Patents for H05K 1 - Printed circuits (98,583)
03/2006
03/01/2006EP1630908A1 Hinge connector of a simple structure and electronic apparatus including the hinge connector
03/01/2006EP1630581A2 Lens-barrel and image pickup apparatus
03/01/2006EP1630199A1 Epoxy resin composition
03/01/2006EP1630128A1 Carbon nanotube device, process for producing the same and carbon nanotube transcriptional body
03/01/2006EP1629702A1 Flexible wiring board and flex-rigid wiring board
03/01/2006EP1629549A2 Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells
03/01/2006EP1629534A2 Selective reference plane bridge(s) on folded package
03/01/2006EP1629509A2 Polymer thick film resistor, layout cell, and method
03/01/2006EP1629420A2 Method for producing a contactless ticket and ticket obtained by means of said method
03/01/2006EP1629391A2 Compact electromagnetic coupler for use with digital transmission systems
03/01/2006EP1425759B1 Electrically conductive particles, especially for introducing in liquid media and method for the production thereof
03/01/2006EP1184165B1 Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil
03/01/2006EP1156705B1 Wiring board, semiconductor device and method of producing, testing and packaging the same, and circuit board and electronic equipment
03/01/2006EP1011039B1 Gap-coupling bus system
03/01/2006CN2762490Y Vertical expansion spring sheet device
03/01/2006CN1742526A Member for circuit board, method for manufacturing circuit board, apparatus for manufacturing circuit board
03/01/2006CN1742525A Circuit board device and method for interconnecting wiring boards
03/01/2006CN1742524A Microconnector for FPC connection and method of producing the same
03/01/2006CN1742523A Flexible printed circuit board and connection structure using the circuit board
03/01/2006CN1742470A Transmission line conductor arrangement
03/01/2006CN1742410A Electronic interconnect for PDA/cell phone
03/01/2006CN1742235A Binder diffusion transfer patterning of a thick film paste layer
03/01/2006CN1742231A Patterning layers comprised of spin-on ceramic films
03/01/2006CN1742031A Epoxy resin compositions, methods of preparing, and articles made therefrom
03/01/2006CN1741709A Circuit board and method for producing the same
03/01/2006CN1741708A Circuit board and method for producing a circuit board
03/01/2006CN1741707A Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same
03/01/2006CN1741706A Wiring board
03/01/2006CN1741705A Printed circuit board and inspection method therefor
03/01/2006CN1741136A 线路板 PCB
03/01/2006CN1740230A Material for insulating substrate and products therefrom
03/01/2006CN1244262C Frequency regulation method and configuration for voltage-controlled oscillator
03/01/2006CN1244261C Structure for preventing mosaic copper metal damage and method thereof
03/01/2006CN1244260C Method and apparatus for producing single ceramic electronic element
03/01/2006CN1244259C Method of producing ceramic element for bonding, ceramic element for bonding, vacuum switch and vacuum container
03/01/2006CN1244258C Circuit device and its manufacturing method
03/01/2006CN1244238C Apparatus and method of replacing telephony cards without down time
03/01/2006CN1244139C Semiconductor device and semiconductor assembly
03/01/2006CN1243703C High purity 4,4-isopropylidene-bis-(2,6 d1 bromophenol) and preparation thereof
03/01/2006CN1243681C Dielectric ceramics
02/2006
02/28/2006US7006879 Boring method for circuit board
02/28/2006US7006359 Modular electronic assembly and method of making
02/28/2006US7006356 Driving system with converter control for low-voltage three-phase motors
02/28/2006US7006190 Liquid crystal display for home appliance and printed circuit board thereof
02/28/2006US7005955 Inductor or transformer having a ferromagnetic core that is formed on a printed circuit board
02/28/2006US7005932 Electronic device having adjustable VCO
02/28/2006US7005754 Method of ball grid array (BGA) alignment, method of testing, alignment apparatus and semiconductor device assembly
02/28/2006US7005753 Optimization of routing layers and board space requirements for a ball grid array land pattern
02/28/2006US7005750 Substrate with reinforced contact pad structure
02/28/2006US7005740 Thick film millimeter wave transceiver module
02/28/2006US7005736 Semiconductor device power interconnect striping
02/28/2006US7005735 Array printed circuit board
02/28/2006US7005586 Supplying power/ground to a component having side power/ground pads
02/28/2006US7005585 Mounting board and electronic device using same
02/28/2006US7005584 Compact navigation device assembly
02/28/2006US7005318 Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of times
02/28/2006US7005179 Producing three-dimensional microfluidic channels in flexible polymer substrate and filling with conductive ink
02/28/2006US7005055 Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same
02/28/2006US7004994 Method for making a film from silver-containing particles
02/28/2006US7004984 Resistor and, or capacitor on cermic core; firing, trimming; controlling sintering temperature
02/28/2006US7004761 Display apparatus and connecting cables used in the display apparatus
02/28/2006US7004759 Modules having a plurality of contacts along edges thereof configured to conduct signals to the modules and further having a plurality of contacts along edges thereof configured to conduct signals from the modules
02/28/2006US7003970 Power module and air conditioner
02/28/2006US7003873 Method of making conformal fluid data sensor
02/28/2006US7003871 Solder paste stencil manufacturing system
02/23/2006WO2006018351A1 Printed circuit board comprising at least one thermally critical smd component and method for producing, equipping and soldering a printed circuit board
02/23/2006WO2005101503A3 Device, in particular intelligent power module with planar connection
02/23/2006US20060040819 Ceramic composition and ceramic wiring board
02/23/2006US20060040567 Compressible films surrounding solder connectors
02/23/2006US20060040527 Electric junction box
02/23/2006US20060040523 Integrated socket and cable connector
02/23/2006US20060040522 Method for making a microelectronic interposer
02/23/2006US20060040095 Identifiable flexible printed circuit board and method of fabricating the same
02/23/2006US20060040094 Electronic parts board and method of producing the same
02/23/2006US20060039821 Method of suppressing the oxidation characteristics of nickel
02/23/2006US20060039127 High power density insulated metal substrate based power converter assembly with very low BUS impedance
02/23/2006US20060038646 Precise multi-pole magnetic component and manufacturing method thereof
02/23/2006US20060038639 Systems and methods for blocking microwave propagation in parallel plate structures utilizing cluster vias
02/23/2006US20060038630 Electromagnetic noise suppressor, structure with electromagnetic noise suppressing function, and method of manufacturing the same
02/23/2006US20060038526 Method for mounting multishaft servo amplifier module
02/23/2006US20060038299 Carbon nanotube device, process for producing the same and carbon nanotube transcriptional body
02/23/2006US20060038280 Substrate for producing semiconductor packages
02/23/2006US20060038270 Semiconductor device, semiconductor package, electronic device, and method for establishing information processing environment
02/23/2006US20060038108 Image-generation device, in particular for installation in the roof area or exterior rearview mirror of a motor vehicle
02/23/2006US20060038022 Chipcard and method for production of a chipcard
02/23/2006US20060037991 Electronic parts assembling and testing method, and electronic circuit baseboard manufactured by the method
02/23/2006US20060037778 Circuit board with SMD-components and at least one wired component, and a method for populating, securing and electrical contacting of the components
02/23/2006US20060037777 Mounting structure of electronic components and mounting method thereof
02/23/2006US20060037776 Securable electronic module
02/23/2006US20060037686 Methods and systems for selectively connecting and disconnecting conductors in a fabric
02/23/2006US20060037674 Laminate for HDD Suspension With the use of Thin Copper Foil and Method for Manufacturing the same
02/23/2006US20060037193 Single-sided circuit board and method for manufacturing the same
02/23/2006DE112004000399T5 Endnahe Übersprechen-Kompensation bei Vielfach-Stufen Endnahe compensation crosstalk at multiple levels
02/23/2006DE102005036512A1 Circuit layout, e.g. to act as a voltage divider for measuring direct current voltage and alternating current voltage, has a high-voltage strength of 10 kV or more
02/23/2006DE102004040326A1 Automotive sensor for e.g. adaptive cruise control, blind angle scanning, parking manoeuvres and pre-crash sensors
02/23/2006DE102004039229A1 Bauelement-Anordnung mit einem Trägersubstrat Component arrangement comprising a carrier substrate
02/23/2006DE102004038970A1 HF intermediate connection for multiple wiring structures comprises an electrically conducting filler or coating on the wall of a via
02/23/2006DE102004038964A1 Leiterplatte mit wenigstens einem thermisch kritischen SMD-Bauteil und Verfahren zum Herstellen, Bestücken und Löten einer Leiterplatte Circuit board with at least one thermally critical SMD component and method of manufacturing, assembling and soldering a circuit board
02/23/2006DE102004030930A1 Zinnbeschichtete Leiterplatten mit geringer Neigung zur Whiskerbildung Tin plated circuit boards with little tendency to whisker
02/23/2006CA2576282A1 High speed differential transmission structures without grounds