Patents for H05K 1 - Printed circuits (98,583)
01/2006
01/18/2006EP1269807B1 Method for fabricating electrical connecting element, and electrical connecting element
01/18/2006EP1153460B1 Device for electrically and mechanically connecting two printed circuit boards
01/18/2006EP1116413B1 Apparatus including an electroacoustic transducer having terminal contacts which extend in the direction of the transducer axis and including a printed circuit board having mating contacts
01/18/2006EP1025617B1 Integrated circuit microsatellite
01/18/2006EP0646048B1 Electrically conductive compositions and methods for the preparation and use thereof
01/18/2006CN2752956Y 电子元件 Electronic component
01/18/2006CN2752049Y Ink-jet printer and ink jet head
01/18/2006CN1723747A Board pieces and composite wiring boards using the board pieces
01/18/2006CN1723745A Copper foil with extremely thin adhesive layer and method for producing the copper foil with extremely thin adhesive layer
01/18/2006CN1723591A Connector having a built-in electronic part
01/18/2006CN1723590A Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same
01/18/2006CN1723566A Wiring substrate and radiation detector using same
01/18/2006CN1723565A Wiring substrate and radiation detector using same
01/18/2006CN1723510A Method for forming transparent conductive film and transparent electrode
01/18/2006CN1723243A Epoxy resin composition containing reactive flame retardant phosphonate oligomer and filler
01/18/2006CN1722938A Circuit board, circuit board mounting method, and electronic device using the circuit board
01/18/2006CN1722937A Surface mounting method for electronic element and printed circuit board applying same mounting method
01/18/2006CN1722936A Mounting structure for electronic parts and mounting method
01/18/2006CN1722932A Short-proof printed circuit board structure
01/18/2006CN1722931A Connecting structure of circuit board and method for manufacturing the same
01/18/2006CN1722930A Flexible circuit substrate
01/18/2006CN1722494A Fuse for lithium-ion cell and lithium-ion cell including the fuse
01/18/2006CN1722430A Circuit module and method for manufacturing the same
01/18/2006CN1722395A Circuit connection method
01/18/2006CN1722315A Circuit protection device
01/18/2006CN1722314A Flexible flat cable and method of manufacturing the same
01/18/2006CN1722233A Method for providing electrical crossover in laminated structure
01/18/2006CN1721756A High density LED array
01/18/2006CN1721476A Resin composition, and use and method for preparing the same
01/18/2006CN1721381A Cured ethylene benzyl compounds and method for preparing same, and substrate for high frequency
01/18/2006CN1237861C Electronic device of sealed electronic element and manufacturing method and printed circuit board suitable for same electronic device
01/18/2006CN1237856C Method of producing multi-layer circuit
01/18/2006CN1237854C Method of making microwave, multifunction modules using fluoropolymer substrates
01/18/2006CN1237853C 基板检测装置 Substrate detection apparatus
01/18/2006CN1237852C Multilayer printed circuit board and its producing method, resin composition for filling through hole
01/18/2006CN1237660C Rotary Structure for relaying signals
01/18/2006CN1237612C Contactless interconnection system
01/18/2006CN1237610C Method for producing plate shape body and semiconductor device
01/18/2006CN1237116C Poly ester synthetic (phenyl ether), polyester film, laminates sheet, printed wiring board, and multilayer printed wiring board
01/18/2006CN1237102C Flame retardant resin compositions contg. phosphoramides, and method for prepn. of same
01/17/2006US6988162 High-speed router with single backplane distributing both power and signaling
01/17/2006US6987983 Radio frequency monolithic integrated circuit and method for manufacturing the same
01/17/2006US6987428 Electromagnetic coupler flexible circuit with a curved coupling portion
01/17/2006US6987316 Multilayer ceramic substrate with single via anchored pad and method of forming
01/17/2006US6987315 Ceramic multilayer substrate
01/17/2006US6987224 Polytetrafluoroethylene mixed powder used for insulation of product for high frequency signal transmission and product for high frequency signal transmission using the same
01/17/2006US6987162 Method and apparatus of producing high-density polyimide (HPI) film
01/17/2006US6986965 Device enclosures and devices with integrated battery
01/17/2006US6986950 Partition or method for producing a partition for a multilayer pressed packet
01/17/2006US6986937 Double-sided copper-clad laminate for forming capacitor layer and method for manufacture thereof, and printed wiring board obtained using the double-sided copper-clad laminate for forming capacitor layer
01/17/2006US6986917 Forming an insulating film by thermally curing the solder photoresist thermosetting resin, forming a small hole with a laser beam, electric plating a lead
01/17/2006US6986667 Inset mechanism for electronic assemblies
01/17/2006US6986199 Laser-based technique for producing and embedding electrochemical cells and electronic components directly into circuit board materials
01/17/2006US6986198 Technique provided to form an isolation border in the power plane without the panel falling apart; having a metal layer sandwiched between a pair of photoimageable dielectric layers; photoforming metal filled vias plated-through holes; stability
01/12/2006WO2006004909A2 Combined electromagnetic and optical communication system
01/12/2006WO2006004779A1 Substrate with patterned conductive layer
01/12/2006WO2006004299A1 Method for manufacturing black surface-treated copper foil for emi shield
01/12/2006WO2006004298A1 Method for manufacturing black surface-treated copper foil for emi shield
01/12/2006WO2006003245A1 Sensor product for electric field sensing
01/12/2006WO2006002615A2 Electrical multi-layered component having a reliable soldering contact
01/12/2006WO2005086233A3 Component with encapsulation suitable for wlp and production method
01/12/2006US20060009051 Flexible cable interconnect assembly
01/12/2006US20060009048 Expansible interface for modularized printed circuit boards
01/12/2006US20060008945 Integrated circuit stacking system and method
01/12/2006US20060008632 Thermosetting resin composition, and prepreg, laminated board for wiring board and printed wiring board using the same
01/12/2006US20060008628 Multilayer circuit board and method for manufacturing the same
01/12/2006US20060008579 Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device
01/12/2006US20060007641 Printed board comprising at least one stiff area and at least one flexible area, and method for the production of stiff-flexible printed boards
01/12/2006US20060007638 Sheet capacitor, IC socket using the same, and manufacturing method of sheet capacitor
01/12/2006US20060007636 Electronic module including a low temperature co-fired ceramic (LTCC) substrate with a capacitive structure embedded therein and related methods
01/12/2006US20060007381 Organic electroluminescent display device
01/12/2006US20060006892 Flexible test head internal interface
01/12/2006US20060006777 Backlight assembly for a hand-held liquid crystal display
01/12/2006US20060006487 Chip package substrate having soft circuit board and method for fabricating the same
01/12/2006US20060005996 Method of attaching electronic components to printed circuit board and attachment structure thereof
01/12/2006US20060005995 Circuit board and method of manufacture thereof
01/12/2006US20060005994 Wiring board, method of manufacturing wiring board, and electronic device
01/12/2006US20060005981 Emi shielded module
01/12/2006US20060005383 Method of forming printed circuit card
01/12/2006DE19832012B4 Flachbandleiter mit einer Abzweig- und/oder Reparaturstelle sowie Verfahren zur Herstellung einer Abzweig- und/oder Reparaturstelle an einem derartigen Flachbandleiter Flat strip conductor having a branch and / or repair and to processes for the preparation of a branch and / or repair of such a ribbon conductor
01/12/2006DE19649893B4 Elektrisch leitender Klebstoff und dessen Verwendung Electrically conductive adhesive and its use
01/12/2006DE102005030080A1 Hochdichte Packung mit Wrap-Around-Verbindung High density package with wrap-around connection
01/12/2006DE102004029200A1 Verfahren zur Herstellung eines Gehäuses für eine elektronische Schaltung sowie ein Substrat für ein Gehäuse Method for producing a housing for an electronic circuit and a substrate for a housing
01/12/2006DE102004028989A1 Elektronische Schaltungsvorrichtung und Verfahren zum Stapeln von elektronischen Schaltungseinheiten An electronic circuit device and method of stacking the electronic circuit units
01/12/2006DE10013189B4 Substrat für ein Leistungsmodul Substrate for a power module
01/11/2006EP1615483A2 Circuit board
01/11/2006EP1615287A1 Secondary battery, and secondary battery matrix and multi-lamination secondary battery matrix having the same
01/11/2006EP1615267A1 Metal-base circuit board and its manufacturing method
01/11/2006EP1615264A2 Method of manufacturing an electronic parts packaging structure
01/11/2006EP1614957A2 High density LED array
01/11/2006EP1614771A1 Tin-coated printed circuit boards with a low tendency to the whisker formation
01/11/2006EP1614725A1 Electrically conductive ink jet ink
01/11/2006EP1614713A1 Flame-retarded epoxy resin composition, prepregs containing the same, laminated sheets and printed wiring boards
01/11/2006EP1614704A1 Crosslinked polyimide, composition comprising the same and method for producing the same
01/11/2006EP1614535A1 Multi-layer polyimide films and flexible circuit substrates therefrom
01/11/2006EP1614329A1 Discharging solution, method for producing patterns and method for producing an electronic device using the discharging solution, and electronic device
01/11/2006EP1614326A1 High frequency heating apparatus
01/11/2006EP1614193A1 Radiating slit antenna system
01/11/2006EP1614134A1 Electromagnetic relay
01/11/2006EP1614125A2 Method for producing soldering globules on an electrical component