| Patents for H05K 1 - Printed circuits (98,583) |
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| 12/06/2005 | US6972391 Laser trimming of annular passive components |
| 12/06/2005 | US6972383 Multilayered circuit board |
| 12/06/2005 | US6972381 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
| 12/06/2005 | US6972380 Printed wiring board having impedance-matched differential pair signal traces |
| 12/06/2005 | US6972371 Potting crack shield and related method |
| 12/06/2005 | US6972207 Method of manufacturing annular oblique light illumination apparatus and flexible wiring substrate |
| 12/06/2005 | US6972097 Various strength of anisotropic magnetic fields; soft magentic powder in binder |
| 12/06/2005 | US6972081 Fabrication of embedded vertical spiral inductor for multichip module (MCM) package |
| 12/06/2005 | US6972070 Method of manufacturing a printed wiring board |
| 12/06/2005 | US6971886 LGA to PGA package adapter |
| 12/06/2005 | US6971162 Localized enhancement of multilayer substrate thickness for high Q RF components |
| 12/06/2005 | US6971160 Hybrid electrical circuit method with mated substrate carrier method |
| 12/06/2005 | CA2285511C Improved polycarboxy/polyol fiberglass binder of low ph |
| 12/01/2005 | WO2005115066A1 Hole adapter for a printer circuit board |
| 12/01/2005 | WO2005114720A2 Parylene-based flexible multi-electrode arrays for neuronal stimulation and recording and methods for manufacturing the same |
| 12/01/2005 | WO2005114658A2 Method for making noble metal conductive leads for suspension assemblies |
| 12/01/2005 | WO2005114228A1 Laminated board and probe card |
| 12/01/2005 | WO2005114123A1 Temperature sensor and temperature monitoring device |
| 12/01/2005 | WO2005113647A1 Polyesterimide having low coefficient of linear thermal expansion and precursor therefor |
| 12/01/2005 | WO2005113645A1 Polyimide resin, multilayer film, multilayer film with metal layer, and semiconductor device |
| 12/01/2005 | WO2005091941A3 Systems and methods for blocking microwave propagation in parallel plate structures |
| 12/01/2005 | WO2005078012A3 Fire retardant compositions using siloxanes |
| 12/01/2005 | WO2005022684A3 Low cost rfid antenna manufactured from conductive loaded resin-based materials |
| 12/01/2005 | WO2004112151A3 Transparent conducting structures and methods of production thereof |
| 12/01/2005 | WO2004102690A3 Organic polymers, laminates, and capacitors |
| 12/01/2005 | US20050267266 Hybrid materials employing PPE/polystyrene/curable epoxy mixtures |
| 12/01/2005 | US20050266758 Wet-spun non-woven fabric and method for producing the same |
| 12/01/2005 | US20050266756 Laminate composition for producing reduced curl flat thin core laminate |
| 12/01/2005 | US20050266730 Programmable power supply |
| 12/01/2005 | US20050266704 Flexible printed board mounting structure and optical pick up having the same |
| 12/01/2005 | US20050266613 Integrated circuit packages with reduced stress on die and associated methods |
| 12/01/2005 | US20050266609 Method of fabricating a built-in chip type substrate |
| 12/01/2005 | US20050266352 Metallic pattern forming method and conductive pattern material |
| 12/01/2005 | US20050266255 Conductive film forming method and conductive material |
| 12/01/2005 | US20050266252 Low loss glass-ceramic materials, method of making same and electronic packages including same |
| 12/01/2005 | US20050266251 Glass-ceramic materials and electronic packages including same |
| 12/01/2005 | US20050266249 Flexible metal clad laminate film and a manufacturing method for the same |
| 12/01/2005 | US20050266233 Film and laminate of the same |
| 12/01/2005 | US20050266214 Wiring substrate and method of fabricating the same |
| 12/01/2005 | US20050266213 Layered board and manufacturing method of the same, electronic apparatus having the layered board |
| 12/01/2005 | US20050266212 Layered board and manufacturing method of the same, electronic apparatus having the layered board |
| 12/01/2005 | US20050266154 Apparatus for forming a circuit |
| 12/01/2005 | US20050265716 Lens barrel for camera |
| 12/01/2005 | US20050265650 Small profile, pluggable optical transceiver subassembly |
| 12/01/2005 | US20050265418 Surface-emitting laser with external cavity formed by a waveguide bragg grating |
| 12/01/2005 | US20050265024 Variable beam LED light source system |
| 12/01/2005 | US20050265010 Multipart electronic circuit assembly with detachably interconnecting and locking component circuit substrates |
| 12/01/2005 | US20050265009 Detecting short circuits and detecting component misplacement |
| 12/01/2005 | US20050265008 Method and structures for implementing enhanced reliability for printed circuit board high power dissipation applications |
| 12/01/2005 | US20050265006 Multiplexer circuit layout design |
| 12/01/2005 | US20050264999 Heat sink attachment |
| 12/01/2005 | US20050264993 Shielding box |
| 12/01/2005 | US20050264982 Plasma display apparatus |
| 12/01/2005 | US20050264924 Disk device |
| 12/01/2005 | US20050264915 Disk drive |
| 12/01/2005 | US20050264709 CRT receiver, high-definition CRT receiver and digital broadcasting CRT receiver |
| 12/01/2005 | US20050264380 Method and stiffener-embedded waveguide structure for implementing enhanced data transfer |
| 12/01/2005 | US20050264313 Contact probe, measuring pad used for the contact probe, and method of manufacturing the contact probe |
| 12/01/2005 | US20050263911 Circuit device and manufacturing method thereof |
| 12/01/2005 | US20050263909 Semiconductor device |
| 12/01/2005 | US20050263905 Method for manufacturing circuit device |
| 12/01/2005 | US20050263898 Substrate, connecting structure and electronic equipment |
| 12/01/2005 | US20050263895 Circuit device and manufacturing method thereof |
| 12/01/2005 | US20050263884 Multilayer printed wiring board and multilayer printed circuit board |
| 12/01/2005 | US20050263880 Circuit device and manufacturing method thereof |
| 12/01/2005 | US20050263874 Semiconductor package, method of production of same, and semiconductor device |
| 12/01/2005 | US20050263872 Flex-based circuit module |
| 12/01/2005 | US20050263870 High density 3-D integrated circuit package |
| 12/01/2005 | US20050263867 Intermediate substrate |
| 12/01/2005 | US20050263849 Layout structure for providing stable power source to a main bridge chip substrate and a motherboard |
| 12/01/2005 | US20050263846 Circuit device |
| 12/01/2005 | US20050263793 Wire bonding method and apparatus for integrated circuit |
| 12/01/2005 | US20050263572 Circuit assembly for battery pack or the like, and method of making the same |
| 12/01/2005 | US20050263501 Laser beam processing method and component machined by the method |
| 12/01/2005 | US20050263498 Ceramic heater |
| 12/01/2005 | US20050263482 Method of manufacturing circuit device |
| 12/01/2005 | US20050263322 Enhanced blind hole termination of pin to PCB |
| 12/01/2005 | US20050263321 Electronic circuit board |
| 12/01/2005 | US20050263320 Circuit device and manufacturing method thereof |
| 12/01/2005 | US20050263319 Printed circuit board, magnetic disk device, and method for manufacturing the printed circuit board |
| 12/01/2005 | US20050263318 Structure for fixing an electronic device to a substrate |
| 12/01/2005 | US20050263250 Micro adhesive nozzle and adhesive applying apparatus |
| 12/01/2005 | US20050263238 Placing a resin sheet in a surface recess or inner void in ceramic green sheets; laminating the sheets with the resin sheet in place; and firing the laminate, which decomposes the resin sheet; deformation and delamination in the recess or void site area is prevented |
| 12/01/2005 | US20050262966 Generating an aerosol including a liquid comprising a nickel precursor and moving the droplets through a heating zone by means of a carrier gas to form nickel particles having small particle size, narrow size distribution, spherical morphology and high crystallinity; pyrometallurgy |
| 12/01/2005 | DE102005020638A1 Brennstoffzellenanordnung und Montagemethode für Brennstoffzelle Fuel cell arrangement and assembly method for fuel cell |
| 12/01/2005 | DE102004049485B3 Elektrische Schaltung mit einer Mehrlagen-Leiterplatte An electrical circuit with a multi-layer printed circuit board |
| 12/01/2005 | DE102004034397A1 Bildsensormodul und Verfahren zum Herstellen eines Waferebenenpakets Image sensor module and method of manufacturing a wafer-level package |
| 12/01/2005 | DE102004023189A1 Lösbare elektrische Kontaktierung dreidimensionaler spritzgegossener Schaltungsträger Releasable electrical contact three-dimensional molded interconnect devices |
| 12/01/2005 | DE102004022232A1 Viskoses Klebematerial zur Befestigung elektronischer Bauelemente Viscous adhesive material for mounting electronic components |
| 12/01/2005 | DE102004022185A1 Breitbandiger Symmetrierübertrager Wideband Balun |
| 12/01/2005 | DE102004022178A1 Verfahren zur Herstellung einer Leiterbahn auf einem Substrat und Bauelement mit einer derart hergestellten Leiterbahn A method of fabricating a wiring on a substrate and the component to a conductor track manufactured in such a way |
| 12/01/2005 | DE102004022176A1 Verfahren zur Herstellung von passiven Bauelementen auf einem Substrat und mittels eines derartigen Verfahren hergestelltes Bauteil A process for the production of passive components on a substrate and by means of such process produced component |
| 12/01/2005 | DE102004021643A1 Applikationsverfahren für eine Bestandteile eines elektronischen Schaltkreises innerhalb einer Druckmaschine Application process for a component of an electronic circuit within a printing press |
| 12/01/2005 | DE102004021122A1 Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul Arrangement in pressure contact with a power semiconductor module |
| 12/01/2005 | DE102004020897A1 Circuit board arrangement with connection entrance and electronic component e.g. for transformers, has connection wire deformed during insertion into connection entrance for testable fixture |
| 12/01/2005 | DE102004019510A1 Plastic housing for electronic devices esp. for motor vehicles, has conductor path provided with layer forming carrier only on one face |
| 11/30/2005 | EP1601053A1 Wired circuit board and connection structure of wired circuit board |
| 11/30/2005 | EP1601017A1 Multilayer printed wiring board |
| 11/30/2005 | EP1601016A2 Apparatus in screw pressure contact with a power semiconductor module |
| 11/30/2005 | EP1601012A2 Microelectronic assembly having variable thickness solder joint |