |
| 12/28/2005 | EP1610262A2 Memory card |
| 12/28/2005 | EP1610132A2 Fabricating interconnects using sacrificial substrates |
| 12/28/2005 | EP1609968A1 Electric parts attaching structure and attaching method for throttle body, and throttle body |
| 12/28/2005 | EP1609547A1 Spherical silver powder with high shrinkage and method for producing same |
| 12/28/2005 | EP1609341A1 Array for electrical connection |
| 12/28/2005 | EP1609339A1 Method for manufacturing an electronic module and an electronic module |
| 12/28/2005 | EP1609338A1 A method and device for protection of a component or module |
| 12/28/2005 | EP1609217A2 Connector and printed circuit board for reducing cross-talk |
| 12/28/2005 | EP1609206A2 Coaxial waveguide microstructures and methods of formation thereof |
| 12/28/2005 | EP1608699A2 Thermally conductive adhesive composition and process for device attachment |
| 12/28/2005 | EP1608535A1 Arrangement of electrical and/or mechanical components on a large, flexible foil-type conductor area |
| 12/28/2005 | EP1461383A4 Thermosetting resin composition for high performance laminates |
| 12/28/2005 | CN2749121Y Electric connector assembly |
| 12/28/2005 | CN2749076Y Electric connector having different spaces between terminals |
| 12/28/2005 | CN2749073Y 信号传输模块 Signal transmission module |
| 12/28/2005 | CN1714609A Circuit board, multi-layer wiring board, method for making circuit board, and method for making multi-layer wiring board |
| 12/28/2005 | CN1714608A Multilayer wiring board, method for producing the came, and method for producing fiber reinforced resin board |
| 12/28/2005 | CN1714476A Apparatus for crosstalk compensation in a telecommunications connector |
| 12/28/2005 | CN1714442A Semiconductor device |
| 12/28/2005 | CN1714314A Aqueous developable photoimageable thick film compositions for making photoimageable black electrodes |
| 12/28/2005 | CN1713967A Chemical-solution supplying apparatus |
| 12/28/2005 | CN1713941A Transmitter for wireless control |
| 12/28/2005 | CN1713809A Shielding structure |
| 12/28/2005 | CN1713802A Wiring board, magnetic disc apparatus, and manufacturing method of wiring board |
| 12/28/2005 | CN1713801A Welding disk for preventing host board short circuit |
| 12/28/2005 | CN1713800A Connector holding structure |
| 12/28/2005 | CN1713799A Production method of suspension board with circuit |
| 12/28/2005 | CN1713798A Resin-impregnated substrate |
| 12/28/2005 | CN1713797A Wiring board, magnetic disc apparatus, and production method of wiring board |
| 12/28/2005 | CN1713406A Light-emitting diode |
| 12/28/2005 | CN1713308A Dielectric ceramic composition, method for manufacture thereof and multilayer ceramic part |
| 12/28/2005 | CN1234152C Conductive film pattern and forming method thereof, distributing substrate, electronic device, electronic machine and medium |
| 12/27/2005 | US6981239 Method, system and apparatus for constructing resistive vias |
| 12/27/2005 | US6980432 Electronic apparatus |
| 12/27/2005 | US6980416 Capacitor, circuit board with built-in capacitor and method of manufacturing the same |
| 12/27/2005 | US6980119 Solid-state warning light with environmental control |
| 12/27/2005 | US6980074 Low noise full integrated multilayers magnetic for power converters |
| 12/27/2005 | US6980068 System for and method of interconnecting high-frequency transmission lines |
| 12/27/2005 | US6980066 High-frequency module |
| 12/27/2005 | US6980063 Transmission line parasitic element discontinuity cancellation |
| 12/27/2005 | US6980017 Test interconnect for bumped semiconductor components and method of fabrication |
| 12/27/2005 | US6980014 Interposer and methods for fabricating same |
| 12/27/2005 | US6979910 Semiconductor package and semiconductor package mounting method |
| 12/27/2005 | US6979895 Semiconductor assembly of stacked substrates and multiple semiconductor dice |
| 12/27/2005 | US6979891 Integrated circuit packaging architecture |
| 12/27/2005 | US6979890 Intermediate substrate |
| 12/27/2005 | US6979848 Memory system with conductive structures embedded in foamed insulator |
| 12/27/2005 | US6979784 Component power interface board |
| 12/27/2005 | US6979712 comprises novolak epoxy resin, carboxylic acid-modified acrylonitrile butadiene rubber particles, phenolic resin, phenolic hydroxyl group-containing phosphorus compound, and filler |
| 12/27/2005 | US6979497 a polyimide film and an electro-conductive metal film in which the metal film is attached to the polyimide film using neither heat curing adhesive nor thermoplastic adhesive; good for manufacturing a flexible printed circuit board (FPC). |
| 12/27/2005 | US6978539 Method for attaching an integrated circuit package to a circuit board |
| 12/27/2005 | US6978538 Method for making a microelectronic interposer |
| 12/25/2005 | CA2510123A1 Tin-coated printed circuit boards with low tendency to whisker formation |
| 12/22/2005 | WO2005122660A1 Aluminum substrate for printed circuits, manufacturing method thereof, printed circuit board, and manufacturing method thereof |
| 12/22/2005 | WO2005122659A1 Method for coating one side of a printed circuit board, coated printed circuit board and coating material |
| 12/22/2005 | WO2005122657A1 Rigid-flex wiring board and method for producing same |
| 12/22/2005 | WO2005122656A1 Flex-rigid wiring board and manufacturing method thereof |
| 12/22/2005 | WO2005122655A2 Pcb including a star shaped through-hole solder pad |
| 12/22/2005 | WO2005122378A1 High voltage unit |
| 12/22/2005 | WO2005122247A1 Composite electronic component |
| 12/22/2005 | WO2005121882A1 Display device using printed circuit board as substrate of display panel |
| 12/22/2005 | WO2005120823A2 Non-covalent bonding agent for carbon nanotube reinforced polymer composites |
| 12/22/2005 | WO2005099028A3 Embedded capacitors using conductor filled vias |
| 12/22/2005 | WO2005081596A3 Preferential ground and via exit structures for printed circuit boards |
| 12/22/2005 | WO2005081314A3 Optimisation of the number of power outputs for an integrated circuit |
| 12/22/2005 | WO2005077853A3 Fiber product coated with particles to adjust the friction of the coating and the interfilament bonding |
| 12/22/2005 | WO2005076679A3 Method for disposing a conductor structure on a substrate, and substrate comprising said conductor structure |
| 12/22/2005 | WO2005035456A3 Glass compositions, glass fibers, and methods of inhibiting boron volatization from glass compositions |
| 12/22/2005 | US20050283794 Anti-hacking printed circuit board having high-molecular material deposited thereon and deposition method for the same |
| 12/22/2005 | US20050283342 System and method for tracking engineering changes relating to a circuit card |
| 12/22/2005 | US20050282937 Electrochemical compatibilizer and hydrophobic wetting agent for fiber reinforced vinyl esters and related thermosets |
| 12/22/2005 | US20050282923 Photosensitive resin compositon comprising a halogen-free colorant |
| 12/22/2005 | US20050282415 Printed circuit boards having improved solder pads |
| 12/22/2005 | US20050282412 Shielding structure |
| 12/22/2005 | US20050282315 High-reliability solder joint for printed circuit board and semiconductor package module using the same |
| 12/22/2005 | US20050282309 Circuit board with embedded passive component and fabrication process thereof |
| 12/22/2005 | US20050282088 Production method of suspension board with circuit |
| 12/22/2005 | US20050282002 Electrically anisotropically conductive hotmelt adhesive for implanting electrical modules in a card body |
| 12/22/2005 | US20050281528 Optical transceiver, connector, substrate unit, optical transmitter, optical receiver, and semiconductor device |
| 12/22/2005 | US20050281507 Coupling device for coupling light between a planar optical component and an optical assembly |
| 12/22/2005 | US20050281025 High density LED array |
| 12/22/2005 | US20050281015 Electronic circuit apparatus and method for stacking electronic circuit units |
| 12/22/2005 | US20050281012 Mirror image electrical packages and system for using same |
| 12/22/2005 | US20050281011 Heat spreader in integrated circuit package |
| 12/22/2005 | US20050281010 Contact pad arrangement for integrated SD/MMC system |
| 12/22/2005 | US20050281008 Extended thin film capacitor (TFC) |
| 12/22/2005 | US20050281007 Heat management in circuit card assemblies |
| 12/22/2005 | US20050280990 Fan module |
| 12/22/2005 | US20050280978 Capacitor, capacitor-embedded board, and method for manufacturing the capacitor |
| 12/22/2005 | US20050280946 Wiring board, magnetic disc apparatus, and method of manufacturing wiring board |
| 12/22/2005 | US20050280944 Method for providing electrical crossover in laminated structure |
| 12/22/2005 | US20050280940 System and method for improving suspension-to-slider attachment in a hard disk drive |