Patents for H05K 1 - Printed circuits (98,583)
01/2008
01/02/2008CN101097896A Power supply regulating device
01/02/2008CN101096136A Method for preparing laminated board
01/02/2008CN100359998C Method for mounting multishaft servo amplifier module
01/02/2008CN100359996C Printed circuit board and manufacturing method thereof
01/02/2008CN100359995C Connecting structure of circuit board and method for manufacturing the same
01/02/2008CN100359994C Chip-on-film use copper foil
01/02/2008CN100359682C Thin electronic label and method for making same
01/02/2008CN100359681C Semiconductor device and its lead frame
01/02/2008CN100359674C Module type semi-conductor device
01/02/2008CN100359369C 显示装置 Display device
01/02/2008CN100359328C Connector for measuring electric resistance, apparatus and method for measuring electric resistance of circuit board
01/02/2008CN100358963C Thermosetting adhesive or pressure-sensitive adhesive composition and thermosetting adhesive or pressure-sensitive adhesive tape or sheet
01/02/2008CN100358960C Thermosetting adhesive or pressure-sensitive adhesive tape or sheet, and process of producing the same
01/01/2008US7315969 Memory module with a test device
01/01/2008US7315459 Electromagnetic noise reduction device
01/01/2008US7315446 Hard drive connecting device for notebook computer
01/01/2008US7315226 Strip line device, printed wiring board mounting member, circuit board, semiconductor package, and method of forming same
01/01/2008US7315224 High data rate interconnecting device
01/01/2008US7315116 Organic electroluminescent display device with separately connected signal lines and power lines
01/01/2008US7315083 Circuit device and manufacturing method thereof
01/01/2008US7315049 LED assembly with vented circuit board
01/01/2008US7315000 Electronic module with dual connectivity
01/01/2008US7314841 Material for a multilayer substrate used for propagation of signals in a high-frequency band; can be sintered at a low temperature and has a small dielectric loss in the high-frequency band and a low temperature dependence of the resonant frequency
01/01/2008US7314780 Semiconductor package, method of production of same, and semiconductor device
01/01/2008US7314708 Electronically controlling the transport and attachment of specific binding entities to specific micro-locations in the synthesis of biopolymers such as DNA and polypeptides; producing a complement of a self-addressable electronic device addressed with specific DNA sequences
01/01/2008US7314388 Adapter, memory card, and memory card module
01/01/2008US7314268 Connection apparatus for circuit board, ink jet type recording apparatus using the same, IC chip and ink cartridge having IC chip
12/2007
12/27/2007WO2007150066A1 Fluidic self-assembly for system integration
12/27/2007WO2007149362A2 Solid state light sheet and bare die semiconductor circuits with series connected bare die circuit elements
12/27/2007WO2007148637A1 Composite material, substrate, and method for manufacturing composite material
12/27/2007WO2007147833A1 Screening element for electronic units
12/27/2007WO2007147593A1 Transponder comprising an electronic memory chip and magnetic circular antenna
12/27/2007US20070298663 Composite structural member having an integrated electrical circuit
12/27/2007US20070298161 Compound for forming wiring conductor, fabrication method of circuit board using the same and circuit board
12/27/2007US20070297161 Printed substrate, and electronic component having shield structure
12/27/2007US20070297157 Wiring board with built-in capacitor
12/27/2007US20070297156 Method, system and apparatus for power distribution for a semiconductor device
12/27/2007US20070297152 System Component of a Control Device
12/27/2007US20070297150 Control Box For Electrical Actuators,Especially For Adjustable Furniture
12/27/2007US20070296533 Magnetic Device
12/27/2007US20070296069 Semiconductor apparatus with decoupling capacitor
12/27/2007US20070295534 Wired circuit board
12/27/2007US20070295533 Buildup board, and electronic component and apparatus having the buildup board
12/27/2007US20070295532 Multilayer printed wiring board
12/27/2007US20070295531 Substrate Structure and Method for Manufacturing the Same
12/27/2007US20070295530 Coatings and methods for inhibiting tin whisker growth
12/27/2007US20070295444 Reel-type package of flexible printed circuit borads and method for supplying thereof
12/27/2007US20070294889 Electronic circuit module and method for its assembly
12/27/2007DE112005003014T5 Speichermodul Routing Memory module routing
12/27/2007DE10255520B4 Verfahren zur elektrischen Kontaktierung mittels gefüllter Flüssigkeiten und elektronische Bauteile mit derartiger Kontaktierung Method for making electrical contact means filled with liquids and electronic components such contact
12/27/2007DE10234364B4 Glas-Keramik-Verbundwerkstoff, dessen Verwendung als keramische Folie, Schichtverbund oder Mikrohybrid und Verfahren zu dessen Herstellung Glass-ceramic composite material, the use of a ceramic sheet, layer or composite micro-hybrid and process for its preparation
12/27/2007DE102007027378A1 Connection arrangement, has galvanically applied metallic layer extending between main surfaces and electrically connecting main surfaces, and spacer unit arranged in recess to space main surface from another main surface
12/27/2007DE102006028536A1 Verfahren zur Herstellung eines Schaltungsteils auf einem Substrat A method for producing a circuit member on a substrate
12/27/2007DE102006026816A1 Engine control unit for combustion engine particularly for supercharged diesel engine of vehicle, has contact points and memory chip which are partly protected by mechanical device and printed circuit board arranged inside housing
12/26/2007EP1871152A1 Wired circuit board
12/26/2007EP1869724A1 Circuitry module
12/26/2007EP1410489B1 Power converters
12/26/2007EP1281581B1 Electrical distribution box for vehicles having two networks with different voltage levels and vehicle with such an electrical distribution box
12/26/2007CN200997725Y Printing circuit board of camera moulded set
12/26/2007CN200997724Y Contact chip
12/26/2007CN200997723Y Improved structure of composite circuit base plate
12/26/2007CN200997722Y Intermediate buffering material structure during contact process
12/26/2007CN200997400Y Low-inductance gate-controlled transistor and power semiconductor assembly
12/26/2007CN200996570Y Luminescent rod with light-emitting diodes wafer
12/26/2007CN101095381A Printed circuit board for high-speed electrical connectors
12/26/2007CN101095380A Multi-layer printed circuit board comprising a through connection for high frequency applications
12/26/2007CN101095265A EMC connector assembly
12/26/2007CN101095044A A gas detecting arrangement
12/26/2007CN101094565A Method of manufacturing multilayer printed wiring board
12/26/2007CN101094561A Wired circuit board
12/26/2007CN101094560A PC board and its manufacturing method
12/26/2007CN101094559A Expansion small card free from plug wire, and personal computer device of using the card
12/26/2007CN101093622A Compression joint type elements and parts board, and method for connecting the board to experimental board
12/26/2007CN100358401C Printed wiring board and method for manufacturing same
12/26/2007CN100358398C Copper foil with extremely thin adhesive layer and method for producing the copper foil with extremely thin adhesive layer
12/26/2007CN100358138C Electronic assembly with vertically connected capacitors and manufacturing method
12/26/2007CN100358114C Method for forming penetrating electrode and chip with penerating electrode
12/26/2007CN100358101C Circuit device and manufacturing method thereof
12/26/2007CN100358054C Conductive paste and ceramic electronic component
12/26/2007CN100358053C Conductor component for electronic circuit
12/26/2007CN100357967C Electronic circuit comprising conductive bridges and method for making such bridges
12/26/2007CN100357496C Method of forming polymide coating containing dielectric filler on surface of metallic material process for producing copper clad laminate for formation of capacitor layer for printed wiring board and
12/26/2007CN100357338C Biaxially oriented polyester film and laminates thereof with copper
12/26/2007CN100357103C Ink-jet head
12/25/2007US7313331 Optical communication device, optical transmitter, optical transmitter-receiver, and optical transmission system
12/25/2007US7313001 Electrical switch having a mount for an electrical circuit
12/25/2007US7312999 High density drive chassis assembly
12/25/2007US7312845 Method of capturing and processing sensed images
12/25/2007US7312533 Electronic component with flexible contacting pads and method for producing the electronic component
12/25/2007US7312427 High-frequency dielectric heating device and printed board with thermistor
12/25/2007US7312405 Module structure having embedded chips
12/25/2007US7312404 Conductive contamination reliability solution for assembling substrates
12/25/2007US7312403 Circuit component mounting device
12/25/2007US7312402 Method and apparatus for providing improved loop inductance of decoupling capacitors
12/25/2007US7312401 Flexible printed wiring board
12/25/2007US7312400 Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method
12/25/2007US7312145 Electronic member, method for making the same, and semiconductor device
12/25/2007US7312103 Method for making an integrated circuit substrate having laser-embedded conductive patterns
12/25/2007US7311966 Porous insulating film and its laminates
12/25/2007US7311937 Method for forming a line pattern, line pattern, and electro-optic device