Patents for H05K 1 - Printed circuits (98,583)
12/2006
12/07/2006US20060274483 Printed circuit board for connecting of mult-wire cabling to surge protectors
12/07/2006US20060274472 Noise filter mounting structure
12/07/2006US20060273446 Circuit board device and method of interconnecting wiring boards
12/07/2006US20060272854 Wiring board and method for manufacturing the same
12/07/2006US20060272853 Wiring board and manufacturing method of wiring board
12/07/2006US20060272850 Interlayer connection conductor and manufacturing method thereof
12/07/2006DE19639427B4 Elektrischer Widerstand mit Thermosicherung Electrical resistance with thermal fuse
12/07/2006DE102005051497B3 Memory module e.g. registered dual in-line memory module, has two groups of semiconductor chips connected by two separate line buses, respectively, where conducting paths of line buses branch out to all semiconductor chips of groups
12/07/2006DE102004039803B4 Verfahren zur Herstellung einer Leitbahnanordnung mit erhöhter kapazitiver Kopplung sowie zugehörige Leitbahnanordnung A process for preparing a Interconnect arrangement with increased capacitive coupling and associated Interconnect arrangement
12/06/2006EP1729555A1 Method for manufacturing a circuit board and a system of circuit boards as well as a circuit board and a system of circuit boards made by the methods
12/06/2006EP1729553A2 Reduced size structure
12/06/2006EP1729552A2 Wiring board and manufacturing method of wiring board
12/06/2006EP1729340A1 High frequency package, transmitting and receiving module and wireless equipment
12/06/2006EP1729337A2 Electronic device and method of manufacturing the same
12/06/2006EP1728414A1 Device provided with an electric motor and a main printed circuit board and mounting method
12/06/2006EP1313795B1 Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate
12/06/2006CN2845399Y Flexible printed circuit board
12/06/2006CN2845127Y Inductance eliminator
12/06/2006CN1875666A Photocontrol devices having flexible mounted photosensors and methods of calibrating the same
12/06/2006CN1875493A Light-emitting diode arrangement comprising a heat-dissipating plate
12/06/2006CN1875373A Data carrier or document carrier
12/06/2006CN1875322A Chemically amplified positive photosensitive thermosetting resin composition, method of forming cured article, and method of producing functional device
12/06/2006CN1875084A 阻燃剂组合物 Flame retardant composition
12/06/2006CN1875060A Aerogel/ptfe composite insulating material
12/06/2006CN1874663A Captive shoulder nut assembly
12/06/2006CN1874652A Method for controlling impedance
12/06/2006CN1874651A Wired circuit board and production method thereof
12/06/2006CN1874650A 电路板 Circuit board
12/06/2006CN1874649A Flexibility circuit board
12/06/2006CN1874648A Wiring board and manufacturing method of wiring board
12/06/2006CN1874647A Printing routing basal lamina and semiconductor testing device
12/06/2006CN1874060A Method for manufacturing antenna and method for manufacturing semiconductor device
12/06/2006CN1873971A Solder foil, semiconductor device and electronic device
12/06/2006CN1873968A Wiring board and semiconductor device
12/06/2006CN1873967A Wiring board, semiconductor device and display module
12/06/2006CN1873859A Coil with air core of forcipated duplex winding based on printed circuit board
12/06/2006CN1873837A Thick film conductor paste compositions for LTCC tape in microwave applications
12/06/2006CN1288950C Electrical circuit arrangement comprised of a number of electrically interconnected circuit components
12/06/2006CN1288946C Method for preparing surface treated copper foil
12/06/2006CN1288945C Method for preparing surface treated copper foil
12/06/2006CN1288944C Thick-membrane distribution shaping method and manufacturing method for laminated electronic parts
12/06/2006CN1288815C Method for determining electronic circuit breaker by inquiry of user and arrangement concerned
12/06/2006CN1288795C Circuit board and circuit device and mfg. method thereof
12/06/2006CN1288747C Staircase shape pattern for semiconductor chip welding
12/06/2006CN1288682C Electrolytic condenser and circuit substrate of built-in electrolytic condenser and manufacture method thereof
12/06/2006CN1288670C Metal powder pulp
12/06/2006CN1288194C Method for preparing polyimide film for flexible printed plate board
12/05/2006US7145787 Programmable power supply
12/05/2006US7145783 Apparatus reducing radiated emission from electronic modules
12/05/2006US7145779 Memory module
12/05/2006US7145774 Backside cooling apparatus for modular platforms
12/05/2006US7145428 Circuit substrate
12/05/2006US7145251 Colored conductive wires for a semiconductor package
12/05/2006US7145239 Circuit board with trace configuration for high-speed digital differential signaling
12/05/2006US7145234 Circuit carrier and package structure thereof
12/05/2006US7145231 Electronic apparatus
12/05/2006US7145229 Silicone metalization
12/05/2006US7145227 Stacked memory and manufacturing method thereof
12/05/2006US7145226 Scalable microelectronic package using conductive risers
12/05/2006US7145221 Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
12/05/2006US7145083 Reducing or eliminating cross-talk at device-substrate interface
12/05/2006US7144833 Dielectric ceramic composition and laminated ceramic device using the same
12/05/2006US7144830 Multilayer dielectrics and electroconductive yarns with cavities between; circuit carrier
12/05/2006US7144754 Device having resin package and method of producing the same
12/05/2006US7144679 Polyimide resin precursor solution, laminates for electronic components made by using the solution and process for production of the laminates
12/05/2006US7144655 Thin-film battery having ultra-thin electrolyte
12/05/2006US7144618 Multilayer composite and method for preparing the same
12/05/2006US7144491 Used in the manufacture of an electrolytic copper foil that allows fine patterning and that is superior in terms of elongation and tensile strength at ordinary temperatures and high temperatures
12/05/2006US7144472 Prepreg production method and prepeg production device and prepreg obtained by the production method and production method for insulating layer attached copper foil and insulating layer attached copper foil obtained by the production method
12/05/2006US7144471 Bonding method and apparatus
12/05/2006US7144259 Optical transceiver module having a dual segment molded lead frame connector
12/05/2006US7144257 Mounting structure, electro-optical device, electronic apparatus, and method of manufacturing electro-optical device
12/05/2006US7143929 Ceramic circuit board and method for manufacturing the same
12/05/2006US7143500 Method to prevent damage to probe card
12/05/2006US7143492 Printed circuit board defective area transplant repair method
12/05/2006CA2434161C Process for the manufacture of printed circuit boards with plated resistors
11/2006
11/30/2006WO2006127721A1 Method for forming via hole in substrate for flexible printed circuit board
11/30/2006WO2006126586A1 Circuit substrate connection structure and circuit substrate connection method
11/30/2006WO2006125947A2 Improved printed circuit board assembly
11/30/2006WO2006125512A2 Device and method for assembly of electrical components
11/30/2006WO2006076609A3 Printable electronic features on non-uniform substrate and processes for making same
11/30/2006WO2006056778A3 Recycling printed circuit boards
11/30/2006WO2006028643A3 Circuit module system and method
11/30/2006WO2005117301A3 Multiple channel optical transceiver modules
11/30/2006US20060271895 Non-Uniform Decoupling Capacitor Distribution for Uniform Noise Reduction Across Chip
11/30/2006US20060270275 Pluggable module and cage
11/30/2006US20060270253 Plug connector for circuit board connection
11/30/2006US20060270252 Electrical connection box
11/30/2006US20060270251 Low profile structure
11/30/2006US20060270111 Integrated circuit package substrate having a thin film capacitor structure
11/30/2006US20060269824 Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells
11/30/2006US20060268532 Multi-function peripheral with improved ground structure
11/30/2006US20060268531 Circuit boards and assembly methods
11/30/2006US20060268530 Wiring board, semiconductor device and display module
11/30/2006US20060268529 Arrangement for electrical and/or mechanical components on a large, flexible foil type conductor area
11/30/2006US20060268410 Rearview mirror constructed for efficient assembly
11/30/2006US20060268213 Low-cost flexible film package module and method of manufacturing the same
11/30/2006US20060267713 Low cost highly isolated RF coupler
11/30/2006US20060267216 Inductive filters and methods of fabrication therefor
11/30/2006US20060267195 Wiring substrate and radiation detector using same