| Patents for H05K 1 - Printed circuits (98,583) |
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| 03/16/2006 | US20060054870 Dielectric composition for use in circuitized substrates and circuitized substrate including same |
| 03/16/2006 | US20060054353 Method and device for protection of a component or module |
| 03/16/2006 | US20060054351 Substrate structure, a method and an arrangement for producing such substrate structure |
| 03/16/2006 | US20060054350 Circuit board and method of manufacturing the same |
| 03/16/2006 | US20060054349 Cof film carrier tape and its manufacturing method |
| 03/16/2006 | US20060054338 Using special visibility materials proximate candidate component locations to enhance recognition |
| 03/16/2006 | US20060054262 Process for producing heat-resistant flexible laminate and heat-resistant flexible laminate produced thereby |
| 03/16/2006 | US20060053591 Hinge connector having a shaft member of a simple structure and electronic apparatus including the hinge connector |
| 03/16/2006 | DE19628890B4 LC-Filter LC filter |
| 03/16/2006 | DE19541039B4 Chip-Modul sowie Verfahren zu dessen Herstellung -Chip module and method of producing the |
| 03/16/2006 | DE102005036834A1 Schaltungsplatine und Verfahren zum Herstellen einer Schaltungsplatine Circuit board and method of manufacturing a circuit board |
| 03/16/2006 | DE102005033691A1 Verfahren zur Herstellung einer Basisplatte für eine Schaltungsbaugruppe, Basisplatte für eine Schaltungsbaugruppe, und Schaltungsplatte unter Verwendung der Basisplatte A process for preparing a base plate for a circuit board, base plate for a circuit package and circuit board using the base plate |
| 03/16/2006 | DE102005026442A1 Oberflächenmontagemodul Surface Mount Module |
| 03/16/2006 | DE102004052909A1 Printed circuit board for weak magnetic field sensor, has outer layers with excitation and detection circuits that are connected to respective circuits on base plate to surround soft magnetic cores, respectively |
| 03/16/2006 | DE102004043747A1 Transponder manufacturing method, involves displacing and fastening antenna aerial on substrate surface by displacement of sonotrode to form antenna, and connecting end piece of aerial with connection surface of chip by thermo compression |
| 03/16/2006 | DE102004041598A1 Semiconductor arrangement`s bending reducing method, involves desorbing vaporizable substances present in wiring carrier by temperature treatment before encasing and/or mounting of chips on carrier |
| 03/16/2006 | DE102004039803A1 Production of conductor systems with high capacitive coupling comprises forming dielectric on substrate, forming trench structure and applying conductive layer and forming capacitor dielectric to produce conductor zone and capacitor zone |
| 03/16/2006 | DE102004038250A1 Vorrichtung zur Aufnahme und zur Befestigung eines elektronischen Bauelements auf einer Leiterplatte Device for receiving and for attaching an electronic component on a circuit board |
| 03/16/2006 | DE102004037786A1 Leiterplatte mit SMD-Bauteilen und mindestens einem bedrahteten Bauteil sowie ein Verfahren zum Bestücken, Befestigen PCB with SMD components and at least one wired component and a method for fitting, fixing |
| 03/16/2006 | DE102004037629A1 Connector facilitating construction of three-dimensional circuit using circuit boards, comprises conductive surface mounting device with flexural region |
| 03/16/2006 | DE102004037462A1 Baugruppe mit Lenkrad und Gassackmodul Assembly with steering wheel and airbag module |
| 03/16/2006 | CA2579062A1 Capacitor layer-forming material and printed circuit board having internal capacitor circuit obtained by using capacitor layer-forming material |
| 03/15/2006 | EP1635625A2 Substrate manufacturing method and circuit board |
| 03/15/2006 | EP1635624A2 Wired circuit board |
| 03/15/2006 | EP1635317A1 Plasma display apparatus including electrode pads |
| 03/15/2006 | EP1634486A1 Circuit assembly and method of its manufacture |
| 03/15/2006 | EP1634342A2 Method of fabricating electronic interconnect devices using direct imaging of dielectric material |
| 03/15/2006 | EP1634330A1 Dielectric composite material comprising benzocyclobutene which contains a filler in order to decrease the coefficient of thermal expansion |
| 03/15/2006 | EP1634326A2 Method for producing a ceramic/metal substrate |
| 03/15/2006 | EP1634127A2 Multi functional timepiece module with application specific printed circuit boards |
| 03/15/2006 | EP1594928A4 High conductivity inks with improved adhesion |
| 03/15/2006 | EP1349135B1 Method of forming electrode for flat panel display |
| 03/15/2006 | EP1297539B1 High-frequency electronic part comprising an insulation material and method of preparing the same |
| 03/15/2006 | EP1105941B1 Connector with two rows of terminals having tail portions with similar impedance |
| 03/15/2006 | CN1748300A Semiconductor device and radiation detector employing it |
| 03/15/2006 | CN1748299A Semiconductor device and radiation detector employing it |
| 03/15/2006 | CN1747627A Wiring board, and electronic device with an electronic part mounted on a wiring board, as well as method of mounting an electronic part on a wiring board |
| 03/15/2006 | CN1747624A Partially completed wiring circuit board assembly sheet and production method of wiring circuit board using said sheet |
| 03/15/2006 | CN1747622A Metal-base circuit carrier |
| 03/15/2006 | CN1747621A Multi-piece substrate and method of manufacturing the substrate |
| 03/15/2006 | CN1747620A Laminated structure of printing circuit board and multi-laminate laminated structure |
| 03/15/2006 | CN1747349A Signal transmission framework |
| 03/15/2006 | CN1747244A Printed circuit board type connector using surface mount and through hole technologies |
| 03/15/2006 | CN1747162A Semiconductor device having tin-based solder layer and method for manufacturing the same |
| 03/15/2006 | CN1747161A Semiconductor device and method of manufacturing semiconductor device |
| 03/15/2006 | CN1747153A Substrate plate structure with tin-ball fixed welding pad and combination structure therewith |
| 03/15/2006 | CN1747073A Coated particles |
| 03/15/2006 | CN1245857C Circuit board and mounting method for the same, and electronic apparatus using the same |
| 03/15/2006 | CN1245856C Alloy plating liquid for modular printed circuit board surface treatment |
| 03/15/2006 | CN1245855C Multilayer wiring board, touch face-plate and their manufacturing method |
| 03/15/2006 | CN1245854C Panel and its making method and installation method for electronic circuit component |
| 03/15/2006 | CN1245756C Base for producing semiconductor device by using three element alloy |
| 03/15/2006 | CN1245728C Method for manufacturing laminated electronic device |
| 03/15/2006 | CN1245699C Apparatus and control method for removing coating on conductive material of dielectric carrier |
| 03/15/2006 | CN1245586C Light-emitting panel |
| 03/14/2006 | US7013452 Method and apparatus for intra-layer transitions and connector launch in multilayer circuit boards |
| 03/14/2006 | US7013437 High data rate differential signal line design for uniform characteristic impedance for high performance integrated circuit packages |
| 03/14/2006 | US7013088 Method and apparatus for parallel optical interconnection of fiber optic transmitters, receivers and transceivers |
| 03/14/2006 | US7012814 Circuit board connection structure, method for forming the same, and display device having the circuit board connection structure |
| 03/14/2006 | US7012812 Memory module |
| 03/14/2006 | US7012810 Leadframe-based module DC bus design to reduce module inductance |
| 03/14/2006 | US7012489 Coaxial waveguide microstructures and methods of formation thereof |
| 03/14/2006 | US7012327 Phased array antenna using (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates |
| 03/14/2006 | US7012197 Multi-layer printed circuit board and method for manufacturing the same |
| 03/14/2006 | US7012196 Apparatus, method and system for interfacing electronic circuits |
| 03/14/2006 | US7012117 Water-dispersible resin composition for use in boring hole in printed wiring board, sheet comprising the composition, and method for boring hole in printed wiring board using the sheet |
| 03/14/2006 | US7011988 Build-up structures with multi-angle vias for Chip to Chip interconnects and optical bussing |
| 03/14/2006 | US7011862 Method for producing wiring substrate |
| 03/14/2006 | US7011556 Contact module, connector and method of producing said contact module |
| 03/14/2006 | US7011113 Hydraulic cartridge valve solenoid coil for direct mount to a printed circuit board |
| 03/14/2006 | CA2432193C High efficiency single port resonant line |
| 03/09/2006 | WO2006025242A1 Double-layered flexible board and method for manufacturing same |
| 03/09/2006 | WO2006025240A1 Double layer flexible board and method for manufacturing the same |
| 03/09/2006 | WO2005119765A3 Assembly including vertical and horizontal joined circuit panels |
| 03/09/2006 | WO2005083803A3 Light-emitting diode arrangement for a high-power light-emitting diode, and method for producing a light-emitting diode arrangement |
| 03/09/2006 | WO2005069733A3 Reactive fine particles |
| 03/09/2006 | WO2005059930A3 Printed circuit embedded capacitors |
| 03/09/2006 | US20060052881 Telemetry signal collection, process and provision equipment |
| 03/09/2006 | US20060052231 20 to 39% of SiO2, from 5 to 35% of B2O3, from 2 to 15% of Al2O3, from 1 to 25% of CaO+SrO, from 5 to 25% of BaO, from 0 to 35% of ZnO, and from 0 to 10% of TiO2+ZrO2+SnO2, provided that B2O3+ZnO is from 15 to 45%, free of alkali metal oxides or contains such oxides less than 1%; low temperature firing |
| 03/09/2006 | US20060051985 Ultra-thin flexible electronic device |
| 03/09/2006 | US20060050498 Die module system and method |
| 03/09/2006 | US20060050497 Buffered thin module system and method |
| 03/09/2006 | US20060050496 Thin module system and method |
| 03/09/2006 | US20060050489 Optimized mounting area circuit module system and method |
| 03/09/2006 | US20060050481 Plasma display apparatus including heat sink assembly apparatus |
| 03/09/2006 | US20060050108 Ink jet printhead chip with predetermined micro-electromechanical systems height |
| 03/09/2006 | US20060049897 Resonator, filter, communication apparatus |
| 03/09/2006 | US20060049777 High-pressure discharge lamp operation device and illumination appliance having the same |
| 03/09/2006 | US20060049545 Securing electrical conductors |
| 03/09/2006 | US20060049516 Nickel/gold pad structure of semiconductor package and fabrication method thereof |
| 03/09/2006 | US20060049509 Printed wiring board |
| 03/09/2006 | US20060049498 Methods of making microelectronic assemblies including compliant interfaces |
| 03/09/2006 | US20060049491 Connection structure for coaxial connector and multilayer substrate |
| 03/09/2006 | US20060049130 Multilayer wiring board and process for fabricating a multilayer wiring board |
| 03/09/2006 | US20060048969 Bus structure |
| 03/09/2006 | US20060048968 Construction for DC to AC power inverter |
| 03/09/2006 | US20060048963 Laminate, printed circuit board, and preparing method thereof |
| 03/09/2006 | DE4212950B4 Leitfähiges Pigment, Verfahren zur Herstellung und Verwendung Conductive pigment, methods for preparing and using |
| 03/08/2006 | EP1633174A2 Wired circuit board |
| 03/08/2006 | EP1633173A1 Flexible connection substrate and folding electronic apparatus |