Patents for H05K 1 - Printed circuits (98,583)
04/2006
04/05/2006CN1755442A Electro-optical device and electronic apparatus
04/05/2006CN1754913A Flame retardant compositions
04/05/2006CN1250062C Manufacturing method of modular board
04/05/2006CN1250059C Method for making layer increased circuit board with inner embedded film shape resistor assembly
04/05/2006CN1250058C Circuit board producing method and circuit board producing device
04/05/2006CN1250056C Method for processing printed circuit board
04/05/2006CN1250055C Printed circuit board and electronic device therewith
04/05/2006CN1250032C Oscillator and oscillator character regulating method
04/05/2006CN1249673C Hard disk drive comprising flexible printed circuit with damping material
04/05/2006CN1249649C Wiring substrate and its manufacturing method
04/05/2006CN1249648C Display module and display unit
04/05/2006CN1249502C Liquid crystal display device
04/05/2006CN1249182C Low dielectric loss tangent film and distributing film
04/05/2006CN1248849C Two-layer copper polyimide substrate material
04/04/2006US7024329 Method and apparatus for testing PCBA subcomponents
04/04/2006US7024086 System and method for integrating optical layers in a PCB for inter-board communications
04/04/2006US7023707 Information handling system
04/04/2006US7023705 Ceramic optical sub-assembly for optoelectronic modules
04/04/2006US7023699 Liquid cooled metal thermal stack for high-power dies
04/04/2006US7023697 Actuation membrane for application to a card slot of a system
04/04/2006US7023687 High energy density capacitors
04/04/2006US7023685 Sheet capacitor, IC socket using the same, and manufacturing method of sheet capacitor
04/04/2006US7023291 Oven controlled crystal oscillator for high stability
04/04/2006US7023288 Piezoelectric oscillator and its manufacturing method
04/04/2006US7023084 Plastic packaging with high heat dissipation and method for the same
04/04/2006US7023081 Land pattern configuration
04/04/2006US7023073 Noise shield type multi-layered substrate
04/04/2006US7022919 Printed circuit board trace routing method
04/04/2006US7022917 Construction and electrical connection technique in textile structures
04/04/2006US7022547 Card manufacturing technique and resulting card
04/04/2006US7022412 Member having metallic layer, its manufacturing method and its application
04/04/2006US7022404 Substrate is formed from a thermosetting composition comprising a polybutadiene or polyisoprene resin; a crosslinking agent; a particulate fluoropolymer; and a magnesium hydroxide having a low ionic content; flame retardancy without use of halogenated flame retardants
04/04/2006US7022402 Dielectric substrates comprising a polymide core layer and a high temperature fluoropolymer bonding layer, and methods relating thereto
04/04/2006US7022399 Semiconductor device integrated multilayer wiring board
04/04/2006US7022397 biaxial oriented polyester film comprising polyethylene-2,6-naphthalenedicarboxylate as major component; excellent handling properties and durability; especially suitable for use in automobile interior devices which are potentially exposed to high temperature
04/04/2006US7022377 Solution polymerization; solvent extraction; imidation; reduced dielectric constant; for use in electronics/printed circuits
04/04/2006US7022373 Method of forming composite insulating layer and process of producing wiring board
04/04/2006US7022276 Method for manufacturing circuit board and circuit board and power conversion module using the same
04/04/2006US7022251 Methods for forming a conductor on a dielectric
04/04/2006US7021944 Socket and contact of semiconductor package
04/04/2006US7021943 Optical transmission module
04/04/2006US7021942 Area array connector having stacked contacts for improved current carrying capacity
04/04/2006US7021836 Attenuator and conditioner
04/04/2006US7020961 Method for manufacturing a bump-attached wiring circuit board
04/04/2006US7020960 Systems and methods for fabricating printed circuit boards
03/2006
03/30/2006WO2006034017A1 Field device incorporating circuit card assembly as environmental and emi/rfi shield
03/30/2006WO2006033852A2 Structured surface using ablatable radiation sensitive material
03/30/2006WO2006033467A1 Polymer, method for producing the polymer, optical film, and image display device
03/30/2006WO2006033346A2 Flexible printed wiring board
03/30/2006WO2006032867A1 Sterilisation sensor
03/30/2006WO2006032836A1 Thick-film hybrid production process
03/30/2006WO2006032835A2 Electrical circuit package with ceramic substrate, conductive platelet and conductor body
03/30/2006WO2006032726A1 Method for assembling an opto-electric module and a structure of an opto-electric module
03/30/2006WO2006032363A1 Device and method for influencing vibration of a planar element
03/30/2006WO2005084259A3 Dual segment molded lead frame connector for optical transceiver modules
03/30/2006US20060069185 Flame retardant compositions
03/30/2006US20060068621 Device, arrangement and method for connecting lines, motor vehicle comprising such an device or arrangement, respectively
03/30/2006US20060068620 Connector and terminal fitting
03/30/2006US20060068619 Rear-projection type imaging device
03/30/2006US20060068617 Motor and bus bar
03/30/2006US20060068616 Wiring pattern formation method, wiring pattern, and electronic device
03/30/2006US20060068615 Electromechanical sub-assembly
03/30/2006US20060068611 Heat transfer device and system and method incorporating same
03/30/2006US20060068610 High speed connectors that minimize signal skew and crosstalk
03/30/2006US20060068609 Electronic device
03/30/2006US20060068211 Low temperature polyimide adhesive compositions and methods relating thereto
03/30/2006US20060068210 Low temperature polyimide adhesive compositions and methods relating thereto
03/30/2006US20060066416 Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package
03/30/2006US20060065439 Wiring board and wiring board manufacturing method
03/30/2006US20060065438 Circuit component mounting device
03/30/2006US20060065436 System and method for protecting microelectromechanical systems array using back-plate with non-flat portion
03/30/2006US20060065435 Transparent substrate provided with electroconductive strips
03/30/2006US20060065434 Signal transmission structure and circuit substrate thereof
03/30/2006DE19812636A9 Verbindungsanordnung zum Herstellen einer Chipkarte Connection arrangement for producing a chip card
03/30/2006DE102005037392A1 Schaltungsplatine und Verfahren zum Herstellen einer Schaltungsplatine Circuit board and method of manufacturing a circuit board
03/30/2006DE102004061353B3 Multiconductor flat strip cable production, useful for computers and control systems, by enveloping stretched conductor section with highly elastic synthetic plastic insulator
03/30/2006DE102004046633A1 Trägeranordnung für eine Hochfrequenzantenne und Verfahren zu ihrer Herstellung Support arrangement for a radio-frequency antenna and processes for their preparation
03/30/2006DE102004045896A1 Transponder has antenna wires on substrate with laterally offset connection to flip chip modules using contact surfaces on connection bridge substrate
03/30/2006DE102004044683A1 Platine mit Leiterbahnsicherung Board with conductor fuse
03/30/2006DE102004044144A1 Verfahren zum Herstellen einer Schaltung A method of manufacturing a circuit
03/30/2006DE102004041207A1 Electrical printed circuit boards connecting device for electronic control switch, has connecting body formed as base connecting units on isolated plates that are arranged horizontally and vertically, spring holder and resting connector
03/30/2006DE102004038305A1 Verfahren zur Herstellung einer elektrisch leitenden Verbindung bei einer T-förmigen oder L-förmigen Leiterplattenkonfiguration A process for producing an electrically conductive connection with a T-shaped or L-shaped circuit board configuration
03/30/2006DE102004036683A1 Steuervorrichtung, insbesondere mechatronisches Getriebe- oder Motorsteuergerät Control device, in particular mechatronic transmission or engine control unit
03/30/2006DE102004007230B4 Gehäuse mit flüssigkeitsdichter elektrischer Durchführung Housing with liquid-tight electrical duct
03/30/2006DE10115192B4 Verfahren zur Herstellung einer elektrisch leitenden Paste A process for preparing an electrically conductive paste
03/29/2006EP1641330A1 Circuit board
03/29/2006EP1641329A1 Printed wiring board
03/29/2006EP1641328A2 Part with electrically conductive paths
03/29/2006EP1641096A1 Electric junction box and its assembling process
03/29/2006EP1641081A1 Press-fit terminal, printed board connection structure using the press-fit terminal, and electrical connection box
03/29/2006EP1640428A1 Adhesive composition for semiconductor device and cover lay film, adhesive sheet, and copper-clad polyimide film each made with the same
03/29/2006EP1640350A1 Composition for ceramic substrate, ceramic substrate, process for producing ceramic substrate and glass composition
03/29/2006EP1640338A1 Metal hydride fine particle, method for producing same, liquid dispersion containing metal hydride fine particle, and metallic material
03/29/2006EP1640154A1 Heat-stabilised Poly(Ethylene Naphthalate) film for flexible electronic and opt-electronic devices
03/29/2006EP1640153A1 Multilayer body and method for producing same
03/29/2006EP1640150A1 Polyimide/metal film laminates and process for the production of printed wiring board using the laminate
03/29/2006EP1640074A1 Structure for mounting multi-featured vibration actuator on circuit board
03/29/2006EP1639872A1 Integrated electromechanical arrangement and method of production
03/29/2006EP1639871A1 Method for manufacturing an electrically conductive pattern
03/29/2006EP1639870A1 Microelectronic substrates with thermally conductive pathways and methods of making same