| Patents for H05K 1 - Printed circuits (98,583) |
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| 02/22/2006 | EP1628515A1 Integrated cooling system for electronic devices |
| 02/22/2006 | EP1628508A1 Process of manufacturing an electronic module |
| 02/22/2006 | EP1627935A1 Surface treating agent for tin or tin alloy material |
| 02/22/2006 | EP1627863A1 Porcelain composition |
| 02/22/2006 | EP1627393A1 Water-soluble electrically conductive composition, modifications, and applications thereof |
| 02/22/2006 | EP1627208A1 Cover for a dew point sensor mounted on a printed circuit board |
| 02/22/2006 | EP1627020A1 Method of inkjet printing a fluorpolymer solution to a substrate and articles therefrom |
| 02/22/2006 | EP1350417B1 Method for the production of an electronic component |
| 02/22/2006 | EP1070389A4 Component carrier |
| 02/22/2006 | CN2760905Y Jointing structure of heat sink |
| 02/22/2006 | CN2760901Y Wiring carrier board |
| 02/22/2006 | CN2760771Y Collector plate for fuel cell |
| 02/22/2006 | CN2760764Y Polarization structure of LED luminophor |
| 02/22/2006 | CN2760552Y Printed circuit board for LED chip |
| 02/22/2006 | CN1739324A Multi-layer ceramic substrate and method for manufacturing thereof |
| 02/22/2006 | CN1739323A Multilayer wiring board and its manufacturing method |
| 02/22/2006 | CN1739322A Method and apparatus for manufacturing circuit board |
| 02/22/2006 | CN1739218A 移动通信终端 The mobile communication terminal |
| 02/22/2006 | CN1738518A Double layer film, production method of double layeer film, production method of printing circuit board |
| 02/22/2006 | CN1738517A Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatus |
| 02/22/2006 | CN1738514A High thermal cycle conductor system |
| 02/22/2006 | CN1738513A Printed circuit board including embedded capacitors and method of manufacturing the same |
| 02/22/2006 | CN1738512A 3d circuit module, multilayer 3d circuit module formed thereof and method for manufacturing the circuit modules |
| 02/22/2006 | CN1738040A Cof semiconductor device and a manufacturing method for the same |
| 02/22/2006 | CN1738025A Method for manufacturing trajectory with enlarged capacitive coupling and corresponding trajectory |
| 02/22/2006 | CN1737078A Wiring-connecting material and process for producing circuit board with the same |
| 02/22/2006 | CN1737077A Wiring-connecting material and process for producing circuit board with the same |
| 02/22/2006 | CN1737076A Wiring-connecting material and process for producing circuit board with the same |
| 02/22/2006 | CN1737056A Epoxy resin compositions containing phosphorus and its uses |
| 02/22/2006 | CN1243461C Electronic equipmemt |
| 02/22/2006 | CN1243460C Manufacturing method of circuit formation base plate |
| 02/22/2006 | CN1243393C Composite battery having internal breaker |
| 02/22/2006 | CN1243282C Photosensitive insulation paste and thick film multilayer circuit substrate |
| 02/21/2006 | US7002813 Assembly comprised of a panel-like constructed module and of a connection unit, production method and device |
| 02/21/2006 | US7002812 Electronic module and method for fabricating the same |
| 02/21/2006 | US7002785 Apparatus for protecting electronic circuitry |
| 02/21/2006 | US7002529 Data processing terminal, terminal designing apparatus and method, computer program, and information storing medium |
| 02/21/2006 | US7002447 Fuel tank resistor card having improved corrosion resistance |
| 02/21/2006 | US7002434 Lumped-element transmission line in multi-layered substrate |
| 02/21/2006 | US7002432 Signal transmission structure |
| 02/21/2006 | US7002430 Compact non-linear geometry electromagnetic coupler for use with digital transmission systems |
| 02/21/2006 | US7002428 Dielectric loss compensation methods and apparatus |
| 02/21/2006 | US7002362 Test system for bumped semiconductor components |
| 02/21/2006 | US7002254 Integrated circuit package employing flip-chip technology and method of assembly |
| 02/21/2006 | US7002237 Spherical shaped semiconductor device, a flexible printed wiring substrate, and mounting method thereof |
| 02/21/2006 | US7002234 Low cost capacitors manufactured from conductive loaded resin-based materials |
| 02/21/2006 | US7002225 Compliant component for supporting electrical interface component |
| 02/21/2006 | US7002217 Electrostatic discharge mitigation structure and methods thereof using a dissipative capacitor with voltage dependent resistive material |
| 02/21/2006 | US7002081 Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof |
| 02/21/2006 | US7002080 for mounting semiconductor chips having finely pitched external connection electrodes and an essentially small thermal expansion coefficient; applicable to semiconductor chip mounting boards, motherboards, probe cards; carbon fiber core |
| 02/21/2006 | US7002075 Intermediate substrate |
| 02/21/2006 | US7001569 Comprises shrink-suppressing layers on main surface of presintered ceramic; efficiency; electronic |
| 02/21/2006 | US7001190 Repairable ball grid array contact |
| 02/21/2006 | US7001188 Electrical junction box having an inspection section of a slit width of a tuning fork-like terminal |
| 02/21/2006 | US7001185 Chip scale package socket for various package sizes |
| 02/21/2006 | US7000845 a substrate for a card with an integrated circuit having on two opposing surfaces electrically conductive layers that are electrically interconnected through the substrate |
| 02/21/2006 | US7000316 Conductor board and method for producing a conductor board |
| 02/21/2006 | US7000314 Method for providing flexible circuit using discrete wiring |
| 02/21/2006 | US7000313 forming metallized vias in a substrate |
| 02/21/2006 | US7000312 Circuit board device and mounting method therefor |
| 02/16/2006 | WO2006016816A1 Circuit board with adaptive, electromagnetic coupler |
| 02/16/2006 | WO2006016650A1 Electrode substrate |
| 02/16/2006 | WO2006015907A1 Interface module |
| 02/16/2006 | WO2005112526A8 Printed wiring board, manufacturing method and electronic device |
| 02/16/2006 | WO2005099323A3 Light-emitting diode arrangement and method for the production thereof |
| 02/16/2006 | WO2005065097A3 Internally shielded energy conditioner |
| 02/16/2006 | WO2005062803A3 Printed circuit dielectric foil and embedded capacitors |
| 02/16/2006 | WO2005056274A3 Method and apparatus for producing a detail |
| 02/16/2006 | WO2005053324A3 Patch panel with crosstalk reduction system and method |
| 02/16/2006 | US20060036179 Ultrasound probe wiring method and apparatus |
| 02/16/2006 | US20060035607 Reduction of Near Field Electro-Magnetic Scattering Using High Impedance Metallization Terminations |
| 02/16/2006 | US20060035552 Glass cloth and film substrate using it |
| 02/16/2006 | US20060035491 Geared motor and method for assembling the geared motor |
| 02/16/2006 | US20060035487 Flexible hybrid cable |
| 02/16/2006 | US20060035482 Torsionally-induced contact-force conductors for electrical connector systems |
| 02/16/2006 | US20060035481 Interconnection from multidimensional transducer arrays to electronics |
| 02/16/2006 | US20060035407 Semiconductor substrate structure and processing method thereof |
| 02/16/2006 | US20060035105 A printed circuit board having nonconductive base layer, a layer of copper and/or a copper alloy and a protective overcoating of a tin alloy to safeguard the solderability of the copper; tin alloys containing a gradient of silver, platinum, gold, nickel, bismuth, and/or copper; crystal growth inhibitors |
| 02/16/2006 | US20060035095 Proton-conducting membrane and use thereof verwendung |
| 02/16/2006 | US20060035093 Heat resistant film and metal laminate thereof |
| 02/16/2006 | US20060033872 Structure of liquid crystal display device for easy assembly and disassembly |
| 02/16/2006 | US20060033592 Miniature power splitter |
| 02/16/2006 | US20060033517 Probe for semiconductor devices |
| 02/16/2006 | US20060033216 Stacked packages |
| 02/16/2006 | US20060033207 Microwave-monolithic-integrated-circuit-mounted substrate, transmitter device for transmission only and transceiver device for transmission/reception in microwave-band communication |
| 02/16/2006 | US20060032670 Connection structures for microelectronic devices and methods for forming such structures |
| 02/16/2006 | US20060032669 Electronic circuit device |
| 02/16/2006 | US20060032668 Printed circuit boards and method of producing the same |
| 02/16/2006 | US20060032667 Lead terminal and power supply device |
| 02/16/2006 | US20060032666 Printed circuit board including embedded capacitors and method of manufacturing the same |
| 02/16/2006 | US20060032665 Single layer flex circuit |
| 02/16/2006 | US20060032664 Panel unit capable of avoiding contact between electrically conductive bodies thereon |
| 02/16/2006 | DE202005019256U1 Protection device for preventing the reading of a passive or active transponder associated with, for example, a passport or credit card, comprises a protective cover made from electromagnetically shielding material |
| 02/16/2006 | DE202005017587U1 Earthed electrical component e.g. plug shroud, for surface-mounting on circuit board, has earthing connections and casing formed by single die casting |
| 02/16/2006 | DE202005016971U1 Positioning seat for electrical connector, comprises hollow sections for spools, guide pins, and slots |
| 02/16/2006 | DE102005029518A1 Verfahren und Einrichtungen zur Reduktion von Teilentladungen auf gedruckten Leiterplatten Methods and devices for the reduction of partial discharges on printed circuit boards |
| 02/16/2006 | DE102005028494A1 Circuit substrate for preparing a semiconductor chip carrier by flip chip technique has contact lead frame and flip chip lead frame |
| 02/16/2006 | DE102005028176A1 Leuchtdiode Light-emitting diode |
| 02/16/2006 | DE102005026382A1 Anzeige von Betriebsinstruktionen Show the operating instructions |
| 02/16/2006 | DE102005025947A1 Hierarchisches Modul Hierarchical module |