Patents for H05K 1 - Printed circuits (98,583)
02/2006
02/16/2006DE102004045735B3 Laminating press with refined steel plate as heating element in each press plate, with increasd heating power in edge regions of heating element
02/16/2006DE102004036890A1 Circuit board device, such as multilayer circuit board for high-frequency signals, has signal hole arranged in filling material within screening hole and through-contacted
02/16/2006DE102004036049A1 Arrangement for a motor vehicle comprises microprocessor and or memory on a circuit board with attached inaccessible voltage source for supply independent of on board circuit
02/16/2006DE102004005022B4 Verfahren zur Herstellung von metallischen Leitbahnen auf elektronischen Bauelementen A process for the production of metallic interconnects to electronic components
02/15/2006EP1626615A1 Flexible circuit board, method for making the same, flexible multi-layer wiring circuit board, and method for making the same
02/15/2006EP1626065A1 Resin composition, method of its composition, and cured formulation
02/15/2006EP1625680A2 Method for optimizing high frequency performance of via structures
02/15/2006EP1625657A2 Distribution of radio-frequency signals in an electronic circuit
02/15/2006EP1625619A1 Interconnection pattern design
02/15/2006EP1625360A2 Measuring device comprising a probe
02/15/2006EP1625357A2 Measuring device comprising a probe
02/15/2006EP1625356A2 Measuring device comprising a probe
02/15/2006EP1625171A1 Polyphosphonate flame retardant curing agent for epoxy resin
02/15/2006EP1483315B1 Continuous filament mat binder system
02/15/2006EP1409574A4 Nanocomposite dielectrics
02/15/2006EP1186212B1 Integrated circuit package having a substrate vent hole
02/15/2006EP1038417B1 Thin-laminate panels for capacitive printed-circuit boards and methods for making the same
02/15/2006EP1025749B1 Process for manufacturing a multi-layer circuit board
02/15/2006EP0728788B1 Process for producing photosensitive resin and liquid photosensitive resin composition
02/15/2006CN2758999Y Circuitboard line guiding structure
02/15/2006CN2758813Y Heat pressing connecting structure for liquid crystal display and printed circuit board
02/15/2006CN1736133A Passive drive matrix display
02/15/2006CN1735828A Photonic circuit board
02/15/2006CN1735510A Soundproof thermal shield
02/15/2006CN1735509A Bonding sheet and one-side metal-clad laminate
02/15/2006CN1735475A Laser trimming of resistors
02/15/2006CN1735326A Resonant tag with a conductive composition closing an electrical circuit
02/15/2006CN1735321A Circuit board with improved welding plate
02/15/2006CN1735320A Method for manufacturing flush type capacitance on printed circuit board and printed circuit board
02/15/2006CN1735318A Flush type resistance manufacturing method and printed circuit board with the same
02/15/2006CN1735316A Circuit base board
02/15/2006CN1735315A Flexibility circuit base board
02/15/2006CN1735314A Printed circuit board and display device using the same
02/15/2006CN1734857A Double-side plug-in USB adapter
02/15/2006CN1734737A Intermetallic spring structure
02/15/2006CN1733469A Flexible metal foil-polyimide laminate and making method
02/15/2006CN1242663C Radio communication printing circuit plate in the form of an electronic macro-component, corresponding interface structure and transfer method onto a motherboard
02/15/2006CN1242661C Method for mfg. multilayer ceramic plate
02/15/2006CN1242659C Process for depositing conducting layer on substrate
02/15/2006CN1242658C Flexible printed substrate
02/15/2006CN1242657C Improved bonding strength between conductive paste and printed substrate and its production method
02/15/2006CN1242513C Low-profile connector
02/15/2006CN1242474C Power module and air conditioner
02/15/2006CN1242373C Matrix display device
02/15/2006CN1241996C Water-dispersible resin composition for use in boring hole in printed wiring board, sheet made from the same, and method for boring hole in printed wiring board using sheet
02/15/2006CN1241976C Semiconductor having themosetting dielectric material and manufacture thereof
02/15/2006CN1241735C Laminate for electronic material
02/15/2006CN1241734C Resin shaping block
02/15/2006CN1241733C Laminate and process for producing same
02/15/2006CN1241721C Method for preparing ceramic mud, ceramic blank and producing single pieces ceramic electronic elements
02/14/2006US7000124 Power management device of an electronic card
02/14/2006US6999643 Method of manufacturing optical waveguide and method of manufacturing opto-electric wiring board
02/14/2006US6999332 Semiconductor package with a controlled impedance bus and method of forming same
02/14/2006US6999330 Power converter and system using the same
02/14/2006US6999318 Heatsinking electronic devices
02/14/2006US6999299 Capacitor structure, a multi-layer wiring board including the same, and a semiconductor device using the multi-layer wiring board
02/14/2006US6999294 Waveguide
02/14/2006US6998943 High-frequency power amplifier
02/14/2006US6998938 Lumped-element low-pass filter in multi-layered substrate
02/14/2006US6998861 Wiring board and soldering method therefor
02/14/2006US6998740 Drive circuit device and motor having the same
02/14/2006US6998715 Grid array electronic component, wire reinforcing method for the same, and method of manufacturing the same
02/14/2006US6998709 RFIC die-package configuration
02/14/2006US6998708 Millimeter wave (MMW) transceiver module with transmitter, receiver and local oscillator frequency multiplier surface mounted chip set
02/14/2006US6998703 Thin package for stacking integrated circuits
02/14/2006US6998696 Integrated thin film capacitor/inductor/interconnect system and method
02/14/2006US6998539 Standoff/mask structure for electrical interconnect
02/14/2006US6998455 Laminate and process for producing the same
02/14/2006US6998344 Method for fabricating semiconductor components by forming conductive members using solder
02/14/2006US6998308 Substrate for carrying a semiconductor chip and a manufacturing method thereof
02/14/2006US6998291 Cost-reducing and process-simplifying wiring board and manufacturing method thereof
02/14/2006US6998290 Economical high density chip carrier
02/14/2006US6998222 Producing an electrically-conductive structure on a non-planar surface
02/14/2006US6997720 Interconnecting module for the base of electronic equipment casing
02/14/2006US6997043 Integration of atmospheric intrusion sensors in electronic component packages
02/14/2006US6996953 System and method for installing a tamper barrier wrap in a PCB assembly, including a PCB assembly having improved heat sinking
02/14/2006US6996902 Method for manufacturing a circuit board
02/14/2006US6996899 Electronic assembly and a method of constructing an electronic assembly
02/14/2006CA2218589C Multiple optical designs for a multifunction sensor
02/09/2006WO2006013950A1 Solution, material for plating, insulating sheet, laminate and printed wiring board
02/09/2006WO2006013772A1 Flexible printed-circuit board
02/09/2006WO2006013735A1 Composite copper foil and method for production thereof
02/09/2006WO2006013230A2 Manufacture of a layer including a component
02/09/2006WO2006013145A1 Printed circuit board with smd components and at least one wired component and a method for picking fixing and electrical contacting of said components
02/09/2006WO2005124445A3 Rearview mirror element having a circuit mounted to the rear surface of the element
02/09/2006WO2005094149A3 Support platform for electrical components, and module comprising said support platform
02/09/2006US20060030180 Electrical connector with a solder ball locking structure and method for manufacturing the same
02/09/2006US20060030176 Arrangement structure of electric junction box
02/09/2006US20060030175 Electrical connection box
02/09/2006US20060030174 Electric power supply device for slide structure
02/09/2006US20060030172 Cable connector assembly having improved mating port
02/09/2006US20060030171 Low voltage differential signal (LVDS) interface flexible flat cable (FFC) and LVDS signal transmission system using the same
02/09/2006US20060030170 Micro-bumps to enhance LGA interconnections
02/09/2006US20060029781 Circuitized substrate and method of making same
02/09/2006US20060029731 Conductive inks for metalization in integrated polymer microsystems
02/09/2006US20060029447 Image forming apparatus and image forming method
02/09/2006US20060028806 Leadframe-based module DC bus design to reduce module inductance
02/09/2006US20060028803 Flash memory with integrated male and female connectors
02/09/2006US20060028222 Interconnect for bumped semiconductor components
02/09/2006US20060028001 Assembly having steering wheel and gasbag module