Patents for H05K 1 - Printed circuits (98,583)
01/2006
01/26/2006DE102005020150A1 Multi-functional remote control switch for audio player in motor vehicle, has switching device outputting manipulation signal of manipulation switches on printed circuit board, to system selected by turning dial between housing and PCB
01/26/2006DE102004033227A1 Metall-Keramik-Substrat A metal-ceramic substrate
01/26/2006DE102004030800A1 Verfahren zur Herstellung einer keramischen Leiterplatte A process for producing a ceramic circuit board
01/26/2006DE102004030388A1 Artikel mit einer Beschichtung von elektrisch leitfähigem Polymer und Verfahren zu deren Herstellung Articles with a coating of electrically conductive polymer, and processes for their preparation
01/26/2006DE10154878B4 Halteelement zur Fixierung eines elektronischen Leistungsbauteils an einem Kühlkörper Holding member for fixing an electronic power component to a heat sink
01/26/2006CA2574211A1 Improved multi-layer integrated rf/if circuit board
01/26/2006CA2574208A1 Improved multi-layer integrated rf/if circuit board
01/26/2006CA2570699A1 Ethoxysilane containing fiberglass binder
01/25/2006EP1619757A1 A double sided insert board
01/25/2006EP1619647A1 Display
01/25/2006EP1618769A1 Article comprising conductive conduit channels
01/25/2006EP1618768A2 Printed circuit device with integrated antenna and implantable sensor processing system with integrated printed circuit board antenna
01/25/2006EP1618571A1 Terminated conductive patterned sheet utilizing conductive conduits
01/25/2006EP1547100A4 Electronic transformer/inductor devices and methods for making same
01/25/2006EP1425170B1 Heat-stabilised poly(ethylene naphthalate) film for flexible electronic and opto-electronic devices
01/25/2006CN1726746A Printed wiring boards having low inductance embedded capacitors and methods of making same
01/25/2006CN1726615A Edge plated transmission line
01/25/2006CN1726259A Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of same
01/25/2006CN1726249A Impregnated glass fiber strands and products including the same
01/25/2006CN1726136A Method for producing a partially metallised film-type element
01/25/2006CN1726098A Fractionally collectable product
01/25/2006CN1725934A Printed circuit board having weak magnetic field sensor and method of manufacturing the same
01/25/2006CN1725933A Wired circuit forming board, wired circuit board, and thin metal layer forming method
01/25/2006CN1725932A Conductive base material with resistance layer and circuit board material with resistance layer
01/25/2006CN1725931A Flexible printing substrate
01/25/2006CN1725930A Printed circuit board
01/25/2006CN1725486A Printed circuit board having structure for relieving stress concentration, and semiconductor chip package equipped with the same
01/25/2006CN1725485A Lead frame with built-in passive element and its manufacturing method
01/25/2006CN1725483A High density package with wrap around interconnect
01/25/2006CN1725474A Circuit apparatus and method of manufacturing the same
01/25/2006CN1725459A Semiconductor substrate structure and process method thereof
01/25/2006CN1724252A Pure copper-coated copper foil and method of producing the same, and TAB tape and method of producing the same
01/25/2006CN1239060C Element mounting base plate and its producing method
01/25/2006CN1239058C Printing circuit board and device
01/25/2006CN1239057C Multi-chip integrated circuit carrier
01/25/2006CN1239056C Flip chip package, circuit thereof and packaging method thereof
01/25/2006CN1239055C Anti-jamming printed circuit board package combined inserting structure
01/25/2006CN1238941C An integrated circuit carrier
01/25/2006CN1238895C Low-inductance gate-controlled thyristor
01/25/2006CN1238862C Dielectric composition for low-temperature sintering and electronic device
01/25/2006CN1238861C Conductive paste, article with the conductive paste coating and method for production thereof
01/25/2006CN1238848C Wiring substrate and wiring method
01/25/2006CN1238757C Electronic assembly and display device
01/25/2006CN1238700C Geothermal heat exchanger heating assaying method and device
01/25/2006CN1238428C Polyimide film, manufacturing method and application
01/25/2006CN1238425C Low permittivity insulating film composition, insulating film forming process and electronic parts
01/25/2006CN1238395C Aqueous polyurethane resin composition
01/25/2006CN1238187C Corrosion prevention for CAC component
01/24/2006US6990543 Memory module with improved data bus performance
01/24/2006US6990355 Flexible printed circuit board and foldable cell phone terminal
01/24/2006US6989995 Capacitor mounting structure
01/24/2006US6989994 Circuit board sub-assemblies, methods for manufacturing same, electronic signal filters including same, and methods, for manufacturing electronic signal filters including same
01/24/2006US6989991 Thermal management system and method for electronic equipment mounted on coldplates
01/24/2006US6989969 Integrated lead suspension and method of construction
01/24/2006US6989606 BGA substrate via structure
01/24/2006US6989586 Integrated circuit packages with reduced stress on die and associated substrates, assemblies, and systems
01/24/2006US6989493 Electrical feedthrough assembly for a sealed housing
01/24/2006US6989329 Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connections
01/24/2006US6989297 Variable thickness pads on a substrate surface
01/24/2006US6989294 Leadless plastic chip carrier with etch back pad singulation
01/24/2006US6989293 Thermally enhanced packaging structure and fabrication method thereof
01/24/2006US6989291 Method for manufacturing circuit devices
01/24/2006US6989199 Copper foil for printed-wiring board and copper-clad laminate using copper foil for printed-wiring board
01/24/2006US6988925 Electrode or circuit pattern; overcoating carbon, impregnating with binder; curing
01/24/2006US6988898 Signal repeating device
01/24/2006US6988788 Ink jet printhead chip with planar actuators
01/24/2006US6988666 Security tag and process for making same
01/21/2006CA2475410A1 Floating pin lamination plate system for multilayer circuit boards
01/19/2006WO2006007166A2 Device and method of manufacture of an interconnection structure for printed circuit boards
01/19/2006WO2006007141A2 Lead solder indicator and method
01/19/2006WO2005101458A3 Method and use of a device for applying coatings onto band-shaped structures during the production of semiconductor components
01/19/2006WO2005091700A3 Shared via decoupling for area arrays components
01/19/2006WO2005088708A3 Improved flip chip mmic on board performance using periodic electromagnetic bandgap structures
01/19/2006US20060014419 Modules for fixing flexible printed circuit boards and flat display devices utilizing the same
01/19/2006US20060012967 Ic chip mounting substrate, ic chip mounting substrate manufacturing method, optical communication device, and optical communication device manufacturing method
01/19/2006US20060012966 Electronic assemblies and systems comprising interposer with embedded capacitors
01/19/2006US20060012421 Printed-circuit board, electronic part having shield structure, and radio communication apparatus
01/19/2006US20060012386 System for measuring an electromagnetic field, a control system using the measuring system, and an electronic circuit designed for the measuring system
01/19/2006US20060012054 High wireability microvia substrate
01/19/2006US20060012028 Device mounting board
01/19/2006US20060011928 Surface-mountable light-emitting diode and/or photodiode and method for the production thereof
01/19/2006US20060011383 Multi-layered circuit board assembly
01/19/2006US20060011382 Wiring board and process for producing the same
01/19/2006US20060011374 Flexible flat cable and method of manufacturing the same
01/19/2006US20060011369 Method and components for implementing EMC shielded resonance damping
01/19/2006DE202005017639U1 Support unit for use in wave soldering machine, has base plate made of light metal that is provided with non-adhesive coating on polytetrafluoroethylene base, where coating is applied by using power coating process
01/19/2006DE112004000260T5 Elektronikbauteilleiterplatte und Verfahren zu deren Herstellung An electronic component circuit board and process for their preparation
01/19/2006DE102005026404A1 Gedruckte Schaltung für geschützte Keramik-Komponente Printed circuit protected ceramic component
01/19/2006DE102004031886A1 Substrate, has coil arrangement two back-to-back partial windings arranged on core, where arrangement is fixed on substrate at its ends and between its ends by respective wire ends, and partial windings have same winding count
01/19/2006DE102004030443A1 Control apparatus especially a surface mounted power element has power component in a housing with both upper and lower heat dissipating surfaces
01/19/2006DE102004020497B3 Method of producing electrical contacts through a composite sheet of semiconductor chips and plastic having conductive particles applies high voltage across sheet
01/19/2006DE102004016480B4 Vollintegrierte hybride optisch-elektrische Leiterplatte Fully integrated hybrid optical-electrical circuit board
01/19/2006DE10065034B4 Faseroptikanschluß und Verfahren zum Benutzen desselben The same fiber optic connector and method of use
01/18/2006EP1617714A1 Electronic circuit assembly, device comprising such assembly and method for fabricating such device
01/18/2006EP1617655A1 Imaging device and mobile terminal using this imaging device
01/18/2006EP1617441A2 Flexible flat cable and method of manufacturing the same
01/18/2006EP1617352A2 Chip card
01/18/2006EP1616995A1 Wet-process nonwoven fabric and process for producing the same
01/18/2006EP1616463A1 High-frequency dielectric heating device and printed board with thermistor
01/18/2006EP1399880B1 Contactless chipcard with an antenna support and chip support made from a fibrous material