Patents for H05K 1 - Printed circuits (98,583)
11/2006
11/16/2006US20060255157 Method for production of a card with a double interface and microcircuit card obtained thus
11/16/2006US20060255147 Long range optical reader
11/16/2006US20060254814 Ground shield structure
11/16/2006US20060254813 Plating buss and a method of use thereof
11/16/2006US20060254812 Printed circuit boards having embedded thick film capacitors
11/16/2006US20060254811 Circuit board and method for its production
11/16/2006US20060254810 Technique for accommodating electronic components on a multilayer signal routing device
11/16/2006US20060254809 Modular integrated circuit chip carrier
11/16/2006US20060254808 Substrate precursor structures
11/16/2006US20060254052 Dielectric substrate with aperture; grounding layer; electroconductive overcoating; multilayer ; irradiating with ions
11/16/2006US20060254051 Method for the space-saving installation of electrical wiring
11/16/2006US20060254050 Method for fabricating wiring board provided with passive element, and wiring board provided with passive element
11/16/2006DE102005032489B3 Circuit board multi-layer structure with integrated electric component, has insert embedded between two flat electrically insulating liquid resin structures
11/16/2006DE102005022062A1 Leiterplatte Circuit board
11/16/2006DE102005021494A1 Bauelementemodul und Verfahren zu dessen Verwendung Module components and method of use
11/16/2006DE102004034397B4 Bildsensormodul mit einem Waferebenenpaket Image sensor module with a wafer-level package
11/15/2006EP1722614A1 Wiring board and method of manufacturing the same
11/15/2006EP1722613A1 Three-dimensional circuit board
11/15/2006EP1722612A1 Component mounting board structure and production method thereof
11/15/2006EP1722611A2 Electronic device with an electrical coil
11/15/2006EP1722411A2 Ceramic circuit board
11/15/2006EP1722018A1 Double glass cloth, and prepreg and substrate for printed wiring board using the glass cloth
11/15/2006EP1721878A1 Insulating ceramic composition, insulating ceramic sintered body, and multilayer ceramic electronic component
11/15/2006EP1721740A1 Heat-resistant resin laminated film, multilayer film with metal layer including same, and semiconductor device
11/15/2006EP1721498A2 Electronic module and method for the production thereof
11/15/2006EP1721497A2 Improved flip chip mmic on board performance using periodic electromagnetic bandgap structures
11/15/2006EP1721496A2 Preferential ground and via exit structures for printed circuit boards
11/15/2006EP1721368A2 Midspan patch panel with circuit separation for data terminal equipment, power insertion and data collection
11/15/2006EP1720956A1 Etched dielectric film in microfluidic devices
11/15/2006EP1569757A4 Apparatus for microdeposition of multiple fluid materials
11/15/2006EP1546051B9 Low-temperature, fluoride free fiber glass compositions and products made using same
11/15/2006EP1543453A4 System and method for modifying electronic design data
11/15/2006EP0882086B1 Composition exhibiting improved fluorescent response
11/15/2006EP0815709B1 A motherboard assembly which has a single socket that can accept a single integrated circuit package or multiple intgrated circuit packages
11/15/2006CN2838209Y Pins of flexible PCB
11/15/2006CN2838208Y Enclosed elastic plate
11/15/2006CN2838207Y Multi-layer flexible circuit board
11/15/2006CN2838065Y Flat USB electronic device
11/15/2006CN1864450A Electrical circuit apparatus and method for assembling same
11/15/2006CN1864404A Electronic device having bezel structure
11/15/2006CN1864258A Electrical circuit apparatus and methods for assembling same
11/15/2006CN1864095A Device and method of making a device having a flexible layer structure
11/15/2006CN1863449A Isolation structure for preventing electromagnetic interference and making method thereof
11/15/2006CN1863438A Verfahren zum herstellen einer leiterplatte mit darin eingebetteten elektronikkomponenten
11/15/2006CN1863436A Method of manufacturing a wiring board, a wiring board, a circuit element and a communications device
11/15/2006CN1863435A Printed wiring board manufacturing method
11/15/2006CN1863434A Component mounting board structure and production method thereof
11/15/2006CN1863433A Laminate for printed circuit board and method of manufacturing the same
11/15/2006CN1863432A Anisotropic conducting film and circuitboard using film
11/15/2006CN1862884A Printed circuit board, connector, and electronic device
11/15/2006CN1862795A Wiring board and method of manufacturing the same
11/15/2006CN1285243C Electrostatic discharge protection device of circuit board
11/15/2006CN1285165C Drive system for AC device of low-voltage three-phase AC motor
11/15/2006CN1284839C Pressure-sensitive adhesive tape for provisionally fixing green sheet for ceramic electronic part and process for producing ceramic electronic part
11/14/2006US7136551 Optical printed circuit board and optical interconnection block using optical fiber bundle
11/14/2006US7136545 Optical connector device, and optical and electrical circuit combined board using the same
11/14/2006US7136345 Optical pickup device and optical disk device
11/14/2006US7136289 Dual-stacked 10 Gigabit X2 uplinks in a single rack unit switch
11/14/2006US7136288 Memory device
11/14/2006US7136275 Polymeric dielectric material for high-energy density capacitors
11/14/2006US7136133 Active matrix substrate, liquid crystal display apparatus having the same, and method for manufacturing the same
11/14/2006US7136008 Low cost electromagnetic energy absorbers manufactured from conductive loaded resin-based materials
11/14/2006US7135952 Electronic transformer/inductor devices and methods for making same
11/14/2006US7135758 Surface mount solder method and apparatus for decoupling capacitance and process of making
11/14/2006US7135642 Integrated circuit carrier with conductive rings and semiconductor device integrated with the carrier
11/14/2006US7135394 Conductive layers and fabrication methods thereof
11/14/2006US7135204 Method of manufacturing a wiring board
11/14/2006US7135203 Continuous reel-to-reel printing process for forming a thin conductive polymer coating over a portion of a flexible circuit in the non-critical region to reduce the measured surface voltage substantially; for making hard disk drives
11/14/2006US7135119 Method for making a multilayer module with high-density printed circuits
11/14/2006US7134918 Electrical connector assembly
11/14/2006US7134891 Flat cable and connector as well as electronic device
11/14/2006US7134882 Connector having a built-in electronic part
11/14/2006US7134881 Land grid array connector and package mount structure
11/14/2006US7134880 Connector with self-adjusting vertical alignment feature
11/14/2006US7134779 Light-emitting element circuit
11/14/2006US7134599 Circuit board inspection apparatus
11/14/2006US7134592 Method and protection apparatus for installation of a temperature-sensitive electronic component
11/14/2006US7134198 Method for manufacturing electric element built-in module with sealed electric element
11/14/2006US7134195 Method of production of multilayer circuit board with built-in semiconductor chip
11/14/2006US7134194 Method of developing an electronic module
11/14/2006CA2370518C Memory module with offset notches for improved insertion and stability and memory module connector
11/14/2006CA2297738C Solid-state energy storage module employing integrated interconnect board
11/14/2006CA2246761C Lighting device for a cabinet
11/09/2006WO2006118971A2 Generic patterned conductor for customizable electronic devices
11/09/2006WO2006118908A2 Apertures for signal shaping using ground and signal pth back-drilling
11/09/2006WO2006118349A1 Clad member and printed-circuit board
11/09/2006WO2006118323A1 Composition containing fluorine-containing aromatic polymer and laminated body containing fluorine-containing aromatic polymer
11/09/2006WO2006118239A1 Process for producing double-sided flexible printed board and double-sided flexible printed board
11/09/2006WO2006118236A1 Method for oxide dielectric layer formation, and capacitor layer forming material comprising oxide dielectric layer formed by said formation method
11/09/2006WO2006118230A1 Material for plating and use thereof
11/09/2006WO2006118211A1 Circuit board and method for manufacturing same
11/09/2006WO2006118181A1 Conductive paste and flexible printed wiring board obtained with the conductive paste
11/09/2006WO2006076608A3 A system and process for manufacturing custom electronics by combining traditional electronics with printable electronics
11/09/2006WO2006056643A3 Method for manufacturing an electronics module
11/09/2006WO2005067693A3 Method and apparatus to create electrical junctions for information routing in textile structures
11/09/2006US20060253270 Model for modifying drill data to predict hole locations in a panel structure
11/09/2006US20060252310 Electrical connector
11/09/2006US20060251823 Kinetic spray coating of powder particles onto a plastic covered substrate without first removing the covering; using a a supersonic nozzle to accelerate particles entrained in a heated gas to force them through a hole in a mask pressed to the surface to remove the plastic and adhere particles
11/09/2006US20060251818 Method for forming transparent conductive film and transparent electrode
11/09/2006US20060250830 Programmable power supply