Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
08/2014
08/13/2014CN203775531U 一种感应磁环板基板 A magnetic substrate induction
08/13/2014CN203775530U 一种拼板 One kind of puzzle
08/13/2014CN203775529U 一种led铝基电路板 One kind of led aluminum board
08/13/2014CN203775528U 一种散热型铝银覆铜板 A heat sink aluminum silver CCL
08/13/2014CN203775527U 化学沉镍钯金表面处理印制pcb线路板 Chemical nickel and palladium surface treatment pcb printed circuit board
08/13/2014CN203775526U Pcb电容模块 Pcb capacitor module
08/13/2014CN203775525U 一种弯折式软电路板及具有该种软电路板的led条形灯 One kind of bending soft circuit boards and flexible circuit board having the same kind of led strip lights
08/13/2014CN203775524U 基于印刷电路板的开关电路结构 Based on the structure of the switching circuit of the printed circuit board
08/13/2014CN203775523U 电路板散热组件 Board cooling components
08/13/2014CN203775522U 加压浸渍型底部基板 Pressure impregnated bottom substrate
08/13/2014CN203775521U 移植式电路基板散热结构 Transplant-in circuit board thermal structure
08/13/2014CN203775520U Igbt在电路板上的散热结构 Igbt heat dissipation structure of the circuit board
08/13/2014CN203775519U 一种散热电路板 A heat sink board
08/13/2014CN203775518U 一种带通孔的pcb多层板 A tape vias multilayer pcb
08/13/2014CN203775517U 一种挠性电路板 A flexible circuit board
08/13/2014CN203775516U 一种带植入式散热铜块的pcb板 Pcb board with an implanted copper cooling block
08/13/2014CN203775515U 一种具有回流焊磁性治具的fpc Fpc having reflow magnetic fixture
08/13/2014CN203775514U 一种电子元件与背光灯公用元件槽 An electronic device with the backlight common component groove
08/13/2014CN203775513U 一种柔性电路板 A flexible circuit board
08/13/2014CN203775512U 高频信号线路以及包括该高频信号线路的电子设备 A high-frequency signal line and an electronic device including the high frequency signal line
08/13/2014CN203775511U 印刷电路板 A printed circuit board
08/13/2014CN203774510U 单片式表面安装伸缩弹片及具该弹片的表面安装组件 Monolithic surface mount retractable dome and with the shrapnel of surface mount components
08/13/2014CN103988589A 用于机动车的控制器 A controller for a motor vehicle
08/13/2014CN103987802A 粘接剂及电子零件的连接方法 Connections adhesive and electronic parts
08/13/2014CN103987801A 导电性粘接剂及电子零件的连接方法 Connections conductive adhesive and electronic components
08/13/2014CN103987753A 树脂组合物、预浸料和层叠板 The resin composition, prepreg and laminated plate
08/13/2014CN103987213A 制备形成有铜薄层的衬底的方法、制造印制电路板的方法及由此制造的印制电路板 The method for preparing a thin layer of copper is formed in a substrate, a method of manufacturing a printed circuit board and the printed circuit board thus manufactured
08/13/2014CN103987211A 一种基于增大铝基面的高效散热铝基板及其制作方法 Based on increasing efficient cooling aluminum plate aluminum surface and its production method
08/13/2014CN103987210A 一种pcb制作方法和pcb One kind of pcb production methods and pcb
08/13/2014CN103987208A 一种印刷线路板及其制作方法 A printed wiring board and manufacturing method thereof
08/13/2014CN103987207A 软硬复合线路板及其制造方法 Soft and hard composite board and its manufacturing method
08/13/2014CN103987202A 一种用于控制局部铜厚的pcb板制作方法及pcb板 A method for controlling the local copper thickness pcb board production methods, and pcb board
08/13/2014CN103987201A 前驱基板、软性印刷电路板及其制造方法 The precursor substrate, the flexible printed circuit board and its manufacturing method
08/13/2014CN103987197A Pcb板的加工方法及pcb板 Pcb board processing method, and pcb board
08/13/2014CN103987193A 一种压接连接器背面放贴片器件的方法 A method of connecting the patch on the back of the device is pressed against the discharge
08/13/2014CN103987192A 线路布置 Line layout
08/13/2014CN103987191A 一种减小ac耦合电容pad对高速串行信号传输影响的方法 A high-speed serial signal transmission is reduced impact ac coupling capacitor pad on way
08/13/2014CN103987190A 一种优化差分过孔阻抗的方法 An optimized differential via impedance method
08/13/2014CN103987189A 前驱基板、软性印刷电路板及其制造方法 The precursor substrate, the flexible printed circuit board and its manufacturing method
08/13/2014CN103987188A 软性电路板 Flexible circuit board
08/13/2014CN103987187A 一种嵌埋铜块pcb板及其制作方法 One kind of embedded copper block pcb board and its manufacturing method
08/13/2014CN103987186A 电路板、显示组件和空调 Circuit boards, display units and air conditioning
08/13/2014CN103987185A 多层式的软性印刷电路板及其制造方法 The flexible multi-layered printed circuit board and its manufacturing method
08/13/2014CN103987184A 电路板及制造方法和包括该电路板的照明模块和照明装置 The circuit board and the manufacturing method of the circuit board and includes a lighting module and a lighting device
08/13/2014CN103985522A 一种偏置磁芯以及应用所述磁芯的电路板 Biasing the core and applying the core circuit board
08/13/2014CN103985521A 一种双磁路磁芯以及应用所述磁芯的电路板 A dual magnetic circuit core and the application of the core circuit board
08/13/2014CN103985520A 一种新型磁芯以及应用所述磁芯的电路板 A novel application of the core and the core circuit board
08/13/2014CN103985519A 一种e型偏置磁芯以及应用所述磁芯的电路板 One kind of the core and the application of e-type bias circuit of the core board
08/13/2014CN103985518A 一种正方平面全封闭型磁芯以及应用所述磁芯的电路板 One kind of square planar cores and applying the totally enclosed core circuit board
08/13/2014CN103985517A 一种磁芯以及应用所述磁芯的电路板 One kind of the core and the application of the core circuit board
08/13/2014CN103985516A 一种平面型磁芯以及应用所述磁芯的电路板 A planar-type core and the application of the core circuit board
08/13/2014CN103985432A 一种pcb印刷电路板银浆及其制备方法 One kind of silver pcb printed circuit board and its preparation method
08/13/2014CN102838843B 一种增韧环氧树脂组合物及其应用 A toughened epoxy resin composition and its application
08/13/2014CN102595786B 一种具有内嵌电容的印制电路板及其制造方法 An embedded capacitance printed circuit board and its manufacturing method
08/13/2014CN102576585B 绝缘片、电路基板和绝缘片的制造方法 The method of manufacturing an insulating film, a circuit substrate and the insulating sheet
08/13/2014CN102558861B 无卤无磷高耐热热固性树脂组合物以及使用其制作的粘结片与覆铜箔层压板 Halogen-free phosphorus high heat thermosetting resin composition and the use of its production of the adhesive sheet and copper clad laminates
08/13/2014CN102480847B 线路板及其制造方法 Circuit board and its manufacturing method
08/13/2014CN102293069B 线路板及其制造方法 Circuit board and its manufacturing method
08/13/2014CN102264541B 带载体金属箔 A metal foil with carrier
08/13/2014CN102237354B 电路基板 Circuit board
08/13/2014CN102215631B 布线基板单元和包括布线基板单元的打印机 A wiring board including a printer unit and the wiring of the base unit
08/13/2014CN102171306B 各向异性导电粘结剂及使用该粘结剂的连接结构体的制备方法 And the anisotropic conductive adhesive prepared using the method of the connection structure of the binder
08/13/2014CN101438460B 电连接器 The electrical connector
08/13/2014CN101128088B 嵌入式波导印刷电路板结构 Embedded waveguide printed circuit board structure
08/12/2014US8804993 Audio port configuration for compact electronic devices
08/12/2014US8804371 Motherboard assembly having serial advanced technology attachment dual in-line memory module
08/12/2014US8804368 Downward-facing optical component module
08/12/2014US8804364 Footprint on PCB for leadframe-based packages
08/12/2014US8804363 Printed circuit boards with embedded components
08/12/2014US8804362 High-frequency module
08/12/2014US8804361 Wiring substrate
08/12/2014US8804356 Mounting apparatus for expansion card
08/12/2014US8804350 Control device for use in woven article
08/12/2014US8804349 Foldable display device
08/12/2014US8804348 Flexible printed circuit board and electronic device
08/12/2014US8804347 Reducing the border area of a device
08/12/2014US8804346 Injection molded control panel with in-molded decorated plastic film that includes an internal connector
08/12/2014US8804345 Integrated appliance
08/12/2014US8804343 Mounting apparatus for expansion card
08/12/2014US8804342 Communication modules having connectors on a leading end and systems including the same
08/12/2014US8804313 Enclosure power distribution architectures
08/12/2014US8803965 Arithmetically operating device, arithmetically operating method, arithmetically operating program, and microscope
08/12/2014US8803004 Complex adhesive boundaries for touch sensors
08/12/2014US8803003 Delta arrangement of hexagonal-close-packed signal pairs
08/12/2014US8803002 Electronic device preventing damage to circuit terminal portion and method of manufacturing the same
08/12/2014US8803001 Bonding area design for transient liquid phase bonding process
08/12/2014US8803000 Device for surface mounting and capacitor element
08/12/2014US8802999 Embedded printed circuit board and manufacturing method thereof
08/12/2014US8802998 Ceramic multilayer substrate and method for producing the same
08/12/2014US8802997 Multi layer circuit board and manufacturing method of the same
08/12/2014US8802996 Wiring board and mounting structure thereof
08/12/2014US8802995 Electronic component including multilayer substrate
08/12/2014US8802994 Printed circuit board and method of manufacturing the same
08/12/2014US8802776 Epoxy resin composition, method for producing composite unit using the epoxy resin composition, and composite unit
08/12/2014CA2667219C Silver-containing aqueous formulation and its use to produce electrically conductive or reflective coatings
08/07/2014WO2014121115A1 Removable conformal radio frequency shields
08/07/2014WO2014120640A1 Pcb having offset differential signal routing
08/07/2014WO2014120635A1 Printed circuit board having orthogonal signal routing
08/07/2014WO2014120611A1 Circuit board assembly
08/07/2014WO2014118783A1 Three-dimensional conductive patterns and inks for making same
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