Patents for H05K 1 - Printed circuits (98,583)
03/2006
03/08/2006EP1632886A1 Interface for a removable electronic device
03/08/2006EP1632864A2 Removable electronic device and method thereof
03/08/2006EP1632533A1 Process for producing modified epoxy resin
03/08/2006EP1631992A2 Transparent conducting structures and methods of production thereof
03/08/2006EP1532851B1 Production of electronic organic circuits by contact printing
03/08/2006EP1472915B1 Circuit carrier and production thereof
03/08/2006EP1428260B1 Non-conductive substrate forming a strip or a panel, on which a plurality of carrier elements are configured
03/08/2006EP1425949B1 Printed circuit board
03/08/2006EP1342294A4 I-channel surface-mount connector
03/08/2006EP1342292A4 Circuit module with universal connectivity
03/08/2006EP1305258B1 Ceramic microelectromechanical structure
03/08/2006EP0971370B1 Cable and method of manufacturing it
03/08/2006EP0953997B1 Electronic part and method for producing the same
03/08/2006CN2764111Y Circuit board holding structure of optics display module
03/08/2006CN2764110Y Clamping means for circuit board
03/08/2006CN2764105Y Circuit board
03/08/2006CN1745609A Device for the metallisation of printed forms which are equipped with electrically conductive tracks and associated metallisation method
03/08/2006CN1745608A Heat dissipating arrangement for an electronic appliance
03/08/2006CN1745437A 导电浆料 Conductive paste
03/08/2006CN1745118A Electronic material composition, electronic product and method of using electronic material composition
03/08/2006CN1744808A Displaying apparatus
03/08/2006CN1744804A Hinge connector having a shaft member and electronic apparatus including the hinge connector
03/08/2006CN1744800A Multilayer wiring board and process for fabricating a multilayer wiring board
03/08/2006CN1744796A Method for producing electroconductive pattern and use thereof
03/08/2006CN1744795A Circuit device and manufacture method for circuit device
03/08/2006CN1744794A Step type printed circuit board and its manufacturing method
03/08/2006CN1744793A Flexible connection substrate and folding electronic apparatus
03/08/2006CN1744792A Electrical devices having an oxygen barrier coating
03/08/2006CN1744791A Wiring substrate and semiconductor device using the same
03/08/2006CN1744303A Package substrate for a semiconductor device, a fabrication method for same, and a semiconductor device
03/08/2006CN1743851A Clamp for inspecting printed circuit board
03/08/2006CN1743336A Novel hydroxyaryl phosphine oxides,diglycidyl ethers and epoxy compositions, composites and laminates derived therefrom
03/08/2006CN1245061C Printed wiring board and method of production thereof
03/08/2006CN1245059C Electronic parts module and electric equipment
03/08/2006CN1244610C Cyanate based thermoset compositions
03/07/2006US7009863 Memory module with integrated bus termination
03/07/2006US7009848 Method, adapter card and configuration for an installation of memory modules
03/07/2006US7009816 Head support mechanism and magnetic disk device
03/07/2006US7009812 Magnetic transducer for perpendicular magnetic recording with single pole write head with trailing shield
03/07/2006US7009484 Magnetic assembly
03/07/2006US7009293 Interconnect substrate, semiconductor device, methods of fabricating, inspecting, and mounting the semiconductor device, circuit board, and electronic instrument
03/07/2006US7009157 Procedure for soldering the constituent layers of a multilayer printed circuit and the machine used for same
03/07/2006US7009117 Printed circuit board and structure for soldering electronic parts thereto
03/07/2006US7009116 Contact device and a process to facilitate contact of power electronics components and an assembly that consists of one or several power electronics components
03/07/2006US7009115 Optimization of routing layers and board space requirements for a ball grid array package
03/07/2006US7009114 includes substrate having wiring pattern and line-shaped insulation pattern disposed on substrate so as to intersect wiring pattern and to define portion of wiring pattern for land electrode
03/07/2006US7008981 a high glass transition temp. epoxy resin system, ferroelectric ceramic particles having two particle size distributions, one of them pertaining to a nano level, a flexibilizer; a macromolecular dispersant and additives
03/07/2006US7008754 Method for forming image on object surface including circuit substrate
03/07/2006US7008563 individually coated with soluble polymer thus electrically isolated from one another; dielectric of a conducting rod composite; electromechanical film or fiber; fluids with electrically-controllable viscosity; tailored electronic properties
03/07/2006US7008549 Circuit board, process for producing the same and a power module employing the same
03/07/2006US7008483 Curing printed circuit board coatings
03/07/2006US7008238 Electrical testing system with electrical adapter
03/07/2006US7008236 Set of printed circuit boards comprising replacement board
03/07/2006US7007852 Data distribution mechanism in the form of ink dots on cards
03/07/2006US7007379 Production method of printed circuit board
03/03/2006CA2515714A1 Circuit module system and method
03/02/2006WO2006023926A2 Method for forming radio frequency antenna
03/02/2006WO2006023294A1 Package with failure-resistant conductive traces
03/02/2006WO2006022846A1 Reduction of near field electro-magnetic scattering using high impedance metallization terminations
03/02/2006WO2006022404A1 Touch panel
03/02/2006WO2006022207A1 Metal-clad white laminate
03/02/2006WO2005107353A3 Reinforcement for substrate assemblies
03/02/2006WO2005089076A3 Film type conductive sheet, method for manufacturing the same, and conductive tape using the same
03/02/2006US20060047355 Method and apparatus for adjusting characteristics of multi-layer electronic components
03/02/2006US20060047100 Containing 10-40 percent by weight of an inorganic spherical hollow material having an aspect ratio of 2 or less; for use in information and telecommunications equipment such as a cellular mobile phone and as a fixing/holding member of a transmitter-receiver element
03/02/2006US20060046537 Slanted vias for electrical circuits on circuit boards and other substrates
03/02/2006US20060046535 Water-resistant casing structure for electronic control device
03/02/2006US20060046534 Video expansion card
03/02/2006US20060046531 Top loaded burn-in socket
03/02/2006US20060046530 LGA socket for CPU
03/02/2006US20060046526 Contact protector for electrical connectors
03/02/2006US20060046525 Printed circuit board type connector using surface mount and through hole technologies
03/02/2006US20060046040 Composite laminate and method for manufacturing the same
03/02/2006US20060045418 Optical printed circuit board and optical interconnection block using optical fiber bundle
03/02/2006US20060044778 Dial module, manufacturing method thereof, led display element, display module, movement module, connector module and meter using them
03/02/2006US20060044776 Fixing mechanism for printed circuit board
03/02/2006US20060044771 Electronic module with conductive polymer
03/02/2006US20060044735 Package substrate for a semiconductor device, a fabrication method for same, and a semiconductor device
03/02/2006US20060043382 Metal base wiring board for retaining light emitting elements, light emitting source, lightning apparatus, and display apparatus
03/02/2006US20060043346 Precursor compositions for the deposition of electrically conductive features
03/02/2006US20060042834 Electronic device with a warped spring connector
03/02/2006US20060042833 Rectification chip terminal structure
03/02/2006US20060042832 Multilayer circuit board and method of producing the same
03/02/2006US20060042831 Visually inspectable surface mount device pad
03/02/2006US20060042830 Flexible multi-level cable
03/02/2006US20060042827 SD/MMC cards
03/02/2006US20060042826 Circuit board, multi-layer wiring board method for making circuity board, and method for making multi-layer wiring board
03/02/2006US20060042825 Cooling of substrate using interposer channels
03/02/2006US20060042824 Printed wiring board and method of manufacturing the same
03/02/2006US20060042823 Wired circuit board
03/02/2006US20060042822 Printed circuit board and inspection method therefor
03/02/2006DE102004061853A1 Combined support structure and manufacturing jig panel for integrated circuit with chip, jig panel and supporting circuit board
03/02/2006DE102004041417A1 Electrical arrangement for microelectronics has component insulated from substrate by dielectric layer on conductive substrate
03/02/2006DE102004020670B4 Electrical component for controlling permittivity in a dielectric has an electrode structure and a dielectric with a fluid like water and an anisotropic material to be electrically aligned
03/02/2006DE102004005082B4 Kondensator mit einem Dielektrikum aus einer selbstorganisierten Monoschicht einer organischen Verbindung und Verfahren zu dessen Herstellung Capacitor having a dielectric made of a self-assembled monolayer of an organic compound and methods for its preparation
03/01/2006EP1631137A1 Module component and method for manufacturing the same
03/01/2006EP1631133A1 Visually inspectable surface mount device pad
03/01/2006EP1631132A2 Aluminium/ceramic bonding substrate
03/01/2006EP1631131A2 Transmission circuit board structure, transmission circuit board, and connector having the same
03/01/2006EP1631130A2 Transmission circuit board