Patents for H05K 1 - Printed circuits (98,583)
11/2006
11/30/2006US20060267135 Circuit arrangement placed on a substrate and method for producing the same
11/30/2006US20060266550 Through-hole arrangement for a ball grid array package
11/30/2006US20060266548 Flexible flat cable, printed circuit board, and electronic apparatus
11/30/2006US20060266545 Wired circuit board
11/30/2006US20060266544 Printed circuit board (PCB) with electrostatic discharge protection
11/30/2006US20060266156 Metal-containing fine particles, dispersion containing metal-containing fine particles and electroconductive metal-containing material
11/30/2006US20060265870 Printed circuit board and printed circuit board manufacturing method
11/30/2006DE19819217B4 Leiterplatte für eine elektronische Komponente Circuit board for an electronic component
11/30/2006DE102005024133A1 Elastomeric connecting piece for producing electrical connection between two electronic components, has retainers for connection with respective components and contact unit with excess length in relation to distance between components
11/30/2006DE102005024096A1 Vorrichtung und Verfahren zur Montage elektrischer Bauteile Device and method for mounting electrical components
11/30/2006DE10157025B4 Ultraschallendoskop Ultrasonic endoscope
11/29/2006EP1727412A1 Electro-static discharge structure for terminal with LCD module
11/29/2006EP1727407A2 Wired circuit board
11/29/2006EP1727400A1 Flash device
11/29/2006EP1726480A2 Motor vehicle rear view mirror assembly comprising a flashing light-emitting device
11/29/2006EP1726419A1 Process for producing ceramic sheet, ceramic substrate utilizing the same and use thereof
11/29/2006EP1726197A2 An element for carrying electronic components
11/29/2006EP1726194A2 Support platform for electrical components, and module comprising said support platform
11/29/2006EP1726192A1 Printed circuit board comprising at least one connection borehole for a connecting wire or pin of a wired electronic component
11/29/2006EP1726191A1 Flexible circuit board assembly
11/29/2006EP1725978A1 Polymeric film substrate for use in radio-frequency responsive tags
11/29/2006CN2842989Y Electromagnetic-shield device combination and magnetic-proof lid
11/29/2006CN2842988Y Flexible circuit-board
11/29/2006CN2842987Y Anti-electromagnetic-interference device of printed circuitboard
11/29/2006CN2842986Y Adhesive elastic trip and dislocation elastic-trip group using same
11/29/2006CN2842985Y Low structural elastic trip with separated welded sections and circuit board device using same
11/29/2006CN2842776Y 电路板连接装置 Circuit board connecting device
11/29/2006CN2842749Y Circuit-board cell installing structure
11/29/2006CN2840744Y Glittering neck-tie
11/29/2006CN1871883A A method of producing a conductive layer on a substrate
11/29/2006CN1871882A Circuit board
11/29/2006CN1871671A Embedded toroidal inductors
11/29/2006CN1871300A Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability
11/29/2006CN1870883A Method of mounting radio tag chips and method of writing management information onto radio tag chips
11/29/2006CN1870877A Thermal gain thin-type electronic mechanism
11/29/2006CN1870862A System and method for integrating optical layers in a PCB for inter-board communications
11/29/2006CN1870860A Electronic substrate manufacturing method, semiconductor device, and manufacturing method of electronic machine
11/29/2006CN1870858A Heat sink arrangement for electrical apparatus
11/29/2006CN1870857A Shielded electronic circuit unit and method of manufacturing the same
11/29/2006CN1870856A Wired circuit board
11/29/2006CN1870855A Flexible metal-coated laminated board using for fine pattern
11/29/2006CN1870854A Ceramic substrate and its manufacturing method
11/29/2006CN1870853A Circuit board layouts of high speed differential signal edge card connector
11/29/2006CN1870852A Printed circuit board with improved differential via
11/29/2006CN1870259A 多层布线基片 A multilayer wiring substrate
11/29/2006CN1869108A Laminated polyester film, flame-retardant polyester film thereof, copper-clad laminated plate and circuit substrate
11/29/2006CN1287647C Circuit board and production method thereof
11/29/2006CN1287646C High-radiating multi-layer circuit board
11/29/2006CN1287645C High-heat radiation and low-noise circuit board
11/29/2006CN1287525C Topology for providing clock signal and multi-path unit on electric circuit module
11/29/2006CN1286608C Method and device for laser beam machining of laminated material
11/28/2006US7142909 Biocompatible bonding method and electronics package suitable for implantation
11/28/2006US7142898 Folding electronic device
11/28/2006US7142836 Microwave filter distributed on circuit board of wireless communication product
11/28/2006US7142817 Portable telephone
11/28/2006US7142742 Method for arranging conducting lines of a flexible cable in an optical disk drive
11/28/2006US7142433 Method of embedding at least one flexible conductive track foil, a conductive track unit as well as an embedding unit therefor
11/28/2006US7142395 Method for making noble metal conductive leads for suspension assemblies
11/28/2006US7142345 Rearview mirror constructed for efficient assembly
11/28/2006US7142068 Voltage controlled oscillator small in reduction of inductance and Q
11/28/2006US7142065 Crystal oscillator device and electronic apparatus using the same
11/28/2006US7142000 Mounting spring elements on semiconductor devices, and wafer-level testing methodology
11/28/2006US7141937 High-pressure discharge lamp operation device and illumination appliance having the same
11/28/2006US7141899 Component carrier
11/28/2006US7141884 Module with a built-in semiconductor and method for producing the same
11/28/2006US7141874 Electronic component packaging structure and method for producing the same
11/28/2006US7141742 Alternating voided areas of anti-pads
11/28/2006US7141741 Circuit board
11/28/2006US7141627 comprises aromatic polyester; high glass transition temperature and low dissipation factor; improved solvent solubility; dielectrics; electronics
11/28/2006US7141528 Controlled microstructure and morphology; particle formation from aerosol of precursors by heating to low temperature; spray conversion; fuel cells, batteries
11/28/2006US7141453 Method of mounting wafer on printed wiring substrate
11/28/2006US7141188 Organic compositions
11/28/2006US7141185 High conductivity inks with low minimum curing temperatures
11/28/2006US7141129 outer dielectric layer may include at least one of CaO, MgO, ZrO2, BaO, and SiO2, and the inner dielectric layer may include BaTiO3
11/28/2006US7140924 Compensation system and method for negative capacitive coupling in IDC
11/28/2006US7140884 Contact assembly and method of making thereof
11/28/2006US7140883 Contact carriers (tiles) for populating larger substrates with spring contacts
11/28/2006US7140531 Method of fabricating a substantially zero signal degradation electrical connection on a printed circuit broad
11/28/2006US7140104 Method of producing circuit component built-in module with embedded circuit component
11/28/2006CA2286372C Wholly aromatic polyamide fiber synthetic paper sheet
11/23/2006WO2006125056A1 Reduced-size vco/pll module
11/23/2006WO2006124864A1 Impedance controlled via structure
11/23/2006WO2006123783A1 Printed wiring board
11/23/2006WO2006122837A1 Control unit comprising a flexible circuit board
11/23/2006WO2006122467A1 A packaging substrate with flat bumps for ic or discrete device and method of manufacturing the same
11/23/2006WO2006102876A3 Electronic assembly
11/23/2006WO2006076605A3 Circuit modeling and selective deposition
11/23/2006US20060264709 Capsule-type medical apparatus
11/23/2006US20060264704 Capsule-type medical apparatus
11/23/2006US20060264106 Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor
11/23/2006US20060264083 Capsule-type endoscope
11/23/2006US20060264072 Electrical connector and system having contact array interface for engaging contacts at varying centerline spacing
11/23/2006US20060263939 Device and method for including passive components in a chip scale package
11/23/2006US20060263641 Heating multilayer compressed film; lamination; controlling temperature; miniaturized circuits
11/23/2006US20060263584 Composite material, electrical circuit or electric module
11/23/2006US20060263003 Substrate for mounting IC chip, substrate for motherboard, device for optical communication, manufacturing method of substrate for mounting IC chip, and manufacturing method of substrate for motherboard
11/23/2006US20060262584 Computer Memory Cards Using Flash EEprom Integrated Circuit Chips and Memory-Controller Systems
11/23/2006US20060262511 Method for integrated circuit fabrication using pitch multiplication
11/23/2006US20060261839 Motherboard memory slot ribbon cable and apparatus
11/23/2006US20060261465 Circuit board with trace configuration for high-speed digital differential signaling