Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
10/2014
10/07/2014US8853556 Transparent conductive film
10/07/2014US8853555 Bonding structure
10/07/2014US8853554 Touch module with photovoltaic conversion function
10/07/2014US8853553 Ball grid array (BGA) and printed circuit board (PCB) via pattern to reduce differential mode crosstalk between transmit and receive differential signal pairs
10/07/2014US8853552 Multilayer printed wiring board and method for manufacturing multilayer printed wiring board
10/07/2014US8853551 Wired circuit board and producing method thereof
10/07/2014US8853550 Circuit board including mask for controlling flow of solder
10/07/2014US8853549 Circuit substrate and method of manufacturing same
10/07/2014US8853548 Suspension substrate, suspension, head suspension, hard disk drive, and method for manufacturing suspension substrate
10/07/2014US8853547 Flexible printed board
10/07/2014US8853546 Printed circuit board and method of manufacturing the same
10/07/2014US8853545 Test card with a cuttable goldfinger structure
10/07/2014US8853544 Method of transferring thin film components and circuit board having the same
10/07/2014US8852999 System-in-a-package based flash memory card
10/07/2014US8852734 Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device
10/07/2014US8852728 Conductive film
10/07/2014US8852465 Electro-conductive paste for forming an electrode of a solar cell device, a solar cell device and method for producing the solar cell device
10/07/2014US8851930 Mini display port connector
10/07/2014US8851929 SFP functionality extender
10/07/2014US8851736 Light emitting module with heatsink plate having coupling protrusions
10/07/2014US8851733 Light signal transmitter and light receiver for an optical sensor
10/07/2014US8851621 Liquid ejecting head and liquid ejecting apparatus
10/07/2014US8851358 Method for aligning plate-like members and method for manufacturing electrical connecting apparatus
10/07/2014US8850701 Method for manufacturing multilayer printed circuit board having mounting cavity
10/07/2014US8850700 Wiring board and method for making the same
10/02/2014WO2014160551A1 Total internal reflection sub-assembly for fiber optic sub-assembly
10/02/2014WO2014160550A1 Fiber optic sub-assembly with low profile
10/02/2014WO2014160265A1 Electrical circuit board trace pattern to minimize capacitor cracking and improve reliability
10/02/2014WO2014159368A1 Ground and heat transfer interface on a printed circuit board
10/02/2014WO2014157766A1 Flexible printed circuit board with moveable part and fingerprint recognition device having same
10/02/2014WO2014157728A1 Copper foil with carrier, printed circuit board, copper clad laminated sheet, electronic device, and printed circuit board fabrication method
10/02/2014WO2014157581A1 Laminate and circuit board
10/02/2014WO2014157468A1 Laminate, laminated sheet, printed circuit board, and production method for laminate and laminated sheet
10/02/2014WO2014157446A1 Curable epoxy composition, film, multilayer film, prepreg, laminate, cured product, and composite body
10/02/2014WO2014157342A1 Wiring board and mounting structure using same
10/02/2014WO2014157303A1 Composition for forming conductive films and method for producing conductive film using same
10/02/2014WO2014157290A1 Wiring board
10/02/2014WO2014157281A1 Wiring board
10/02/2014WO2014157031A1 High-frequency transmission line and electronic device
10/02/2014WO2014156844A1 Thermoplastic resin film base for optical firing, conductive circuit board using same, and method for manufacturing said conductive circuit board
10/02/2014WO2014156621A1 Substrate for flexible printed wiring board and method for manufacturing same, and flexible printed wiring board using same
10/02/2014WO2014156594A1 Composition for forming conductive film, and conductive film manufacturing method using same
10/02/2014WO2014156457A1 Glass/ceramic composite material
10/02/2014WO2014156456A1 Glass/ceramic composite material
10/02/2014WO2014156422A1 Resin multi-layer substrate and electronic apparatus
10/02/2014WO2014156326A1 Composition for forming conductive film, and conductive film manufacturing method using same
10/02/2014WO2014156254A1 Soft magnetic thermosetting adhesive film, magnetic-film-laminated circuit board, and position detection device
10/02/2014WO2014155758A1 Glass-ceramic composite material
10/02/2014WO2014155347A1 Printed circuit board for a light emitting diode module
10/02/2014WO2014154581A1 Control module for an electric appliance
10/02/2014WO2014154572A1 Control module for an electric appliance
10/02/2014WO2014154567A1 Control module for an electric appliance
10/02/2014WO2014154139A1 Electronic component mounting structure, manufacturing method and electronic component product
10/02/2014WO2014154000A1 Packaging substrate and manufacturing method therefor, and substrate assembly
10/02/2014WO2014153999A1 Package substrate unit and preparation method therefor, and substrate assembly
10/02/2014WO2014153576A1 Placement method for circuit carrier and circuit carrier
10/02/2014US20140296362 New poly-amic acid, photo-sensitive resin composition, dry film, and circuit board
10/02/2014US20140295921 Flexible board and electronic device
10/02/2014US20140295189 Coverlay for high-frequency circuit substrate
10/02/2014US20140295159 Curable resin composition, film, prepreg, laminate, cured article, and composite article
10/02/2014US20140295148 Photosensitive resin composition
10/02/2014US20140293671 Configurable Width Memory Modules
10/02/2014US20140293566 Circuit board and electronic device
10/02/2014US20140293565 Electronic device, electronic apparatus, moving object, and method for manufacturing electronic device
10/02/2014US20140293564 Interposer and electronic component package
10/02/2014US20140293563 Microelectronic device attachment on a reverse microelectronic package
10/02/2014US20140293562 Fibrous laminate interface for security coatings
10/02/2014US20140293561 Wiring board, electronic component embedded substrate, method of manufacturing wiring board, and method of manufacturing electronic component embedded substrate
10/02/2014US20140293560 Substrate embedding electronic component and method of manufacturing substrate embedding electronic component
10/02/2014US20140293559 Wiring board
10/02/2014US20140293558 Lens mount with conductive glue pocket for grounding to a circuit board
10/02/2014US20140293554 Insulated metal substrate
10/02/2014US20140293547 Circuit substrate, semiconductor package and process for fabricating the same
10/02/2014US20140293148 Conductive film, method for making the same, and touch screen including the same
10/02/2014US20140293146 Conductive film, method for manufacturing the same, and touch screen including the same
10/02/2014US20140292599 Packaged Capacitor Component with Multiple Self-Resonance Frequencies
10/02/2014US20140291699 Ceramic/copper circuit board and semiconductor device
10/02/2014US20140291008 Electrode pattern and touchscreen using the same
10/02/2014US20140291007 Stacked electromagnetic bandgap structure
10/02/2014US20140291006 Printed circuit board solder mounting method and solder mount structure
10/02/2014US20140291005 Wiring board
10/02/2014US20140291004 Carrier Tape for Tab-Package and Manufacturing Method Thereof
10/02/2014US20140291003 Connecting Element for a Multi-Chip Module and Multi-Chip Module
10/02/2014US20140291002 Printed circuit board module
10/02/2014US20140291001 Method of making hybrid wiring board with built-in stiffener and interposer and hybrid wiring board manufactured thereby
10/02/2014US20140291000 Ceramic electronic component and wiring board having built-in ceramic electronic component
10/02/2014US20140290999 Multilayer ceramic capacitor, method of fabrication thereof and circuit board having electronic component mounted thereon
10/02/2014US20140290997 Multilayer wiring substrate and manufacturing method thereof
10/02/2014US20140290996 Epoxy resin compound and radiant heat circuit board using the same
10/02/2014US20140290995 Transparent conductive film and preparation method thereof
10/02/2014US20140290994 Surface-modified inorganic filler, method of preparing the same, buildup film composition for multilayer printed wiring board, and the multilayer printed wiring board including the same
10/02/2014US20140290993 Multilayer ceramic capacitor, manufacturing method thereof, and circuit board for mounting electronic component
10/02/2014US20140290992 Conductive film, method for manufacturing the same, and electronic device including the same
10/02/2014US20140290991 Gold finger and touch screen
10/02/2014US20140290990 Curable composition, cured coating film prepared from curable composition, and printed wiring board including the cured film
10/02/2014US20140290989 Structure of via hole of electrical circuit board and manufacturing method thereof
10/02/2014US20140290988 Patterned conductive polymer with dielectric patch
10/02/2014US20140290987 Solution processed nanoparticle-nanowire composite film as a transparent conductor for opto-electronic devices
10/02/2014US20140290986 Epoxy resin compound and radiant heat circuit board using the same
10/02/2014US20140290985 Embedded metal structures in ceramic substrates
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