| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 03/23/2006 | US20060059682 Manufacturing method of a multi-layer circuit board embedded with a passive component |
| 03/23/2006 | DE19920475B4 Oberflächenbefestigte Dünnfilm-Schmelzsicherung Paved surface thin film fuse |
| 03/23/2006 | DE10230712B4 Elektronikeinheit mit einem niedrigschmelzenden metallischen Träger Electronic unit with a low-melting metal support |
| 03/23/2006 | DE102005038254A1 Schaltungsmodulsystem und -Verfahren Circuit module system and method |
| 03/23/2006 | DE102004036960A1 Leiterplatte und Verfahren zur Herstellung einer solchen Leiterplatte Printed circuit board and method for producing such a printed circuit board |
| 03/23/2006 | DE102004012231B4 Metal-ceramic substrate for electronics switches or modules comprises a ceramic layer containing aluminum oxide, zirconium oxide and yttrium oxide with a copper foil or layer formed on both sides |
| 03/22/2006 | EP1638384A1 Circuit arrangement for cooling of surface mounted semi-conductors |
| 03/22/2006 | EP1638378A1 Prepreg for printed wiring board and copper-clad laminated board |
| 03/22/2006 | EP1637903A1 Three-dimensional imaging processing module incorporating stacked layers containing microelectronic circuits |
| 03/22/2006 | EP1637554A1 Resin composition for printed wiring board, prepreg, and laminate obtained with the same |
| 03/22/2006 | EP1636838A2 Capacitor-related systems for addressing package/motherboard resonance |
| 03/22/2006 | EP1636396A1 Pre-plating surface treatments for enhanced galvanic-corrosion resistance |
| 03/22/2006 | EP1636300A2 Nanoporous laminates |
| 03/22/2006 | EP1636209A1 Epoxy compound and cured epoxy resin product |
| 03/22/2006 | EP1635761A1 Improved package with electronic circuitry |
| 03/22/2006 | EP1594929A4 High conductivity inks with low minimum curing temperatures |
| 03/22/2006 | EP1517959A4 Polyester-type formaldehyde free insulation binder |
| 03/22/2006 | EP1464211B1 Electric circuit module and method for its assembly |
| 03/22/2006 | EP1446251A4 Highly filled composites of powdered fillers and polymer matrix |
| 03/22/2006 | EP1446237A4 Manufacture having double sided features in a metal-containing web formed by etching |
| 03/22/2006 | EP1410701A4 Method of manufacturing an integrated circuit carrier |
| 03/22/2006 | EP1340289A4 Board integrated resilient contact elements array and method of fabrication |
| 03/22/2006 | EP1020908B1 Resin-sealed surface mounting type electronic parts |
| 03/22/2006 | EP0980737B1 Laser machining method, laser machining device and control method of laser machining |
| 03/22/2006 | CN1751546A Method for manufacturing an electrically conductive pattern |
| 03/22/2006 | CN1751544A Prepreg for printed wiring board and copper-clad laminated board |
| 03/22/2006 | CN1750927A Layered polyimide/metal product |
| 03/22/2006 | CN1750739A Method for producing thin film resistor on printed circuit board |
| 03/22/2006 | CN1750738A Wired circuit board |
| 03/22/2006 | CN1750737A Printed circuit board having chip package mounted theron and method of fabricating same |
| 03/22/2006 | CN1750736A Printed circuit board including embedded passive component and method of fabricating same |
| 03/22/2006 | CN1750735A Printed circuit board with conductor fuse |
| 03/22/2006 | CN1750734A Circuit board and method of manufacturing the same |
| 03/22/2006 | CN1750259A Multiple chip packaged conductor frame, its producing method and its package structure |
| 03/22/2006 | CN1750244A Wiring board, method of manufacturing the same, and semiconductor device |
| 03/22/2006 | CN1750187A Transformer or inductor containing a magnetic core having sidewalls and center core portion |
| 03/22/2006 | CN1247055C Connection structure of distribution substrate and its display device |
| 03/22/2006 | CN1247054C Thin film substrate |
| 03/22/2006 | CN1247053C Multilayer circuit board and method for manufacturing multilayer circuit board |
| 03/22/2006 | CN1246902C Electronic line chip |
| 03/22/2006 | CN1246901C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 03/22/2006 | CN1246899C 半导体装置 Semiconductor device |
| 03/22/2006 | CN1246703C Method and device for detecting multi-layer electronic parts by optical mode |
| 03/21/2006 | US7017128 Concurrent electrical signal wiring optimization for an electronic package |
| 03/21/2006 | US7016802 Photocontrol devices having flexible mounted photosensors and methods of calibrating the same |
| 03/21/2006 | US7016490 Circuit board capacitor structure for forming a high voltage isolation barrier |
| 03/21/2006 | US7016212 Memory module and memory system suitable for high speed operation |
| 03/21/2006 | US7016200 Module support for electrical/electronic components |
| 03/21/2006 | US7016198 Printed circuit board having outer power planes |
| 03/21/2006 | US7015869 High frequency antenna disposed on the surface of a three dimensional substrate |
| 03/21/2006 | US7015717 Signal transmitting device suited to fast signal transmission |
| 03/21/2006 | US7015637 A substrate having a wiring comprises a plurality of recesses arranged in a direction crossing the longitudinal direction of the wiring, and wherein the thickness of the wiring is 30 nm or more at the bottom of each of the plurality of recesses; noncracking; antipeeling agents |
| 03/21/2006 | US7015591 Exposed pad module integrating a passive device therein |
| 03/21/2006 | US7015590 Reinforced solder bump structure and method for forming a reinforced solder bump |
| 03/21/2006 | US7015575 LSI package |
| 03/21/2006 | US7015574 Electronic device carrier adapted for transmitting high frequency signals |
| 03/21/2006 | US7015573 Method and apparatus for molding module electronic devices and a module electronic device molded thereby |
| 03/21/2006 | US7015571 Multi-chips module assembly package |
| 03/21/2006 | US7015570 Electronic substrate with inboard terminal array, perimeter terminal array and exterior terminal array on a second surface and module and system including the substrate |
| 03/21/2006 | US7015405 Panel device for ATCA main board |
| 03/21/2006 | US7014784 Methods and apparatus for printing conductive thickfilms over thickfilm dielectrics |
| 03/21/2006 | US7014743 Separating nanotubes and/or nanowires of different electronic properties into groups (e.g. conductors and semiconductors), by suspending them in a liquid, establishing an asymmetrical alternating-current (AC) between electrodes, causing migration |
| 03/21/2006 | US7014731 Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same |
| 03/21/2006 | US7014474 Electrical connection and component assembly for constitution of a hard disk drive |
| 03/21/2006 | US7014472 System for making high-speed connections to board-mounted modules |
| 03/21/2006 | US7014333 Small portable flashlight |
| 03/21/2006 | US7013563 Method of testing spacings in pattern of openings in PCB conductive layer |
| 03/21/2006 | US7013561 Method for producing a capacitor-embedded circuit board |
| 03/21/2006 | US7013559 Method of fabricating a semiconductor device package |
| 03/21/2006 | US7013557 Method of packaging electronic components without creating unnecessary solder balls |
| 03/16/2006 | WO2006028643A2 Circuit module system and method |
| 03/16/2006 | WO2006028289A1 Modified polyimide resin and curable resin composition |
| 03/16/2006 | WO2006028207A1 Electrolytic copper foil with carrier foil furnished with primer resin layer and process for producing the same |
| 03/16/2006 | WO2006028205A1 Conductive paste and flexible printed wiring board obtained by using the conductive paste |
| 03/16/2006 | WO2006028155A1 Module type electronic component and electronic device |
| 03/16/2006 | WO2006028098A1 Wiring board |
| 03/16/2006 | WO2006028001A1 Optical wiring resin composition and photo-electric composite wiring board |
| 03/16/2006 | WO2005123377A3 Functional elastic textile structures |
| 03/16/2006 | WO2005122655A3 Pcb including a star shaped through-hole solder pad |
| 03/16/2006 | WO2005104324A3 Folded, fully buffered memory module |
| 03/16/2006 | WO2005099326A3 A method for manufacturing a flexible circuit board having small thickness and flexible board manufactured thereby |
| 03/16/2006 | WO2005091365A3 Coupling substrate for semiconductor components and method for the production thereof |
| 03/16/2006 | US20060057916 Water-soluble polyimide precursor, aqueous polyimide precursor solution, polyimide, impregnated material with polyimide binder, and laminate |
| 03/16/2006 | US20060057868 Socket for ball grid array devices |
| 03/16/2006 | US20060057830 Method for producing bumps on an electrical component |
| 03/16/2006 | US20060057827 Method for manufacturing in electrically conductive pattern |
| 03/16/2006 | US20060057819 Electronic part producing method and electronic part |
| 03/16/2006 | US20060057420 Sputtering vapor deposition; polyimide seals; clad laminates |
| 03/16/2006 | US20060057340 Composition of a resin of acrylate resin and an epoxy resin, a metal powder of two metals, one low-melting-point metal. and one high-melting-point metal, a phenol-type curing agent and flux; good conductivity and good adhesiveness to substrates |
| 03/16/2006 | US20060056765 Architecture of connecting optical pcb, transceiver modules for optical pcb and optical connection block |
| 03/16/2006 | US20060056759 Polished polyimide substrate |
| 03/16/2006 | US20060056757 Optical connection device and optoelectronic hybrid apparatus including the same |
| 03/16/2006 | US20060056756 Photonic circuit board |
| 03/16/2006 | US20060056162 Substrate manufacturing method and circuit board |
| 03/16/2006 | US20060055649 Liquid crystal display device having a drive IC mounted on a flexible board directly connected to a liquid crystal panel |
| 03/16/2006 | US20060055517 Circuit board assembly with integral antenna |
| 03/16/2006 | US20060055506 Securing device for a security module connector |
| 03/16/2006 | US20060055484 Method and apparatus for rejecting common mode signals on a printed circuit board and method for making same |
| 03/16/2006 | US20060055475 Microwave oscillator |
| 03/16/2006 | US20060055171 Releasable connector including swivel |